VS-25TTS12PBF >
VS-25TTS12PBF
Vishay General Semiconductor - Diodes Division
SCR 1.2KV 25A TO220AB
210991 Pcs New Original In Stock
SCR 1.2 kV 25 A Standard Recovery Through Hole TO-220-3
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VS-25TTS12PBF Vishay General Semiconductor - Diodes Division
5.0 / 5.0 - (451 Ratings)

VS-25TTS12PBF

Product Overview

1134364

DiGi Electronics Part Number

VS-25TTS12PBF-DG
VS-25TTS12PBF

Description

SCR 1.2KV 25A TO220AB

Inventory

210991 Pcs New Original In Stock
SCR 1.2 kV 25 A Standard Recovery Through Hole TO-220-3
SCRs
Quantity
Minimum 1

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In Stock (All prices are in USD)
  • QTY Target Price Total Price
  • 1 0.7916 0.7916
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VS-25TTS12PBF Technical Specifications

Category Thyristors, SCRs

Packaging -

Series -

Product Status Discontinued at Digi-Key

Voltage - Off State 1.2 kV

Voltage - Gate Trigger (Vgt) (Max) 2 V

Current - Gate Trigger (Igt) (Max) 45 mA

Voltage - On State (Vtm) (Max) 1.25 V

Current - On State (It (AV)) (Max) 16 A

Current - On State (It (RMS)) (Max) 25 A

Current - Hold (Ih) (Max) 100 mA

Current - Off State (Max) 500 µA

Current - Non Rep. Surge 50, 60Hz (Itsm) 350A @ 50Hz

SCR Type Standard Recovery

Operating Temperature -40°C ~ 125°C

Mounting Type Through Hole

Package / Case TO-220-3

Supplier Device Package TO-220-3

Base Product Number 25TTS12

Datasheet & Documents

HTML Datasheet

VS-25TTS12PBF-DG

Environmental & Export Classification

RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8541.30.0080

Additional Information

Other Names
25TTS12PBF-DG
25TTS12PBF
Standard Package
50

Alternative Parts

View Details
PART NUMBER
MANUFACTURER
QUANTITY AVAILABLE
DiGi PART NUMBER
UNIT PRICE
SUBSTITUTE TYPE
TYN1225RG
STMicroelectronics
17621
TYN1225RG-DG
0.0147
MFR Recommended
VS-25TTS12-M3
Vishay General Semiconductor - Diodes Division
5922
VS-25TTS12-M3-DG
0.0079
Direct
CLA30E1200PB
IXYS
2124
CLA30E1200PB-DG
1.5225
MFR Recommended

Reviews

5.0/5.0-(Show up to 5 Ratings)
달***억
de desembre 02, 2025
5.0
DiGi Electronics는 항상 품질이 일정하며, 배송도 약속된 시간에 딱 맞춰 옵니다.
알***풍경
de desembre 02, 2025
5.0
디지 일렉트로닉스 제품은 다양성이 뛰어나서 언제나 만족스럽습니다.
Nat***Nest
de desembre 02, 2025
5.0
The staff handled all my issues with professionalism and care.
Star***hway
de desembre 02, 2025
5.0
They provide excellent customer support, adding value to a cost-effective shopping experience.
Morn***Glow
de desembre 02, 2025
5.0
The packaging materials are sturdy and well-designed, preventing any damage.
Brig***oyage
de desembre 02, 2025
5.0
They review and address customer feedback diligently, which shows their commitment to quality.
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Frequently Asked Questions (FAQ)

Can the VS-25TTS12PBF reliably replace the TYN1225RG in a 1200V AC motor control circuit without redesigning the gate drive?

Yes, the VS-25TTS12PBF can replace the TYN1225RG in 1200V motor control applications, but verify gate sensitivity compatibility. The VS-25TTS12PBF has a maximum gate trigger current (Igt) of 45 mA, similar to the TYN1225RG, but often exhibits lower variability in turn-on behavior due to tighter manufacturing controls. However, ensure your gate driver can source at least 50 mA to account for temperature derating and ensure reliable triggering at -40°C. Also confirm that the snubber circuit is adequate, as the VS-25TTS12PBF’s standard recovery characteristic may produce higher dV/dt stress than faster alternatives.

How does the VS-25TTS12PBF perform in high-temperature industrial environments when conducting near its 16A average current limit?

The VS-25TTS12PBF is rated for up to 125°C operating temperature, but sustained 16A average current (It(AV)) requires aggressive heatsinking due to thermal resistance of the TO-220AB package. At ambient temperatures above 70°C, derate current by at least 10-15% unless a low-thermal-resistance heatsink (≤1.5°C/W) is used. Monitor junction temperature with thermal interface materials and ensure pcb layout supports heat dissipation through wide copper pours. Thermal runaway risk increases if the hold current (Ih ≤ 100 mA) is approached under unstable load conditions.

Is the VS-25TTS12PBF suitable for inductive load switching in power tools, and what are the key failure risks to mitigate?

The VS-25TTS12PBF is viable for inductive load switching in power tools but requires proper protection due to its standard recovery characteristic. The 350A non-repetitive surge rating supports high inrush currents, yet the relatively slow turn-off can cause cross-conduction in H-bridge configurations if commutation timing isn’t precisely controlled. Use an RC snubber network across the device to suppress voltage transients from inductive kickback, and ensure the gate drive turns off cleanly to avoid unintended re-triggering. Poor PCB layout or shared gate return paths can lead to false triggering under high di/dt loads.

What are the critical design-in considerations when substituting the discontinued VS-25TTS12PBF with the CLA30E1200PB in existing products?

When replacing the VS-25TTS12PBF with the CLA30E1200PB, evaluate three key differences: higher current rating (30A vs 25A RMS), gate trigger sensitivity (50 mA max vs 45 mA), and package footprint compatibility. While both are TO-220-3, verify pinout alignment and thermal mounting compatibility. The CLA30E1200PB may require adjusting gate drive timing due to potentially higher Igt; validate operation at low temperatures where trigger thresholds rise. Also confirm that existing overcurrent protection (e.g., fusing) is rated for the new device’s surge capability to maintain system safety and reliability.

How can I ensure long-term reliability of the VS-25TTS12PBF in surge-heavy power distribution systems?

To ensure long-term reliability of the VS-25TTS12PBF in surge-prone environments, implement multi-stage protection. The device handles 350A non-repetitive surge, but repeated exposure near this limit degrades lifespan. Pair it with upstream transient voltage suppression (TVS) diodes or MOVs to absorb line surges above 1 kV. Ensure gate circuit stability with a series resistor (220–470 Ω) to prevent noise-induced triggering during fast transients. Regular thermal cycling and periodic maintenance checks for solder joint integrity are advised, especially in applications with frequent on/off cycling, such as backup power switching.

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