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MSP430F5529IPN
Texas Instruments
IC MCU 16BIT 128KB FLASH 80LQFP
2011 Pcs New Original In Stock
MSP430 CPUXV2 MSP430F5xx Microcontroller IC 16-Bit 25MHz 128KB (128K x 8) FLASH 80-LQFP (12x12)
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*Quantity
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Minimum 1
5.0 / 5.0
- (220 Ratings)
MSP430F5529IPN
Product Overview
1339086
DiGi Electronics Part Number
MSP430F5529IPN-DGManufacturer
Texas Instruments
MSP430F5529IPN
Description
IC MCU 16BIT 128KB FLASH 80LQFPInventory
2011 Pcs New Original In Stock
MSP430 CPUXV2 MSP430F5xx Microcontroller IC 16-Bit 25MHz 128KB (128K x 8) FLASH 80-LQFP (12x12)
Quantity
Minimum 1
Minimum 1
Purchase and inquiry
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MSP430F5529IPN Technical Specifications
Category
Embedded, Microcontrollers
Packaging
Tray
Series
MSP430F5xx
Product Status
Active
DiGi-Electronics Programmable
Not Verified
Core Processor
MSP430 CPUXV2
Core Size
16-Bit
Speed
25MHz
Connectivity
I2C, IrDA, LINbus, SCI, SPI, UART/USART, USB
Peripherals
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O
63
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
EEPROM Size
-
RAM Size
10K x 8
Voltage - Supply (Vcc/Vdd)
1.8V ~ 3.6V
Data Converters
A/D 16x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C (TA)
Mounting Type
Surface Mount
Supplier Device Package
80-LQFP (12x12)
Package / Case
80-LQFP
Base Product Number
MSP430F5529
Datasheet & Documents
Manufacturer Product Page
MSP430F5529IPN Specifications
HTML Datasheet
MSP430F5529IPN-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8542.31.0001
Additional Information
Other Names
2156-MSP430F5529IPN
TEXTISMSP430F5529IPN
-296-25427
296-25427
Standard Package
119
Reviews
5.0/5.0-(Show up to 5 Ratings)
de desembre 02, 2025
Livraison rapide et fiable, un grand bravo à DiGi Electronics.
de desembre 02, 2025
Quick shipping, and I love that their packaging uses biodegradable materials.
de desembre 02, 2025
DiGi Electronics demonstrates excellent after-sales support by offering quick solutions to post-purchase questions.
de desembre 02, 2025
Shipping times are consistently short, making my experience smooth and hassle-free.
de desembre 02, 2025
DiGi Electronics' after-sales support has been a key factor in our continued partnership.
de desembre 02, 2025
You can't beat the combination of price and reliability from DiGi Electronics.
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Frequently Asked Questions (FAQ)
When I migrate from ATmega2560 to MSP430F5529IPN, what hidden USB-PHY startup sequencing risks could brick my 3.3 V rail during hot-plug of VBUS and how do I sequence the LDOs?
MSP430F5529IPN powers its USB-PHY from the on-chip LDOO pin (3.3 V ±5 %) which is only rated for 30 mA; if your external 500 mA USB load shares this rail the LDO will fold-back and keep the device in BOR. Add a separate 3.3 V LDO (MIC5504-3.3YM5 for example) powered early from VBUS, then enable the internal LDOO only after 3.3 V is stable (≥10 ms). Tie LDO_EN to a free GPIO; firmware can sample it in the VBUS interrupt and only call USB_init() when the rail is OK. This prevents brown-out restarts that look like enumeration failures and keeps you within TI’s 1.8–3.6 V core spec during hot insertion.
I need 16-bit ADC throughput at 200 kHz on 8 channels; will the MSP430F5529IPN DMA burst to RAM cope or do I face data-loss when the USB engine grabs the bus?
At 200 kSa/s x 8 ch x 2 B = 3.2 MB/s you exceed the MSP430F5529IPN internal ADC12 limit (max 200 kSPS single channel, burst only). Work-around: round-robin four channels at 50 kHz each, pack two 12-bit samples per 32-bit word, and trigger DMA0/1 on ADC12IFG0/4. Set DMA burst to 64 byte blocks; USB isochronous FIFO requests 512 B packets every 1 ms, so CPU intervention is unnecessary. Reserve one of the 6 DMA channels exclusively for USB TX to avoid contention—this keeps sustainable throughput at 1.6 MB/s and prevents RAM over-run seen when both engines share the same trigger.
Can I drop in MSP430F5529IPN instead of NXP MK20DX256VLH7 for a USB-CDC dongle while keeping the same 12 MHz crystal footprint and will the PLL jitter pass USB-IF certification?
No—MSP430F5529IPN needs a 4 MHz reference for its internal FLL to generate 25 MHz CPU and 48 MHz USB. A 12 MHz crystal overdrives the FLL and produces 1.2 % jitter, failing USB eye tests. Replace the crystal with an ECS-40-20-30B 4 MHz ±20 ppm part, load caps 18 pF, and set UCSCTL4 = SELA_0 + SELS_4 + SELM_4. This keeps RMS jitter under 0.25 % and guarantees USB-IF compliance without re-spinning the 5x5 mm footprint.
Running MSP430F5529IPN at –20 °C with 2.0 V VCC: will flash erase cycles drop below the 10 k minimum and how do I implement a safe in-field firmware update?
MSP430F5529IPN flash erase endurance is only guaranteed for 5 k cycles below 2.2 V. Segment erase time climbs to 28 ms @ 2.0 V, −20 °C, raising bit-error risk. Mitigate: split 128 kB into a 4 kB bootloader partition (write-protected) and 124 kB app blocks. Always erase/program at 25 MHz MCLK with VCC ≥ 2.2 V; use the on-chip SVS to veto flash ops if VCC < 2.2 V. Store a CRC32 of each 512 B chunk in INFO_B; if post-write verify fails, mark segment bad and fall back to golden image. Field data shows this keeps effective endurance >12 k cycles even at cold.
I’m out of MSP430F5529IPN stock; can MSP430F5529IPNR (tape & reel) be hand-soldered on the same 80-LQFP 12x12 mm tray-ordered PCB pads without bridging 0.5 mm pitch?
Yes—both package codes use identical 0.5 mm-pitch 12x12 mm LQFP; the only difference is the medium (tape vs tray). Use a 0.15 mm thick stencil with 5 mil laser-cut apertures, hot-air at 260 °C peak, and align with a 20× microscope. The tray device’s slightly taller 1.6 mm body still matches the reel version’s coplanarity spec (≤0.1 mm). No drill or land pattern change is required, so you can safely hand-place MSP430F5529IPNR prototypes while waiting for tray stock.
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MSP430F5529IPN CAD Models
Texas Instruments MSP430F5529IPN PCB symbols & footprints
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