CY7C1041D-10ZSXI >
CY7C1041D-10ZSXI
Infineon Technologies
IC SRAM 4MBIT PARALLEL 44TSOP II
2235 Pcs New Original In Stock
SRAM - Asynchronous Memory IC 4Mbit Parallel 10 ns 44-TSOP II
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CY7C1041D-10ZSXI Infineon Technologies
5.0 / 5.0 - (409 Ratings)

CY7C1041D-10ZSXI

Product Overview

6325317

DiGi Electronics Part Number

CY7C1041D-10ZSXI-DG
CY7C1041D-10ZSXI

Description

IC SRAM 4MBIT PARALLEL 44TSOP II

Inventory

2235 Pcs New Original In Stock
SRAM - Asynchronous Memory IC 4Mbit Parallel 10 ns 44-TSOP II
Memory
Quantity
Minimum 1

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In Stock (All prices are in USD)
  • QTY Target Price Total Price
  • 1 20.0200 20.0200
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CY7C1041D-10ZSXI Technical Specifications

Category Memory, Memory

Manufacturer Infineon Technologies

Packaging -

Series -

Product Status Obsolete

DiGi-Electronics Programmable Not Verified

Memory Type Volatile

Memory Format SRAM

Technology SRAM - Asynchronous

Memory Size 4Mbit

Memory Organization 256K x 16

Memory Interface Parallel

Write Cycle Time - Word, Page 10ns

Access Time 10 ns

Voltage - Supply 4.5V ~ 5.5V

Operating Temperature -40°C ~ 85°C (TA)

Mounting Type Surface Mount

Package / Case 44-TSOP (0.400", 10.16mm Width)

Supplier Device Package 44-TSOP II

Base Product Number CY7C1041

Datasheet & Documents

HTML Datasheet

CY7C1041D-10ZSXI-DG

Environmental & Export Classification

RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991B2A
HTSUS 8542.32.0041

Additional Information

Other Names
428-1923-DG
CY7C1041D10ZSXI
448-CY7C1041D-10ZSXI
-CY7C1041D
CY7C1041D-10ZSXI-DG
428-1923
2015-CY7C1041D-10ZSXI
Standard Package
270

Alternative Parts

View Details
PART NUMBER
MANUFACTURER
QUANTITY AVAILABLE
DiGi PART NUMBER
UNIT PRICE
SUBSTITUTE TYPE
IS61C25616AL-10TLI
ISSI, Integrated Silicon Solution Inc
2475
IS61C25616AL-10TLI-DG
0.1096
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Reviews

5.0/5.0-(Show up to 5 Ratings)
RoseE***antée
de desembre 02, 2025
5.0
Leur rapidité et diversité contribuent à rendre nos projets éducatifs plus faciles à réaliser.
Mystè***nfini
de desembre 02, 2025
5.0
Les tarifs chez DiGi Electronics sont très compétitifs, je recommande fortement.
キキ***夢見
de desembre 02, 2025
5.0
配送の速さと信頼性により、こちらの会社を選び続けています。
Brigh***rizons
de desembre 02, 2025
5.0
Shopping on their website always feels safe and straightforward.
Peacefu***xieDust
de desembre 02, 2025
5.0
Their competitive prices and rapid delivery are highly impressive.
Creati***anderer
de desembre 02, 2025
5.0
Their after-sales team offers personalized advice that helps us maximize the use of their products.
Cheer***Vibes
de desembre 02, 2025
5.0
On-time delivery is a core strength of DiGi Electronics.
Golde***rizon
de desembre 02, 2025
5.0
The clarity of their pricing details made the buying process very comfortable.
Bliss***Breeze
de desembre 02, 2025
5.0
Exceptional support that helps us stay ahead in our industry.
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Frequently Asked Questions (FAQ)

Can the CY7C1041D-10ZSXI be used as a drop-in replacement for IS61C25616AL-10TLI in an existing high-speed SRAM design, and what pinout or timing differences should I watch for?

While the CY7C1041D-10ZSXI and IS61C25616AL-10TLI share similar 256K x 16 organization and 10 ns access time, they are not guaranteed to be pin-compatible due to differences in control signal assignments and manufacturer-specific timing characteristics. Before substituting, verify signal mapping—especially OE#, WE#, and CE#—and review setup/hold times under worst-case conditions. The CY7C1041D-10ZSXI has tighter data valid windows, so ensure your controller can meet timing margins. Always simulate or prototype the replacement to avoid intermittent read/write failures in production.

Is it safe to use the CY7C1041D-10ZSXI in a new design given its obsolete status, and what are the long-term supply and reliability risks?

Using the CY7C1041D-10ZSXI in a new design carries significant long-term risk due to its obsolete status. While current stock (2200 pcs) may support short production runs, future availability from authorized sources is uncertain, increasing exposure to counterfeit parts. For designs with a lifecycle beyond 2–3 years, consider redesigning with active-pin-compatible alternatives like the ISSI IS61C25616AL-10TLI with careful timing validation. If you proceed, buy enough lifetime stock with certified traceability and monitor end-of-life notices from Infineon.

How does the 10 ns access time of the CY7C1041D-10ZSXI perform at the upper end of its operating temperature range, and should I derate the timing in industrial applications?

The CY7C1041D-10ZSXI is specified for 10 ns access time across the full industrial temperature range (-40°C to 85°C), but real-world PCB parasitics and signal integrity degrade faster at temperature extremes. At 85°C, CMOS propagation delays increase and noise margins shrink, risking setup/hold violations at maximum clock rates. To maintain reliability, margin timing by 15–20% in timing-critical applications, especially when driving multiple loads or over longer traces. Use controlled impedance routing and minimize stubs to preserve signal quality near the 10 ns limit.

What are the key PCB layout considerations when integrating the CY7C1041D-10ZSXI in a high-speed parallel memory interface to avoid data corruption?

When laying out the CY7C1041D-10ZSXI, treat all address, data, and control lines as high-speed signals due to its 10 ns cycle time. Use controlled impedance traces (typically 50–60 Ω), minimize trace length mismatches to under 500 mils to prevent skew, and route address and control lines short and direct. Place 0.1 µF ceramic decoupling capacitors at each VCC pin and connect directly to ground plane vias. Avoid routing noisy signals (clocks, switching supplies) underneath the 44-TSOP II package to prevent coupling into the die. These steps reduce ringback, crosstalk, and data bus contention risks.

What is the impact of MSL 3 rating on CY7C1041D-10ZSXI handling, and what reflow profile precautions are needed to prevent 'popcorning' during assembly?

The CY7C1041D-10ZSXI has an MSL 3 rating (168-hour floor life), meaning it must be stored in dry packs and used within one week after opening if humidity exceeds 30% RH. Before reflow, bake the device at 125°C for 24 hours if exposed beyond its floor life to remove absorbed moisture. Use a JEDEC-standard reflow profile with a maximum peak temperature of 260°C and proper ramp-up rates to prevent 'popcorning'—internal delamination from steam pressure. Ignoring MSL guidelines risks latent defects and early field failures, especially in harsh environments.

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