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MSP430F5328IRGCR
Texas Instruments
IC MCU 16BIT 128KB FLASH 64VQFN
2322 Pcs New Original In Stock
MSP430 CPUXV2 MSP430F5xx Microcontroller IC 16-Bit 25MHz 128KB (128K x 8) FLASH 64-VQFN (9x9)
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5.0 / 5.0
- (419 Ratings)
MSP430F5328IRGCR
Product Overview
1293438
DiGi Electronics Part Number
MSP430F5328IRGCR-DGManufacturer
Texas Instruments
MSP430F5328IRGCR
Description
IC MCU 16BIT 128KB FLASH 64VQFNInventory
2322 Pcs New Original In Stock
MSP430 CPUXV2 MSP430F5xx Microcontroller IC 16-Bit 25MHz 128KB (128K x 8) FLASH 64-VQFN (9x9)
Quantity
Minimum 1
Minimum 1
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MSP430F5328IRGCR Technical Specifications
Category
Embedded, Microcontrollers
Packaging
Cut Tape (CT) & Digi-Reel®
Series
MSP430F5xx
Product Status
Active
DiGi-Electronics Programmable
Not Verified
Core Processor
MSP430 CPUXV2
Core Size
16-Bit
Speed
25MHz
Connectivity
I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O
47
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
EEPROM Size
-
RAM Size
10K x 8
Voltage - Supply (Vcc/Vdd)
1.8V ~ 3.6V
Data Converters
A/D 12x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C (TA)
Mounting Type
Surface Mount
Supplier Device Package
64-VQFN (9x9)
Package / Case
64-VFQFN Exposed Pad
Base Product Number
MSP430F5328
Datasheet & Documents
Manufacturer Product Page
MSP430F5328IRGCR Specifications
HTML Datasheet
MSP430F5328IRGCR-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8542.31.0001
Additional Information
Other Names
-296-29800-1
296-29800-1
296-29800-2
-MSP430F5328IRGCR-NDR
296-29800-6
-296-29800-1-DG
Standard Package
2,000
Reviews
5.0/5.0-(Show up to 5 Ratings)
de desembre 02, 2025
구매 후 지속적인 지원이 마음에 들어요. 매우 만족스럽습니다.
de desembre 02, 2025
Die Lieferung kam stets pünktlich, was bei meinen bisherigen Einkäufen bei anderen Anbietern nicht immer der Fall war.
de desembre 02, 2025
Great prices, high-quality eco packaging—what more could I ask for?
de desembre 02, 2025
Shopping on DiGi Electronics is reliable and budget-friendly with a great online experience.
de desembre 02, 2025
The packaging was secure and professional, ensuring my items arrived in perfect condition.
de desembre 02, 2025
The customer support after purchase is always courteous and efficient.
de desembre 02, 2025
The company provides comprehensive after-sales services that truly add value to their offerings.
de desembre 02, 2025
Always well-stocked and ready to serve, making our procurement process efficient.
de desembre 02, 2025
DiGi’s products are crafted with precision, showing their dedication to quality.
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Frequently Asked Questions (FAQ)
What are the key design risks when replacing MSP430F5328IRGCR with a pin-compatible alternative like the MSP430F5338 in a battery-powered sensor node, and how can I validate functional equivalence beyond datasheet specs?
While the MSP430F5338 shares the same 64-VQFN package and similar core architecture, critical differences in peripheral mapping (e.g., ADC channel assignments and DMA trigger sources) and power state transition timing can break firmware compatibility. The MSP430F5328IRGCR’s 12-bit ADC has specific sampling capacitor settling behavior that differs from the F5338’s implementation—verify by measuring actual conversion accuracy under low VCC (1.8V) and high source impedance (>10kΩ). Always revalidate low-power mode current draw in LPM3/LPM4 using a precision uA meter, as leakage paths in I/O pins may vary between revisions. Perform a full regression test of your application’s real-time response to interrupts during power mode transitions.
How does the MSP430F5328IRGCR’s internal oscillator stability impact timing-critical UART communication in industrial environments with wide temperature swings, and what mitigation strategies should I implement?
The MSP430F5328IRGCR’s internal 25MHz DCO can drift up to ±1.5% over -40°C to 85°C, which exceeds the ±2% total tolerance budget for reliable UART operation at 115200 baud. In industrial settings with rapid thermal cycling, this can cause framing errors. To mitigate, enable the built-in frequency calibration using factory-trimmed values stored in the TLV structure, or implement periodic auto-baud detection in software. For mission-critical links, consider using an external 32.768kHz crystal for ACLK and derive SMCLK via DCO modulation—this hybrid approach maintains low power while improving long-term stability. Always validate baud rate error using an oscilloscope on the actual PCB under thermal stress.
Can I safely use the MSP430F5328IRGCR’s GPIO pins to directly drive inductive loads like relays or solenoids in a 24V industrial control system, and what protection circuitry is essential to prevent latch-up or ESD damage?
No—the MSP430F5328IRGCR’s GPIOs are not designed to sink/source more than 6mA per pin and lack robust ESD protection for industrial transients. Directly driving inductive loads risks exceeding the absolute maximum ratings during flyback events, potentially causing latch-up or cumulative oxide degradation. Always use a dedicated driver IC (e.g., TI’s DRV8873) or optocoupler interface. If space-constrained, add a flyback diode (1N4148) across the load, a series current-limiting resistor (≥1kΩ), and a TVS diode (SMAJ33A) on the GPIO line. Route the return path separately to avoid ground bounce affecting analog measurements. Validate robustness with IEC 61000-4-2 ESD testing at ±8kV contact discharge.
What are the hidden reliability concerns when operating the MSP430F5328IRGCR at its maximum 3.6V supply voltage in high-humidity environments, and how does MSL 3 rating influence PCB assembly and storage practices?
Operating near 3.6V increases electric field stress on the thin gate oxides, accelerating time-dependent dielectric breakdown (TDDB), especially when combined with moisture ingress in humid environments. The MSL 3 rating (168 hours floor life) means the device is susceptible to popcorning if exposed to >60% RH before reflow. After opening the dry pack, you must bake the reels at 125°C for 24 hours if stored beyond 168 hours at <30% RH. During PCB assembly, ensure conformal coating (e.g., acrylic or parylene) covers the exposed thermal pad and bond wires to prevent electrochemical migration. Monitor for increased standby current over time—a sign of early oxide degradation—especially in designs with long field lifetimes.
When integrating the MSP430F5328IRGCR into a mixed-signal design with sensitive analog sensors, how should I manage ground return paths and power sequencing to avoid noise coupling through the exposed thermal pad, and what layout mistakes commonly degrade ADC performance?
The exposed thermal pad on the MSP430F5328IRGCR is internally connected to VSS, so improper grounding creates ground loops that couple digital switching noise into analog inputs. Connect the pad to a solid, unbroken analog ground plane—not a digital ground—using multiple vias (≥9) to minimize impedance. Never split the ground plane; instead, partition components. Power sequencing isn’t critical since there’s no separate analog supply, but ensure AVCC is filtered with a 10Ω resistor and 100nF+10μF capacitors placed within 2mm of the pin. Avoid routing high-speed digital traces (e.g., SPI clocks) underneath the MCU or parallel to analog input traces. A common mistake is placing decoupling capacitors on the opposite side of the board without short, wide return paths—this increases loop inductance and degrades ADC SNR by >6dB.
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MSP430F5328IRGCR CAD Models
Texas Instruments MSP430F5328IRGCR PCB symbols & footprints
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