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MSP430F5510IRGZT
Texas Instruments
IC MCU 16BIT 32KB FLASH 48VQFN
33243 Pcs New Original In Stock
MSP430 CPUXV2 MSP430F5xx Microcontroller IC 16-Bit 25MHz 32KB (32K x 8) FLASH 48-VQFN (7x7)
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5.0 / 5.0
- (454 Ratings)
MSP430F5510IRGZT
Product Overview
1333951
DiGi Electronics Part Number
MSP430F5510IRGZT-DGManufacturer
Texas Instruments
MSP430F5510IRGZT
Description
IC MCU 16BIT 32KB FLASH 48VQFNInventory
33243 Pcs New Original In Stock
MSP430 CPUXV2 MSP430F5xx Microcontroller IC 16-Bit 25MHz 32KB (32K x 8) FLASH 48-VQFN (7x7)
Quantity
Minimum 1
Minimum 1
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MSP430F5510IRGZT Technical Specifications
Category
Embedded, Microcontrollers
Packaging
Cut Tape (CT) & Digi-Reel®
Series
MSP430F5xx
Product Status
Active
DiGi-Electronics Programmable
Not Verified
Core Processor
MSP430 CPUXV2
Core Size
16-Bit
Speed
25MHz
Connectivity
I2C, IrDA, LINbus, SCI, SPI, UART/USART, USB
Peripherals
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O
31
Program Memory Size
32KB (32K x 8)
Program Memory Type
FLASH
EEPROM Size
-
RAM Size
6K x 8
Voltage - Supply (Vcc/Vdd)
1.8V ~ 3.6V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C (TA)
Mounting Type
Surface Mount
Supplier Device Package
48-VQFN (7x7)
Package / Case
48-VFQFN Exposed Pad
Base Product Number
MSP430F5510
Datasheet & Documents
Manufacturer Product Page
MSP430F5510IRGZT Specifications
HTML Datasheet
MSP430F5510IRGZT-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8542.31.0001
Additional Information
Other Names
296-31692-2
MSP430F5510IRGZT-DG
296-31692-6
TEXTISMSP430F5510IRGZT
2156-MSP430F5510IRGZT
296-31692-1
Standard Package
250
Reviews
5.0/5.0-(Show up to 5 Ratings)
de desembre 02, 2025
Le professionnalisme de DiGi Electronics se voit dans leur service d’expédition et leur support.
de desembre 02, 2025
Their after-sales team responds with remarkable speed and clarity.
de desembre 02, 2025
Their commitment to reliable products at a low cost really impresses me.
de desembre 02, 2025
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de desembre 02, 2025
Fast, affordable, and reliable—DiGi Electronics exceeds expectations.
de desembre 02, 2025
From the first use, it's clear that quality is a top priority at DiGi Electronics.
de desembre 02, 2025
This product feels solid and robust, indicating high-quality materials and craftsmanship.
de desembre 02, 2025
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Frequently Asked Questions (FAQ)
Can the MSP430F5510IRGZT be safely used in a battery-powered IoT sensor node that must operate down to 2.0V, given its 1.8V minimum Vcc specification?
While the MSP430F5510IRGZT is rated for 1.8V to 3.6V operation, running it near the lower limit in a real-world battery-powered design introduces risks. As alkaline or Li-ion batteries discharge, voltage sag under load can briefly dip below 1.8V, potentially causing brown-out resets or erratic behavior. To mitigate this, use a low-dropout regulator (LDO) with tight output tolerance or implement dynamic voltage scaling. Additionally, enable the built-in brown-out detect (BOD) at an appropriate threshold (e.g., BOR level 1.9V) to ensure clean resets. Always validate worst-case startup and transient response under low-battery conditions during prototyping.
Is the MSP430F5510IRGZT a drop-in replacement for the older MSP430F2013IPWR in a legacy industrial control board, considering pinout, power, and peripheral compatibility?
No, the MSP430F5510IRGZT is not a drop-in replacement for the MSP430F2013IPWR due to fundamental differences in package (48-VQFN vs. 14-TSSOP), I/O count (31 vs. 11), and peripheral set. While both use the MSP430 core, the F5510 includes USB and DMA—features absent in the F2013—but lacks direct pin compatibility. Power domains are similar (1.8–3.6V), but clocking and memory architecture differ significantly. If upgrading, you’ll need a PCB redesign; consider the MSP430G2553IPW14 as a closer functional and pin-compatible alternative if USB isn’t required.
How does the internal oscillator accuracy of the MSP430F5510IRGZT impact UART communication reliability in a noisy factory environment without an external crystal?
The MSP430F5510IRGZT’s internal ±2% RC oscillator (at 25°C) may cause UART framing errors in long-daisy-chained or high-baud-rate (≥115200) links, especially over temperature swings (-40°C to 85°C) where drift can exceed ±4%. In electrically noisy industrial settings, this compounds with signal integrity issues. For reliable asynchronous communication, use an external 32.768kHz watch crystal for low-speed timing or a high-frequency crystal (e.g., 8MHz) with the DCO calibrated via the factory-trimmed values. Alternatively, implement software-based baud rate detection or use synchronous protocols like SPI where clock is driven by the master.
What are the thermal and layout risks when using the MSP430F5510IRGZT in a compact wearable device with limited copper pour and no forced airflow?
The MSP430F5510IRGZT’s 48-VQFN package includes an exposed thermal pad that must be soldered to a grounded PCB pour for effective heat dissipation. In compact wearables with minimal copper area, junction temperatures can rise significantly—even at modest clock speeds—due to poor thermal conduction. Without adequate thermal vias under the pad, localized heating may trigger unintended resets or reduce flash endurance. Mitigate this by connecting the exposed pad to a multi-layer ground plane with at least six 0.3mm thermal vias, and avoid placing heat-sensitive components nearby. Validate thermal performance using IR imaging or a thermocouple during peak CPU and USB activity.
Can I replace the MSP430F5510IRGZT with the newer MSP430FR5994IPMR in a USB-enabled data logger to gain FRAM benefits, and what firmware changes are needed?
Yes, the MSP430FR5994IPMR can replace the MSP430F5510IRGZT in a USB data logger, offering non-volatile FRAM for faster writes and lower power, but it requires significant firmware adaptation. The FR5994 uses a different memory map, peripheral register layout, and lacks direct code compatibility despite sharing the CPUXV2 core. You’ll need to update clock configuration (FR5994 uses a different DCO structure), rewrite flash/EEPROM emulation routines (FRAM doesn’t require erase cycles), and verify USB stack compatibility—TI’s USB API differs between families. Also, note the FR5994 has 256KB FRAM vs. 32KB flash on the F5510, enabling larger buffer designs, but requires migration to Code Composer Studio or newer toolchains with FRAM-aware debugging.
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MSP430F5510IRGZT CAD Models
Texas Instruments MSP430F5510IRGZT PCB symbols & footprints
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