MSP430G2332IPW14R >
MSP430G2332IPW14R
Texas Instruments
IC MCU 16BIT 4KB FLASH 14TSSOP
55146 Pcs New Original In Stock
MSP430 CPU16 MSP430G2xx Microcontroller IC 16-Bit 16MHz 4KB (4K x 8) FLASH 14-TSSOP
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MSP430G2332IPW14R Texas Instruments
5.0 / 5.0 - (213 Ratings)

MSP430G2332IPW14R

Product Overview

1354514

DiGi Electronics Part Number

MSP430G2332IPW14R-DG

Manufacturer

Texas Instruments
MSP430G2332IPW14R

Description

IC MCU 16BIT 4KB FLASH 14TSSOP

Inventory

55146 Pcs New Original In Stock
MSP430 CPU16 MSP430G2xx Microcontroller IC 16-Bit 16MHz 4KB (4K x 8) FLASH 14-TSSOP
Quantity
Minimum 1

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MSP430G2332IPW14R Technical Specifications

Category Embedded, Microcontrollers

Manufacturer Texas Instruments

Packaging Cut Tape (CT) & Digi-Reel®

Series MSP430G2xx

Product Status Active

DiGi-Electronics Programmable Not Verified

Core Processor MSP430 CPU16

Core Size 16-Bit

Speed 16MHz

Connectivity I2C, SPI, USI

Peripherals Brown-out Detect/Reset, DMA, POR, PWM, WDT

Number of I/O 10

Program Memory Size 4KB (4K x 8)

Program Memory Type FLASH

EEPROM Size -

RAM Size 256 x 8

Voltage - Supply (Vcc/Vdd) 1.8V ~ 3.6V

Data Converters A/D 8x10b

Oscillator Type Internal

Operating Temperature -40°C ~ 85°C (TA)

Mounting Type Surface Mount

Supplier Device Package 14-TSSOP

Package / Case 14-TSSOP (0.173", 4.40mm Width)

Base Product Number MSP430G2332

Datasheet & Documents

Manufacturer Product Page

MSP430G2332IPW14R Specifications

HTML Datasheet

MSP430G2332IPW14R-DG

Environmental & Export Classification

RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.31.0001

Additional Information

Other Names
296-41337-2
296-41337-1
296-41337-6
MSP430G2332IPW14R-DG
Standard Package
2,000

Reviews

5.0/5.0-(Show up to 5 Ratings)
陽光***雨後
de desembre 02, 2025
5.0
我對DiGi Electronics的快速物流非常滿意,且他們的售後團隊每次都能提供即時的技術支援。
Chan***Douce
de desembre 02, 2025
5.0
La livraison a été extrêmement rapide, et la qualité des produits toujours fiable.
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de desembre 02, 2025
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de desembre 02, 2025
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Frequently Asked Questions (FAQ)

What are the key design constraints when using the MSP430G2332IPW14R in a battery-powered sensor node with limited PCB space?

When designing with the MSP430G2332IPW14R in compact, battery-powered applications, key constraints include its 14-TSSOP package footprint requiring precise layout for thermal and signal integrity, and the need to operate within the 1.8V–3.6V supply range for battery compatibility. Leverage the device’s ultra-low-power modes (LPM3/4) to maximize battery life—ensure external pull-ups on unused I/Os are avoided to prevent leakage currents. Use the integrated 10-bit ADC for analog sensing but account for its 1.5V internal reference limit when scaling sensor inputs. Minimize external components by using internal oscillators, though precision timing applications may require an external crystal on P2.0/P2.1 if needed.

Can the MSP430G2332IPW14R replace an MSP430G2231IPW14 in an existing design, and what are the critical differences to verify?

The MSP430G2332IPW14R can replace the MSP430G2231IPW14 in many cases due to compatible pinouts and 14-TSSOP packaging, but verify program memory (4KB vs. 2KB) and peripheral integration—MSP430G2332IPW14R includes a USI module supporting SPI/I2C vs. USI in G2231, enabling more flexible communication. However, confirm I/O mappings and ADC channel assignments, as some variants differ. Additionally, ensure code size fits and that Brown-out Reset (BOR) and WDT configurations are adjusted per application reliability needs. No hardware changes are typically needed, but firmware validation is essential.

How does the MSP430G2332IPW14R handle reliable operation in industrial environments with temperature fluctuations from -40°C to 85°C?

The MSP430G2332IPW14R is rated for -40°C to 85°C operation, making it suitable for industrial environments. Ensure stable 1.8V–3.6V power delivery using low-dropout regulators with adequate decoupling (100nF ceramic close to VCC pins). At temperature extremes, internal oscillator drift may affect timing—use the DCO calibration values stored in INFOA for improved accuracy if precise timing is needed. Avoid rapid temperature cycling and verify signal integrity with proper PCB layout, especially for ADC performance. Enable the built-in WDT during runtime to recover from potential lockups due to EMI or power glitches.

What are the risks of using internal peripherals like the USI and 10-bit ADC in the MSP430G2332IPW14R without external signal conditioning?

Relying solely on the MSP430G2332IPW14R’s internal USI and ADC without external signal conditioning risks degraded performance. The 10-bit ADC has no internal sample-and-hold, so high-impedance sources (>10kΩ) can cause sampling errors—use op-amp buffers for sensors like thermistors. For USI-based SPI/I2C, ensure signal rise times are controlled on longer traces with series resistors or pull-up strength tuning to avoid bus contention. Also, ADC accuracy drops near the lower Vcc range; maintain clean power and consider oversampling for improved resolution in low-noise applications.

What are the long-term reliability concerns when sourcing the MSP430G2332IPW14R for production in high-volume IoT devices?

For high-volume IoT production using the MSP430G2332IPW14R, ensure consistent supply chain sourcing due to potential obsolescence risks—TI’s ‘Active’ status is favorable, but monitor lifecycle notices. Verify MSL-1 rating during assembly: while moisture resistance is excellent, prolonged storage in humid environments may still require baking before reflow. Focus on solder joint reliability with proper thermal profiling for 14-TSSOP. Additionally, lock down firmware with ROM-safe practices since flash memory endurance is limited to ~10k erase/write cycles—avoid frequent field updates to preserve longevity.

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