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OMAPL138EZWTD4E
Texas Instruments
IC MPU OMAP-L1X 456MHZ 361NFBGA
1683 Pcs New Original In Stock
ARM926EJ-S Microprocessor IC OMAP-L1x 1 Core, 32-Bit 456MHz 361-NFBGA (16x16)
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*Quantity
Minimum 1
Minimum 1
5.0 / 5.0
- (413 Ratings)
OMAPL138EZWTD4E
Product Overview
1361867
DiGi Electronics Part Number
OMAPL138EZWTD4E-DGManufacturer
Texas Instruments
OMAPL138EZWTD4E
Description
IC MPU OMAP-L1X 456MHZ 361NFBGAInventory
1683 Pcs New Original In Stock
ARM926EJ-S Microprocessor IC OMAP-L1x 1 Core, 32-Bit 456MHz 361-NFBGA (16x16)
Quantity
Minimum 1
Minimum 1
Purchase and inquiry
Warranty & Returns
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365 - Day Quality Guarantee - Every part fully backed.
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OMAPL138EZWTD4E Technical Specifications
Category
Embedded, Microprocessors
Packaging
Tray
Series
OMAP-L1x
Product Status
Active
Core Processor
ARM926EJ-S
Number of Cores/Bus Width
1 Core, 32-Bit
Speed
456MHz
Co-Processors/DSP
Signal Processing; C674x, System Control; CP15
RAM Controllers
SDRAM
Graphics Acceleration
No
Display & Interface Controllers
LCD
Ethernet
10/100Mbps (1)
SATA
SATA 3Gbps (1)
USB
USB 1.1 + PHY (1), USB 2.0 + PHY (1)
Voltage - I/O
1.8V, 3.3V
Operating Temperature
-40°C ~ 90°C (TJ)
Security Features
Boot Security, Cryptography
Mounting Type
Surface Mount
Package / Case
361-LFBGA
Supplier Device Package
361-NFBGA (16x16)
Additional Interfaces
HPI, I2C, McASP, McBSP, MMC/SD, SPI, UART
Base Product Number
OMAPL138
Datasheet & Documents
Manuals
OMAPL138 Tech Ref Manual
Manufacturer Product Page
OMAPL138EZWTD4E Specifications
HTML Datasheet
OMAPL138EZWTD4E-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
REACH Status
REACH Unaffected
ECCN
3A991A2
HTSUS
8542.31.0001
Additional Information
Other Names
OMAPL138EZWTD4E-CRL
OMAPL138EZWTD4E-DG
296-42794
Q13590617
-296-42794-DG
2156-OMAPL138EZWTD4E
TEXTISOMAPL138EZWTD4E
Standard Package
90
Alternative Parts
PART NUMBER
MANUFACTURER
QUANTITY AVAILABLE
DiGi PART NUMBER
UNIT PRICE
SUBSTITUTE TYPE
Reviews
5.0/5.0-(Show up to 5 Ratings)
de desembre 02, 2025
항상 필요한 부품들을 빠르게 구할 수 있어 작업이 원활하게 진행됩니다.
de desembre 02, 2025
수리와 애프터서비스 요청에 대한 대응이 매우 신속하고 친절했어요.
de desembre 02, 2025
Tolle Preise und professioneller Support – hier fühlt man sich gut aufgehoben.
de desembre 02, 2025
価格透明性のおかげで、予算の管理が楽になりました。
de desembre 02, 2025
I feel confident knowing that their customer service is both efficient and highly knowledgeable.
de desembre 02, 2025
The versatility of their inventory means I often find what I need in one place, saving time.
de desembre 02, 2025
Di Digi Electronics’ commitment to transparency and quick delivery enhances customer loyalty.
de desembre 02, 2025
The rapid dispatch process means I get my parts faster than other suppliers, and they stand up well under prolonged use.
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Frequently Asked Questions (FAQ)
Can I replace the OMAPL138EZWTD4E with a Sitara AM335x processor in an existing industrial control design without major firmware changes?
Replacing the OMAPL138EZWTD4E with a Sitara AM335x (e.g., AM3358BZCE) is not a drop-in upgrade due to fundamental architectural differences: the OMAPL138 uses an ARM926EJ-S core with a C674x DSP, while the AM335x uses a Cortex-A8 without a dedicated DSP. This means signal processing routines running on the C674x co-processor in your current OMAPL138EZWTD4E firmware will require significant re-architecture or offloading to software, increasing CPU load. Additionally, pinout, power sequencing, and peripheral register maps differ substantially. A full hardware and software validation cycle is required—consider this a redesign, not a replacement, unless you're prepared to recompile and retest all DSP-dependent code paths.
What are the critical layout and thermal risks when designing a high-density PCB with the OMAPL138EZWTD4E in a 361-NFBGA package?
The OMAPL138EZWTD4E’s 361-NFBGA (16x16 mm) package demands strict PCB design practices to avoid signal integrity and thermal issues. Due to its fine pitch (0.8 mm ball spacing), you must use at least 6-layer stackup with controlled impedance routing for high-speed interfaces like SATA and DDR. Poor via-in-pad or inadequate ground plane stitching can cause EMI and timing failures. Thermally, the -40°C to 90°C junction range assumes proper heat dissipation—without a thermal pad connection or copper pour under the package, localized hot spots can trigger throttling or long-term reliability degradation. Always follow TI’s layout guidelines and perform thermal simulation early; passive cooling may suffice, but airflow or a small heatsink is recommended in enclosed industrial environments.
How does the OMAPL138EZWTD4E compare to the NXP LPC3250 for low-power audio processing applications requiring real-time DSP performance?
While both the OMAPL138EZWTD4E and NXP LPC3250 use ARM9 cores, the OMAPL138EZWTD4E holds a decisive advantage in real-time audio processing due to its integrated C674x DSP co-processor, which offloads computationally intensive tasks like FFT, filtering, or codec execution—something the LPC3250 must handle entirely on its ARM926EJ-S core. This makes the OMAPL138EZWTD4E more efficient and deterministic for applications such as industrial audio analytics or VoIP gateways. However, the LPC3250 may offer lower static power consumption in sleep modes. If your application requires tight real-time DSP response and moderate power budget (not ultra-low-power), the OMAPL138EZWTD4E is the superior choice despite its higher complexity.
Is the OMAPL138EZWTD4E suitable for functional safety-critical systems, and what limitations should I consider for ISO 13849 or IEC 61508 compliance?
The OMAPL138EZWTD4E is not certified for functional safety standards like IEC 61508 or ISO 13849 and lacks built-in hardware safety mechanisms such as lockstep cores, ECC on critical memories, or diagnostic peripherals. While you can use it in safety-related systems with external monitoring (e.g., watchdog timers, redundant logic), achieving SIL or PL ratings will require extensive system-level mitigations and validation. TI does not provide a safety manual or FMEDA for this device, increasing certification effort. For new safety-critical designs, consider safer alternatives like TI’s Hercules RM series; the OMAPL138EZWTD4E should only be used in non-certified or architecturally mitigated safety contexts where risk assessment permits.
What are the long-term supply and obsolescence risks of using the OMAPL138EZWTD4E in a 10-year industrial product lifecycle?
Although the OMAPL138EZWTD4E is currently listed as 'Active' by Texas Instruments, it belongs to the older OMAP-L1x generation, which has seen declining design-in activity in favor of newer Sitara processors. This increases long-term supply risk—especially given its tray packaging and MSL 3 rating, which limits shelf life to 168 hours after baking if exposed to ambient conditions. For a 10-year lifecycle, secure last-time buy commitments early and consider lifecycle-matched alternatives like the AM62x series for future-proofing. Additionally, ensure your contract manufacturer can handle NFBGA rework and has access to qualified assembly processes, as fewer vendors support this package type compared to more modern QFNs or BGA variants.
Quality Assurance (QC)
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