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MSP430F5340IRGZR
Texas Instruments
IC MCU 16BIT 64KB FLASH 48VQFN
19034 Pcs New Original In Stock
MSP430 CPUXV2 MSP430F5xx Microcontroller IC 16-Bit 25MHz 64KB (64K x 8) FLASH 48-VQFN (7x7)
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5.0 / 5.0
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MSP430F5340IRGZR
Product Overview
1333207
DiGi Electronics Part Number
MSP430F5340IRGZR-DGManufacturer
Texas Instruments
MSP430F5340IRGZR
Description
IC MCU 16BIT 64KB FLASH 48VQFNInventory
19034 Pcs New Original In Stock
MSP430 CPUXV2 MSP430F5xx Microcontroller IC 16-Bit 25MHz 64KB (64K x 8) FLASH 48-VQFN (7x7)
Quantity
Minimum 1
Minimum 1
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MSP430F5340IRGZR Technical Specifications
Category
Embedded, Microcontrollers
Packaging
Cut Tape (CT) & Digi-Reel®
Series
MSP430F5xx
Product Status
Active
DiGi-Electronics Programmable
Not Verified
Core Processor
MSP430 CPUXV2
Core Size
16-Bit
Speed
25MHz
Connectivity
I2C, IrDA, SCI, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O
38
Program Memory Size
64KB (64K x 8)
Program Memory Type
FLASH
EEPROM Size
-
RAM Size
6K x 8
Voltage - Supply (Vcc/Vdd)
1.8V ~ 3.6V
Data Converters
A/D 9x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C (TA)
Mounting Type
Surface Mount
Supplier Device Package
48-VQFN (7x7)
Package / Case
48-VFQFN Exposed Pad
Base Product Number
MSP430F5340
Datasheet & Documents
Manufacturer Product Page
MSP430F5340IRGZR Specifications
HTML Datasheet
MSP430F5340IRGZR-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8542.31.0001
Additional Information
Other Names
296-29580-1
296-29580-2
296-29580-6
Standard Package
2,500
Reviews
5.0/5.0-(Show up to 5 Ratings)
de desembre 02, 2025
Service client impeccable et prix très accessibles, je ne peux que recommander.
de desembre 02, 2025
Die Navigation auf der Website ist klar strukturiert, sodass ich schnell zu meinen gewünschten Produkten gelangt bin.
de desembre 02, 2025
Ich bin begeistert von der schnellen Bearbeitung meiner Bestellung.
de desembre 02, 2025
The prompt shipping process really enhanced my shopping experience.
de desembre 02, 2025
The packaging is top-notch, ensuring everything stays safe during transit, and the shipping was lightning fast.
de desembre 02, 2025
Their proactive communication about delivery times is very helpful.
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Frequently Asked Questions (FAQ)
What are the critical design considerations when replacing an MSP430F5340IRGZR with a competing ultra-low-power microcontroller like the STM32L452RE in a battery-powered sensor node?
When evaluating a replacement of the MSP430F5340IRGZR with the STM32L452RE, key risks include differences in low-power mode behavior, peripheral compatibility, and voltage domain flexibility. The MSP430F5340IRGZR operates down to 1.8V and offers deterministic wake-up from LPM3/LPM4 with minimal current (as low as 1µA), while the STM32L452RE requires 1.71V minimum but uses a more complex power architecture with multiple voltage scaling modes. Additionally, the MSP430’s integrated 12-bit ADC runs autonomously with DMA support in low-power modes—a feature not always matched by the STM32L4 without careful configuration. Ensure your firmware can adapt to different clocking schemes and interrupt latencies, and validate real-world power consumption under identical workloads before committing to a redesign.
Can the MSP430F5340IRGZR safely drive 5V-tolerant logic inputs in a mixed-voltage industrial control system without level shifters?
No, the MSP430F5340IRGZR is not 5V-tolerant on its I/O pins. Its absolute maximum voltage on any pin is VDD + 0.3V, and with a maximum VDD of 3.6V, applying 5V signals risks latch-up or long-term reliability degradation. In industrial environments where 5V TTL or CMOS signals are common, you must use level-shifting circuitry (e.g., TXB0108 or discrete MOSFET-based translators) or ensure all connected devices operate within the 1.8V–3.6V range. Relying on internal protection diodes for clamping is unsafe and violates TI’s recommended operating conditions—this oversight is a frequent cause of field failures in retrofit designs.
How does the exposed pad on the MSP430F5340IRGZR affect PCB thermal and electrical design, and what layout mistakes should be avoided during high-reliability assembly?
The 48-VQFN package of the MSP430F5340IRGZR includes an exposed thermal pad that must be soldered to a grounded copper pour on the PCB for both thermal dissipation and electrical stability. Failing to connect this pad to ground increases thermal resistance and can cause erratic behavior due to floating substrate noise. Use at least nine 0.3mm vias under the pad to a solid ground plane on inner layers, and ensure solder paste stencil apertures cover 50–80% of the pad area to prevent voiding. Avoid placing signal traces beneath the pad, as this can lead to unintended coupling or solder bridging during reflow—especially critical in high-volume manufacturing where MSL3 handling requires strict moisture control.
Is it safe to run the MSP430F5340IRGZR at 25MHz continuously from the internal DCO while operating near the upper temperature limit of 85°C, and what are the implications for timing-sensitive applications like UART or SPI?
While the MSP430F5340IRGZR supports 25MHz operation from the internal DCO across the full -40°C to 85°C range, frequency drift due to temperature and voltage variation can exceed ±1% without calibration. For timing-critical protocols like UART or synchronous SPI slaves, this drift may cause bit errors at high baud rates (>115.2 kbps). TI recommends using the internal REF module or an external crystal for precise timing, or implementing software-based baud rate calibration using the Timer_A module. Relying solely on the uncalibrated DCO in industrial or automotive ambient conditions is a common source of intermittent communication faults that are difficult to debug post-deployment.
What are the risks of substituting the MSP430F5340IRGZR with the pin-compatible but lower-memory MSP430F5338 in an existing firmware design that uses all 64KB of flash?
Substituting the MSP430F5340IRGZR with the MSP430F5338—despite apparent pin and package compatibility—introduces significant firmware and functional risks. The MSP430F5338 has only 32KB of flash and 4KB of RAM (vs. 64KB/6KB in the MSP430F5340IRGZR), which will cause linker errors or runtime crashes if your application exceeds these limits. Additionally, the MSP430F5338 lacks certain peripherals like the second USCI module and has fewer ADC channels, potentially breaking communication stacks or sensor interfaces. Always verify memory map alignment, peripheral availability, and interrupt vector compatibility before considering drop-in replacements, even within the same family. Blind substitution based solely on footprint similarity is a leading cause of costly respins in production hardware.
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MSP430F5340IRGZR CAD Models
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