Counterfeit and defect prevention
Visual and packaging inspection
Electrical performance verification
Service Email:
[email protected]
>
MSP430FR2033IG48
Texas Instruments
IC MCU 16BIT 15.5KB FRAM 48TSSOP
1954 Pcs New Original In Stock
MSP430 CPU16 MSP430™ FRAM Microcontroller IC 16-Bit 16MHz 15.5KB (15.5K x 8) FRAM 48-TSSOP
Request Quote
(Ships tomorrow)
*Quantity
Minimum 1
Minimum 1
5.0 / 5.0
- (229 Ratings)
MSP430FR2033IG48
Product Overview
1278239
DiGi Electronics Part Number
MSP430FR2033IG48-DGManufacturer
Texas Instruments
MSP430FR2033IG48
Description
IC MCU 16BIT 15.5KB FRAM 48TSSOPInventory
1954 Pcs New Original In Stock
MSP430 CPU16 MSP430™ FRAM Microcontroller IC 16-Bit 16MHz 15.5KB (15.5K x 8) FRAM 48-TSSOP
Quantity
Minimum 1
Minimum 1
Purchase and inquiry
Warranty & Returns
How to Order
Shipping & Delivery
Quality Assurance
365 - Day Quality Guarantee - Every part fully backed.
90 - Day Refund or Exchange - Defective parts? No hassle.
Limited Stock, Order Now - Get reliable parts without worry.
Global Shipping & Secure Packaging
Worldwide Delivery in 3-5 Business Days
100% ESD Anti-Static Packaging
Real-Time Tracking for Every Order
Secure & Flexible Payment
Credit Card, VISA, MasterCard, PayPal, Western Union, Telegraphic Transfer(T/T) and more
All payments encrypted for security
MSP430FR2033IG48 Technical Specifications
Category
Embedded, Microcontrollers
Packaging
Tube
Series
MSP430™ FRAM
Product Status
Active
DiGi-Electronics Programmable
Not Verified
Core Processor
MSP430 CPU16
Core Size
16-Bit
Speed
16MHz
Connectivity
I2C, IrDA, SCI, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O
44
Program Memory Size
15.5KB (15.5K x 8)
Program Memory Type
FRAM
EEPROM Size
-
RAM Size
2K x 8
Voltage - Supply (Vcc/Vdd)
1.8V ~ 3.6V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C (TA)
Mounting Type
Surface Mount
Supplier Device Package
48-TSSOP
Package / Case
48-TFSOP (0.240", 6.10mm Width)
Base Product Number
MSP430FR2033
Datasheet & Documents
Manufacturer Product Page
MSP430FR2033IG48 Specifications
Design Resources
Low-Power Touch Through Glass Reference Design
HTML Datasheet
MSP430FR2033IG48-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
REACH Status
REACH Unaffected
ECCN
5A992C
HTSUS
8542.31.0001
Additional Information
Standard Package
40
Reviews
5.0/5.0-(Show up to 5 Ratings)
de desembre 02, 2025
他們的定價策略公開透明，讓我很放心進行合作。
de desembre 02, 2025
Die große Auswahl an Produkten ermöglicht es uns, unsere Bildungsumgebung regelmäßig zu verbessern.
de desembre 02, 2025
Die Logistik- und Versandprozesse sind hervorragend optimiert.
de desembre 02, 2025
The process for resolving post-sales issues is straightforward and transparent.
de desembre 02, 2025
They handle returns and support issues efficiently and professionally.
de desembre 02, 2025
The customer service team was very responsive and helped resolve my issue swiftly.
de desembre 02, 2025
The website's design makes it easy to compare different options effortlessly.
Publish Evalution
Evalution Message
Please enter your review message.
Please post honest comments and do not post ilegal comments.
Frequently Asked Questions (FAQ)
What are the key design-in risks when using the MSP430FR2033IG48 in a low-power sensor node with intermittent SPI communication?
A key risk when designing the MSP430FR2033IG48 into a low-power sensor node is improper management of SPI peripheral wake-up latency and current consumption in active vs. standby modes. Since the device uses FRAM, ensure that SPI transactions don’t inadvertently keep the CPU or module clocks active, preventing entry into LPM3 or LPM4. Design tip: Use DMA-triggered SPI transfers and disable module clocks post-transfer. Also, verify that slave select (CS) lines are pulled correctly to avoid bus contention, which can increase power draw. Decouple SPI with series resistors if sharing the bus with higher-voltage devices to prevent leakage through I/O pins above Vcc.
Can the MSP430FR2033IG48 replace the MSP430F2013 in an existing pulse-counting application, and what are the critical compatibility concerns?
Yes, the MSP430FR2033IG48 can replace the MSP430F2013 in most pulse-counting designs, but key differences must be addressed. The MSP430FR2033IG48 offers FRAM instead of Flash, enabling faster write cycles and better endurance—ideal for frequent data logging. However, interrupt latency and timer_A register mapping are slightly different. Verify that Timer_A capture mode timing aligns with your pulse widths, especially below 1µs. Also, check that the 16MHz DCO calibration constants are remapped correctly in firmware, as the default calibration for the FRAM device differs. Software delay loops may require adjustment due to faster instruction execution.
How does the FRAM memory in the MSP430FR2033IG48 affect reliability in industrial environments with frequent power cycling?
The FRAM in the MSP430FR2033IG48 significantly improves reliability in industrial applications with frequent power cycling due to its 10^14 write-cycle endurance and near-instant write speed, eliminating the need for page-buffering and wear leveling. Unlike Flash-based MCUs, it is immune to write-cycle wear-out. However, ensure Vcc slew rates during power-up and down stay within datasheet limits (≤1V/ms) to prevent metastable states. Combine the brown-out reset (BOR) with software checksum validation of critical FRAM data sectors to guard against incomplete writes during sudden power loss, especially in remote monitoring systems.
What PCB layout and thermal considerations should be addressed when using the MSP430FR2033IG48 in a sealed outdoor enclosure?
When deploying the MSP430FR2033IG48 in a sealed outdoor enclosure, focus on thermal dissipation and moisture ingress. The 48-TSSOP package has limited thermal conductivity, so include at least two thermal vias under the exposed thermal pad (if available) connected to a ground plane. Even with low average current, sustained RF transmission or PWM loads can raise junction temperature—verify TJ < 85°C using worst-case ambient assumptions. Use conformal coating to protect against condensation, and avoid placing I/O traces near high-impedance analog pins (e.g., ADC channels) to prevent leakage. Include a 100nF ceramic capacitor at each Vcc pin, with traces kept short to reduce EMI susceptibility.
How does the MSP430FR2033IG48 compare to the STM32L031K6 in terms of interrupt latency and analog sensing performance for battery-powered applications?
The MSP430FR2033IG48 typically offers lower interrupt latency than the STM32L031K6 due to simpler pipeline architecture and zero-wait-state FRAM, enabling direct interrupt entry within 3 cycles. This benefits fast response to external events like sensor triggers. For analog sensing, the MSP430FR2033IG48 integrates 8x10-bit ADC with internal references and better analog noise immunity in low-power modes, whereas the STM32L031K6's ADC may require stabilization delays post-wake-up. However, the STM32 offers higher resolution (12-bit). For ultra-low-duty-cycle sensing with sub-1µA sleep and fast wake-on-analog, the MSP430FR2033IG48 is often preferred, but validate GPIO voltage thresholds if interfacing with 3.3V peripherals, as the MSP430 is not always 5V-tolerant on all pins.
Quality Assurance (QC)
DiGi ensures the quality and authenticity of every electronic component through professional inspections and batch sampling, guaranteeing reliable sourcing, stable performance, and compliance with technical specifications, helping customers reduce supply chain risks and confidently use components in production.
MSP430FR2033IG48 CAD Models
Texas Instruments MSP430FR2033IG48 PCB symbols & footprints
productDetail
