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MSP430F5335IPZR
Texas Instruments
IC MCU 16BIT 256KB FLASH 100LQFP
53075 Pcs New Original In Stock
MSP430 CPUXV2 MSP430F5xx Microcontroller IC 16-Bit 20MHz 256KB (256K x 8) FLASH 100-LQFP (14x14)
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5.0 / 5.0
- (489 Ratings)
MSP430F5335IPZR
Product Overview
1341887
DiGi Electronics Part Number
MSP430F5335IPZR-DGManufacturer
Texas Instruments
MSP430F5335IPZR
Description
IC MCU 16BIT 256KB FLASH 100LQFPInventory
53075 Pcs New Original In Stock
MSP430 CPUXV2 MSP430F5xx Microcontroller IC 16-Bit 20MHz 256KB (256K x 8) FLASH 100-LQFP (14x14)
Quantity
Minimum 1
Minimum 1
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MSP430F5335IPZR Technical Specifications
Category
Embedded, Microcontrollers
Packaging
Cut Tape (CT) & Digi-Reel®
Series
MSP430F5xx
Product Status
Active
DiGi-Electronics Programmable
Verified
Core Processor
MSP430 CPUXV2
Core Size
16-Bit
Speed
20MHz
Connectivity
I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O
74
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
EEPROM Size
-
RAM Size
18K x 8
Voltage - Supply (Vcc/Vdd)
1.8V ~ 3.6V
Data Converters
A/D 16x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C (TA)
Mounting Type
Surface Mount
Supplier Device Package
100-LQFP (14x14)
Package / Case
100-LQFP
Base Product Number
MSP430F5335
Datasheet & Documents
Manufacturer Product Page
MSP430F5335IPZR Specifications
HTML Datasheet
MSP430F5335IPZR-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8542.31.0001
Additional Information
Other Names
296-29817-6
-296-29817-1
-296-29817-1-DG
296-29817-1
-MSP430F5335IPZR-NDR
296-29817-2
Standard Package
1,000
Alternative Parts
PART NUMBER
MANUFACTURER
QUANTITY AVAILABLE
DiGi PART NUMBER
UNIT PRICE
SUBSTITUTE TYPE
Reviews
5.0/5.0-(Show up to 5 Ratings)
de desembre 02, 2025
Je suis impressionné par la robustesse de l’emballage chez DiGi Electronics. De plus, leurs prix sont très compétitifs, ce qui leur donne un avantage évident.
de desembre 02, 2025
Price tags are reasonable given the high standard of the products.
de desembre 02, 2025
Affordable and environmentally conscious—DiGi Electronics is my go-to brand.
de desembre 02, 2025
I’ve noticed that their packaging keeps products well-protected even during long transit.
de desembre 02, 2025
Their after-sales service ensures minimal downtime and maximum productivity.
de desembre 02, 2025
Their attentive service ensures I always have the right information and support when I need it.
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Frequently Asked Questions (FAQ)
What are the key design-in risks when using the MSP430F5335IPZR in a low-power industrial sensor application with intermittent wireless transmission?
When designing the MSP430F5335IPZR into a low-power sensor node, engineers must carefully manage its 20MHz CPU speed and multiple peripherals to avoid unintended current spikes. While the MSP430F5335IPZR supports deep sleep modes, improper configuration of DMA transfers or wakeup from UART/I2C events can lead to excessive average current. To mitigate, use the integrated WDT and brown-out reset to ensure reliable restarts after brownouts, and verify all unused I/Os are configured as outputs tied low. Also, ensure the 1.8V–3.6V supply remains stable during RF transmission bursts, as voltage droop can trigger resets. Consider pairing with a low-quiescent LDO to maintain clean power under dynamic loads.
Can the MSP430F5335IPZR replace an MSP430F5438A in an existing high-channel-count data acquisition system without PCB redesign?
Replacing the MSP430F5438A with the MSP430F5335IPZR requires careful evaluation despite both being 100-LQFP MSP430 variants. The MSP430F5335IPZR offers 16x12-bit ADC channels, but has only 74 I/Os compared to the F5438A’s 87, which may limit pin availability for high-channel-count systems. Additionally, the F5335 has 256KB flash vs. 256KB on the F5438A, but RAM is reduced to 18KB (from 16KB). While the CPU architecture is similar (MSP430Xv2), differences in peripheral mapping—especially DMA and timer blocks—can require firmware adjustments. A pinout comparison is essential; although both are 100-LQFP, the footprint may not be interchangeable without routing changes.
How does the internal oscillator accuracy of the MSP430F5335IPZR affect real-time control performance in clock-sensitive applications?
The MSP430F5335IPZR relies on an internal oscillator, which has a typical accuracy of ±1% over temperature but can vary up to ±5% in extreme conditions or across batches. This drift impacts time-critical functions like UART communication at higher baud rates (e.g., 115200 bps) or PWM timing for motor control, potentially leading to communication errors or jitter. For precision timing, consider using an external 32.768kHz crystal with the integrated RTC to calibrate the internal DCO via software trim. Alternatively, add an external high-speed crystal if synchronous communication or precise ADC sampling intervals are required, as internal-only timing increases long-term reliability risks in uncontrolled environments.
What PCB layout and thermal considerations should be addressed when deploying the MSP430F5335IPZR in a sealed outdoor enclosure?
The MSP430F5335IPZR in a 100-LQFP package (14x14mm) requires attention to thermal dissipation in sealed enclosures, especially when operating near 85°C ambient. Although the device has low active current (~165 µA/MHz), poor PCB layout can lead to localized heating. Use at least four thermal vias under the exposed pad to transfer heat to inner or back-side ground planes. Ensure solder joint reliability by following MSL3 guidelines—bake the device if exposed to >60% RH for >168 hours before reflow. Also, route high-speed signals (e.g., SPI to sensors) away from analog traces to prevent crosstalk, and place decoupling capacitors (100nF) close to each Vcc pin to maintain supply integrity under transient loads.
What are the reliability concerns when using the MSP430F5335IPZR in a medical wearable with frequent power cycling and battery voltage fluctuations?
In medical wearables, the MSP430F5335IPZR must handle frequent brownouts and supply noise from small Li-ion batteries. Its built-in brown-out detect (BOR) resets the device below 1.8V, but rapid voltage transients during startup can corrupt register states or partially initialize peripherals. To ensure reliability, enable the POR circuitry and use the WDT as a fail-safe timer that requires periodic clearing in firmware. Avoid powering down abruptly; instead, implement a controlled shutdown sequence when battery voltage drops near 1.8V. Also, verify that the ADC reference is set to internal 2.5V with bypass capacitor to maintain accurate sensor readings despite Vcc variations. Firmware should include flash write protection to prevent corruption during unexpected power loss, leveraging the MSP430F5335IPZR’s segment protection features.
Quality Assurance (QC)
DiGi ensures the quality and authenticity of every electronic component through professional inspections and batch sampling, guaranteeing reliable sourcing, stable performance, and compliance with technical specifications, helping customers reduce supply chain risks and confidently use components in production.
MSP430F5335IPZR CAD Models
Texas Instruments MSP430F5335IPZR PCB symbols & footprints
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