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CY62146G30-45ZSXA
Infineon Technologies
IC SRAM 4MBIT PARALLEL 44TSOP II
1474 Pcs New Original In Stock
SRAM - Asynchronous Memory IC 4Mbit Parallel 45 ns 44-TSOP II
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CY62146G30-45ZSXA
Product Overview
6325312
DiGi Electronics Part Number
CY62146G30-45ZSXA-DGManufacturer
Infineon Technologies
CY62146G30-45ZSXA
Description
IC SRAM 4MBIT PARALLEL 44TSOP IIInventory
1474 Pcs New Original In Stock
SRAM - Asynchronous Memory IC 4Mbit Parallel 45 ns 44-TSOP II
Quantity
Minimum 1
Minimum 1
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CY62146G30-45ZSXA Technical Specifications
Category
Memory, Memory
Packaging
Tray
Series
MoBL®
Product Status
Active
DiGi-Electronics Programmable
Not Verified
Memory Type
Volatile
Memory Format
SRAM
Technology
SRAM - Asynchronous
Memory Size
4Mbit
Memory Organization
256K x 16
Memory Interface
Parallel
Write Cycle Time - Word, Page
45ns
Access Time
45 ns
Voltage - Supply
2.2V ~ 3.6V
Operating Temperature
-40°C ~ 85°C (TA)
Mounting Type
Surface Mount
Package / Case
44-TSOP (0.400", 10.16mm Width)
Supplier Device Package
44-TSOP II
Base Product Number
CY62146
Datasheet & Documents
HTML Datasheet
CY62146G30-45ZSXA-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
REACH Status
REACH Unaffected
ECCN
3A991B2A
HTSUS
8542.32.0041
Additional Information
Other Names
SP005645083
2015-CY62146G30-45ZSXA
2832-CY62146G30-45ZSXA
Standard Package
270
Reviews
5.0/5.0-(Show up to 5 Ratings)
de desembre 02, 2025
Ich bin begeistert von der Transparenz in der Preisgestaltung, das schafft Vertrauen beim Einkauf.
de desembre 02, 2025
Sehr empfehlenswert: Produkte hochwertig, Versand stets pünktlich.
de desembre 02, 2025
After-sales support helped resolve my concerns quickly.
de desembre 02, 2025
Their meticulous packaging safety measures ensure customer convenience and trust.
de desembre 02, 2025
Their after-sales support has been instrumental in helping me optimize the use of their products.
de desembre 02, 2025
Order was shipped immediately and arrived in perfect condition.
de desembre 02, 2025
Their prices make it possible for hobbyists like me to experiment with new tech.
de desembre 02, 2025
DiGi Electronics' reliability reduces downtime and increases productivity.
de desembre 02, 2025
Their shipping process is smooth, punctual, and reliable.
de desembre 02, 2025
Affordable and reliable—DiGi Electronics is my top choice.
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Frequently Asked Questions (FAQ)
What are the key design risks when replacing a legacy 5V SRAM like the IS61LV25616AL-10TLI with the CY62146G30-45ZSXA in a 3.3V system, and how can signal integrity be ensured during the transition?
The CY62146G30-45ZSXA operates at 2.2V–3.6V, making it incompatible with direct 5V interfacing. Replacing a 5V SRAM such as the IS61LV25616AL-10TLI requires careful level-shifting on address, data, and control lines to prevent damage and ensure reliable communication. Additionally, the input high-voltage threshold (VIH) of the CY62146G30-45ZSXA is only ~0.7 × VCC, so 5V logic may exceed absolute maximum ratings even if functionally interpreted as high. Use bidirectional voltage translators (e.g., TXB0108) on data buses and unidirectional shifters (e.g., SN74LVC8T245) for control signals. Also verify that the 45 ns access time meets your system’s timing budget under worst-case 2.2V operation, as delay increases near the lower voltage rail.
Can the CY62146G30-45ZSXA be safely used in an industrial motor control application with frequent power cycling between 2.5V and 3.3V, and what reliability concerns should be addressed?
Yes, the CY62146G30-45ZSXA supports operation from 2.2V to 3.6V and is rated for -40°C to +85°C, making it suitable for industrial environments like motor control. However, frequent power cycling introduces risks of partial writes or corrupted states if the supply drops below 2.2V during operation. Implement a power-on reset (POR) circuit or supervisor IC (e.g., TPS3823) to hold the system in reset until VCC stabilizes above 2.2V. Also ensure decoupling capacitors (100nF ceramic + 10µF bulk) are placed close to the VCC pin to mitigate voltage droop during transient loads. Note that data retention is not guaranteed below 2.2V—avoid relying on memory content during brownout conditions.
How does the CY62146G30-45ZSXA compare to the Microchip 23LC1024 in terms of integration complexity and real-time performance for a battery-powered data logging system?
The CY62146G30-45ZSXA offers parallel interface with 45 ns access time, enabling faster random access and deterministic timing critical for real-time logging, whereas the Microchip 23LC1024 uses SPI with significantly higher effective latency due to serial overhead. However, the CY62146G30-45ZSXA consumes more dynamic power and requires 23 additional GPIO pins versus just 4 for the 23LC1024. For battery-powered systems where pin count and sleep current matter, evaluate whether the speed gain justifies the resource cost. If your MCU has spare parallel bus capability (e.g., external memory interface), the CY62146G30-45ZSXA provides superior throughput; otherwise, the SPI-based 23LC1024 may be more efficient despite slower access.
What PCB layout considerations are critical when designing with the CY62146G30-45ZSXA in a high-noise automotive environment, and how does its MSL-3 rating affect assembly?
In automotive applications, minimize loop areas by routing address, data, and control traces as tightly coupled groups with ground reference planes beneath. Keep trace lengths matched (±100 mil) to reduce skew, especially for the /CE, /OE, and /WE control signals. Use series termination resistors (22–33Ω) near the driver to dampen reflections on longer traces. The CY62146G30-45ZSXA has an MSL-3 rating, meaning it can be exposed to ambient conditions for up to 168 hours after dry packaging is opened before reflow. Beyond that, baking per J-STD-033 is required to prevent moisture-induced delamination or ‘popcorning’ during soldering. Always store unused trays in a dry cabinet (<10% RH) and track floor life rigorously in production.
Is it safe to parallel two CY62146G30-45ZSXA devices to create a 256K x 32 memory bank, and what timing or contention issues must be managed?
Yes, two CY62146G30-45ZSXA chips can be combined for a 256K x 32 configuration by sharing address, /CE, /OE, and /WE lines while splitting the data bus (D0–D15 on one, D16–D31 on the other). However, ensure both devices are sourced from the same lot to minimize access time variation, as mismatched propagation delays can cause data skew at high clock rates. Also verify that the driving MCU or FPGA can source/sink enough current for double the capacitive load on shared control lines—consider adding buffer ICs (e.g., 74LVC244) if rise/fall times degrade. Never enable both outputs simultaneously during read cycles; use a single /OE signal to avoid bus contention. This configuration maintains the 45 ns access time but doubles standby current, impacting battery life in portable designs.
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CY62146G30-45ZSXA CAD Models
Infineon Technologies CY62146G30-45ZSXA PCB symbols & footprints
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