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OMAPL138EZCEA3
Texas Instruments
IC MPU OMAP-L1X 375MHZ 361NFBGA
2097 Pcs New Original In Stock
ARM926EJ-S Microprocessor IC OMAP-L1x 1 Core, 32-Bit 375MHz 361-NFBGA (13x13)
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5.0 / 5.0
- (407 Ratings)
OMAPL138EZCEA3
Product Overview
1360259
DiGi Electronics Part Number
OMAPL138EZCEA3-DGManufacturer
Texas Instruments
OMAPL138EZCEA3
Description
IC MPU OMAP-L1X 375MHZ 361NFBGAInventory
2097 Pcs New Original In Stock
ARM926EJ-S Microprocessor IC OMAP-L1x 1 Core, 32-Bit 375MHz 361-NFBGA (13x13)
Quantity
Minimum 1
Minimum 1
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OMAPL138EZCEA3 Technical Specifications
Category
Embedded, Microprocessors
Packaging
-
Series
OMAP-L1x
Product Status
Active
Core Processor
ARM926EJ-S
Number of Cores/Bus Width
1 Core, 32-Bit
Speed
375MHz
Co-Processors/DSP
Signal Processing; C674x, System Control; CP15
RAM Controllers
SDRAM
Graphics Acceleration
No
Display & Interface Controllers
LCD
Ethernet
10/100Mbps (1)
SATA
SATA 3Gbps (1)
USB
USB 1.1 + PHY (1), USB 2.0 + PHY (1)
Voltage - I/O
1.8V, 3.3V
Operating Temperature
-40°C ~ 105°C (TJ)
Security Features
Boot Security, Cryptography
Mounting Type
Surface Mount
Package / Case
361-LFBGA
Supplier Device Package
361-NFBGA (13x13)
Additional Interfaces
HPI, I2C, McASP, McBSP, MMC/SD, SPI, UART
Base Product Number
OMAPL138
Datasheet & Documents
Manuals
OMAPL138 Tech Ref Manual
Manufacturer Product Page
OMAPL138EZCEA3 Specifications
HTML Datasheet
OMAPL138EZCEA3-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
REACH Status
REACH Unaffected
ECCN
3A991A2
HTSUS
8542.31.0001
Additional Information
Other Names
296-42788
OMAPL138EZCEA3-DG
-296-42788-DG
Standard Package
160
Alternative Parts
PART NUMBER
MANUFACTURER
QUANTITY AVAILABLE
DiGi PART NUMBER
UNIT PRICE
SUBSTITUTE TYPE
Reviews
5.0/5.0-(Show up to 5 Ratings)
de desembre 02, 2025
每次購買都能享受到快速的運送服務，真的很方便，也很滿意！
de desembre 02, 2025
我真的很感謝他們的售後支援，每次都提供迅速而貼心的幫助，讓我感受到他們的誠意。
de desembre 02, 2025
Ich schätze die prompte und freundliche Unterstützung, die ich nach meiner Bestellung erhalten habe.
de desembre 02, 2025
Received my order within a record time, and the package was intact thanks to careful packing.
de desembre 02, 2025
Speedy delivery and high-quality products make shopping here a joy.
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Frequently Asked Questions (FAQ)
What are the key thermal design considerations when integrating the OMAPL138EZCEA3 in an industrial application operating at 105°C junction temperature?
When designing with the OMAPL138EZCEA3 for high-temperature environments up to 105°C TJ, thermal management is critical due to power dissipation from both the ARM926EJ-S core and C674x DSP. To mitigate thermal risks, ensure a proper PCB layout with adequate copper pour and thermal vias under the exposed pad (361-NFBGA) to conduct heat to inner or backside layers. Use a thermal simulation to validate heatsinking or airflow assumptions, especially when operating near maximum junction temperature. Additionally, consider dynamic voltage and frequency scaling techniques to limit sustained power draw under heavy processing loads, ensuring long-term reliability in harsh conditions.
Can the OMAPL138EZCEA3 replace the ADSP-BF561 in a dual-core DSP system, and what are the integration trade-offs?
The OMAPL138EZCEA3 can serve as a partial functional replacement for the ADSP-BF561 in dual-core DSP applications, but with architectural trade-offs. While the ADSP-BF561 offers two dedicated DSP cores ideal for symmetric multiprocessing, the OMAPL138EZCEA3 combines a single ARM9 + C674x DSP, better suited for asymmetric workloads where control and signal processing are separated. Replacing BF561-based designs requires rearchitecting task allocation and inter-core communication via shared memory or mailbox logic. Ensure real-time latency requirements are revalidated, as the OMAPL138EZCEA3's system control coprocessor (CP15) and memory hierarchy differ significantly from Blackfin architectures.
How does I/O voltage mismatch affect interfacing 3.3V peripherals with the OMAPL138EZCEA3 in mixed-signal embedded systems?
The OMAPL138EZCEA3 supports dual I/O voltages (1.8V and 3.3V), which allows safe interfacing with legacy 3.3V analog and digital peripherals such as ADCs, DACs, or motor drivers—common in industrial control systems. However, incorrect bank assignment can lead to interface failure or device damage. Ensure 3.3V-tolerant pins (e.g., GPIO, UART, SPI) are configured in the appropriate VIO domain and verify signal integrity through termination and trace length matching. Use level translators for any signal routed to 1.8V-only components, and confirm power sequencing aligns with recommended startup order to avoid latch-up or leakage.
What are the risks of using the OMAPL138EZCEA3 in a new design versus opting for a newer Sitara processor like AM3352?
Using the OMAPL138EZCEA3 in new designs poses long-term supply and scalability risks compared to newer Sitara AM3352 processors, even though the OMAPL138EZCEA3 remains active and well-suited for low-power, dual-core (ARM+DSP) applications. The AM3352 offers higher clock speeds, enhanced peripherals (like CAN, enhanced Ethernet), better power efficiency, and longer roadmap support. Designers should assess future production volume and software lifecycle needs—OMAPL138EZCEA3 may limit OS support and third-party tooling over time. If real-time DSP processing with moderate ARM performance is critical and legacy code exists, the OMAPL138EZCEA3 remains viable, but consider obsolescence planning.
How can boot security features of the OMAPL138EZCEA3 be leveraged to protect firmware in a connected industrial gateway?
The OMAPL138EZCEA3 includes boot security and cryptography features that can be configured to establish a hardware-rooted chain of trust during startup, mitigating risks of unauthorized firmware execution in industrial gateways. To implement secure boot, fuse boot configuration settings to enforce authenticated ROM boot loader (RBL) execution and use HMAC or AES-128 to validate the next-stage bootloader and OS image. Additionally, isolate secure key storage and restrict access through system control coprocessor (CP15) configurations. Pair with external secure elements if key provisioning and lifecycle management require higher assurance beyond on-chip capabilities.
Quality Assurance (QC)
DiGi ensures the quality and authenticity of every electronic component through professional inspections and batch sampling, guaranteeing reliable sourcing, stable performance, and compliance with technical specifications, helping customers reduce supply chain risks and confidently use components in production.
OMAPL138EZCEA3 CAD Models
Texas Instruments OMAPL138EZCEA3 PCB symbols & footprints
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