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MSP430F5526IRGCT
Texas Instruments
IC MCU 16BIT 96KB FLASH 64VQFN
2685 Pcs New Original In Stock
MSP430 CPUXV2 MSP430F5xx Microcontroller IC 16-Bit 25MHz 96KB (96K x 8) FLASH 64-VQFN (9x9)
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5.0 / 5.0
- (289 Ratings)
MSP430F5526IRGCT
Product Overview
1367949
DiGi Electronics Part Number
MSP430F5526IRGCT-DGManufacturer
Texas Instruments
MSP430F5526IRGCT
Description
IC MCU 16BIT 96KB FLASH 64VQFNInventory
2685 Pcs New Original In Stock
MSP430 CPUXV2 MSP430F5xx Microcontroller IC 16-Bit 25MHz 96KB (96K x 8) FLASH 64-VQFN (9x9)
Quantity
Minimum 1
Minimum 1
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MSP430F5526IRGCT Technical Specifications
Category
Embedded, Microcontrollers
Packaging
-
Series
MSP430F5xx
Product Status
Active
DiGi-Electronics Programmable
Not Verified
Core Processor
MSP430 CPUXV2
Core Size
16-Bit
Speed
25MHz
Connectivity
I2C, IrDA, LINbus, SCI, SPI, UART/USART, USB
Peripherals
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O
47
Program Memory Size
96KB (96K x 8)
Program Memory Type
FLASH
EEPROM Size
-
RAM Size
8K x 8
Voltage - Supply (Vcc/Vdd)
1.8V ~ 3.6V
Data Converters
A/D 12x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C (TA)
Mounting Type
Surface Mount
Supplier Device Package
64-VQFN (9x9)
Package / Case
64-VFQFN Exposed Pad
Base Product Number
MSP430F5526
Datasheet & Documents
Manufacturer Product Page
MSP430F5526IRGCT Specifications
HTML Datasheet
MSP430F5526IRGCT-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8542.31.0001
Additional Information
Other Names
-296-36674-1
296-36674-6
2156-MSP430F5526IRGCT
296-36674-2
296-36674-1
MSP430F5526IRGCT-DG
-296-36674-1-DG
TEXTISMSP430F5526IRGCT
-MSP430F5526IRGCT-NDR
Standard Package
250
Reviews
5.0/5.0-(Show up to 5 Ratings)
de desembre 02, 2025
Their cost-effective solutions are delivered with environmentally mindful packaging.
de desembre 02, 2025
Their after-sales response was immediate and very helpful, ensuring satisfaction.
de desembre 02, 2025
The shipping was incredibly efficient, I received my order within the shortest delivery window.
de desembre 02, 2025
DiGi Electronics’ reliability in delivery and support gives me confidence to use their services for critical projects.
de desembre 02, 2025
DiGi Electronics provides excellent value, especially with their emphasis on safe packaging.
de desembre 02, 2025
The customer service at DiGi Electronics is truly friendly and attentive, always making me feel valued.
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Frequently Asked Questions (FAQ)
What are the key risks when replacing an MSP430F5526IRGCT with a competing ultra-low-power microcontroller like the STM32L452RE or NXP LPC55S28 in a battery-powered sensor node design?
Replacing the MSP430F5526IRGCT with alternatives such as the STM32L452RE or NXP LPC55S28 introduces several design risks: first, the MSP430F5526IRGCT operates down to 1.8V, enabling direct coin-cell operation, while the STM32L452RE requires 1.71V minimum but has higher active current in comparable modes, reducing battery life. Second, the MSP430F5526IRGCT’s integrated USB 2.0 PHY eliminates external components, whereas the LPC55S28 requires an external PHY for full-speed USB, increasing BOM cost and layout complexity. Third, the MSP430F5526IRGCT’s deterministic interrupt latency and unified memory map simplify real-time firmware development compared to the more complex NVIC and cache architecture of the LPC55S28. Always validate power state transitions and peripheral compatibility under worst-case load conditions before committing to a pin-compatible swap.
How should I handle thermal and PCB layout concerns when designing with the MSP430F5526IRGCT in a high-density 64-VQFN package, especially near heat-generating components like switching regulators?
The MSP430F5526IRGCT’s 64-VQFN (9x9) package with an exposed thermal pad demands careful thermal management. Solder the exposed pad fully to a grounded thermal plane on the PCB to ensure proper heat dissipation and electrical grounding. Maintain a minimum 0.5mm clearance between the MCU and high-power components like DC-DC converters to avoid localized heating that could push the junction temperature beyond the -40°C to 85°C operating range. Use thermal vias (≥8 vias of 0.3mm diameter) under the pad to conduct heat to inner or bottom layers. Avoid routing high-speed digital traces beneath the package to prevent coupling noise into sensitive analog sections, particularly the 12-bit ADC inputs.
Can the MSP430F5526IRGCT safely drive multiple I2C peripherals at 400kHz in a noisy industrial environment, and what design mitigations are necessary to prevent bus lockups?
Yes, the MSP430F5526IRGCT supports 400kHz I2C via its USCI module, but in electrically noisy environments, bus lockups due to clock stretching or glitches are a real risk. To mitigate this, use external pull-up resistors (typically 2.2kΩ to 4.7kΩ) sized for the total bus capacitance—avoid internal pull-ups as they are too weak. Implement a watchdog-based I2C timeout routine in firmware to reset the peripheral if the bus hangs. Additionally, place RC filters (e.g., 100Ω + 100pF) on SDA/SCL lines near the MSP430F5526IRGCT to suppress high-frequency noise. For mission-critical systems, consider using a dedicated I2C buffer like the PCA9515A to isolate the MCU from long or noisy bus segments.
What are the reliability implications of operating the MSP430F5526IRGCT at its minimum 1.8V supply voltage in a cold environment (-30°C), and how does this affect flash programming and data retention?
Operating the MSP430F5526IRGCT at 1.8V near the lower end of its temperature range (-30°C to -40°C) increases the risk of flash write/erase failures due to reduced charge pump efficiency in cold conditions. Texas Instruments specifies that flash operations are guaranteed down to 2.2V for full reliability; below this, use the built-in BOR (Brown-Out Reset) set to 1.8V or higher to prevent corruption during brownouts. For data retention, the MSP430F5526IRGCT’s flash maintains integrity over 20 years at 85°C, but cold temperatures can slow leakage, potentially extending retention—however, do not rely on this. Always perform flash operations at or above 2.2V in cold environments, and validate retention with accelerated life testing if used in safety-critical applications.
When integrating USB functionality with the MSP430F5526IRGCT in a consumer device, what are the hidden design constraints related to ESD protection and signal integrity that could cause certification failures?
The MSP430F5526IRGCT includes an integrated USB 2.0 full-speed PHY, but successful USB certification depends on careful ESD and signal integrity design. The USB_DP and USB_DM pins are sensitive and must be routed with controlled impedance (90Ω differential) and minimal length (<50mm). Place TVS diodes (e.g., USBLC6-2SC6) as close as possible to the USB connector—not the MCU—to clamp ESD events before they reach the MSP430F5526IRGCT. Avoid vias in differential pairs and maintain a continuous ground reference plane beneath the traces. Additionally, ensure the 3.3V USB supply is clean and stable; noise on this rail can cause packet errors during enumeration. Failing to follow these practices often results in failed USB-IF compliance tests, particularly for radiated emissions and ESD immunity (IEC 61000-4-2).
Quality Assurance (QC)
DiGi ensures the quality and authenticity of every electronic component through professional inspections and batch sampling, guaranteeing reliable sourcing, stable performance, and compliance with technical specifications, helping customers reduce supply chain risks and confidently use components in production.
MSP430F5526IRGCT CAD Models
Texas Instruments MSP430F5526IRGCT PCB symbols & footprints
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