MSP430F2616TPM >
MSP430F2616TPM
Texas Instruments
IC MCU 16BIT 92KB FLASH 64LQFP
2724 Pcs New Original In Stock
MSP430 CPU16 MSP430F2xx Microcontroller IC 16-Bit 16MHz 92KB (92K x 8 + 256B) FLASH 64-LQFP (10x10)
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MSP430F2616TPM Texas Instruments
5.0 / 5.0 - (131 Ratings)

MSP430F2616TPM

Product Overview

1333587

DiGi Electronics Part Number

MSP430F2616TPM-DG

Manufacturer

Texas Instruments
MSP430F2616TPM

Description

IC MCU 16BIT 92KB FLASH 64LQFP

Inventory

2724 Pcs New Original In Stock
MSP430 CPU16 MSP430F2xx Microcontroller IC 16-Bit 16MHz 92KB (92K x 8 + 256B) FLASH 64-LQFP (10x10)
Quantity
Minimum 1

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MSP430F2616TPM Technical Specifications

Category Embedded, Microcontrollers

Manufacturer Texas Instruments

Packaging Tray

Series MSP430F2xx

Product Status Active

DiGi-Electronics Programmable Not Verified

Core Processor MSP430 CPU16

Core Size 16-Bit

Speed 16MHz

Connectivity I2C, IrDA, LINbus, SCI, SPI, UART/USART

Peripherals Brown-out Detect/Reset, DMA, POR, PWM, WDT

Number of I/O 48

Program Memory Size 92KB (92K x 8 + 256B)

Program Memory Type FLASH

EEPROM Size -

RAM Size 4K x 8

Voltage - Supply (Vcc/Vdd) 1.8V ~ 3.6V

Data Converters A/D 8x12b; D/A 2x12b

Oscillator Type Internal

Operating Temperature -40°C ~ 105°C (TA)

Mounting Type Surface Mount

Supplier Device Package 64-LQFP (10x10)

Package / Case 64-LQFP

Base Product Number MSP430F2616

Datasheet & Documents

Manufacturer Product Page

MSP430F2616TPM Specifications

HTML Datasheet

MSP430F2616TPM-DG

Environmental & Export Classification

RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.31.0001

Additional Information

Other Names
296-32653
2156-MSP430F2616TPM
MSP430F2616TPM-DG
TEXTISMSP430F2616TPM
Standard Package
160

Reviews

5.0/5.0-(Show up to 5 Ratings)
하***로
de desembre 02, 2025
5.0
꾸준한 품질 유지와 세심한 고객 지원이 돋보입니다.
별***한밤
de desembre 02, 2025
5.0
제품 품질에 대해 어떠한 걱정도 없고, 배송도 항상 약속한 시간에 도착해서 매우 만족합니다.
Amo***erso
de desembre 02, 2025
5.0
Leur rapport qualité-prix est sans pareil, parfait pour une jeune entreprise comme la nôtre.
Chan***Doux
de desembre 02, 2025
5.0
DiGi Electronics facilite la vie avec ses prix compétitifs et son service client exceptionnel.
り***ゃん
de desembre 02, 2025
5.0
発送のスピードも速く、必要なときにすぐに手に入る点がありがたいです。
Dre***aven
de desembre 02, 2025
5.0
Their commitment to quality keeps me coming back for all my DIY needs.
Hopef***earts
de desembre 02, 2025
5.0
Their support team is knowledgeable and always ready to help resolve issues.
Whispe***gWinds
de desembre 02, 2025
5.0
DiGi Electronics’ prompt shipping has helped me meet critical project deadlines.
Lumino***orizon
de desembre 02, 2025
5.0
Good stock levels and attentive service make DiGi Electronics a standout in electronic components distribution.
Coba***ream
de desembre 02, 2025
5.0
DiGi Electronics strikes the perfect balance between price and performance.
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Frequently Asked Questions (FAQ)

What are the key design risks when replacing an MSP430F2616TPM with a similar low-power microcontroller like the MSP430G2955IPWR, and how can I ensure seamless firmware compatibility?

Replacing the MSP430F2616TPM with the MSP430G2955IPWR introduces several design risks despite both being in the MSP430 family. The MSP430G2955IPWR has only 32KB of flash and 2KB of RAM compared to the MSP430F2616TPM’s 92KB flash and 4KB RAM, which may cause memory overflow in existing applications. Additionally, the MSP430G2955IPWR lacks the DMA controller and has fewer peripheral instances (e.g., only one USCI module vs. two on the F2616), potentially breaking real-time data handling. To mitigate risk, perform a full memory map and peripheral usage audit of your firmware, and verify interrupt vector compatibility. Always test with worst-case workloads on the new device before committing to redesign.

Can the MSP430F2616TPM operate reliably in industrial environments at 105°C ambient temperature, and what PCB layout considerations are critical to prevent thermal or signal integrity issues?

Yes, the MSP430F2616TPM is rated for operation up to 105°C (TA), making it suitable for industrial applications, but reliability depends heavily on PCB design. At high temperatures, increased leakage current and reduced noise margins can affect analog performance (e.g., ADC accuracy). Ensure adequate copper pour under the 64-LQFP package for thermal dissipation, maintain a solid ground plane, and keep high-impedance analog traces (like ADC inputs) short and shielded. Also, decouple each VCC pin with a 100nF ceramic capacitor placed within 2mm of the pin. Avoid routing high-speed digital signals (e.g., SPI clocks) near sensitive analog lines to prevent crosstalk-induced errors at elevated temperatures.

How does the MSP430F2616TPM compare to the newer MSP430FR5994IPZR in terms of power efficiency and long-term availability for battery-powered designs?

The MSP430FR5994IPZR offers superior power efficiency due to its FRAM technology, which enables faster writes and lower active current during flash operations compared to the MSP430F2616TPM’s embedded flash. However, the MSP430F2616TPM remains a strong choice for designs requiring proven longevity and lower unit cost in moderate-power applications. For battery-powered systems where frequent data logging is needed, the FR5994’s near-zero write energy is advantageous. But if your application uses infrequent writes and prioritizes supply chain stability, the MSP430F2616TPM—being actively manufactured and widely stocked—offers better long-term availability. Always model total system current over the duty cycle to make an informed trade-off.

What are the hidden integration challenges when using the MSP430F2616TPM’s internal oscillator in precision timing applications, and how can I compensate for frequency drift?

The MSP430F2616TPM’s internal oscillator (±2.5% initial accuracy, ±10% over temperature and voltage) is insufficient for precision timing tasks like UART communication at high baud rates or sensor synchronization without calibration. Frequency drift over temperature (especially near -40°C or 105°C) can cause bit errors in serial protocols. To mitigate this, use the built-in factory-calibrated trim values stored in flash (Tlv_DCO_30) to fine-tune DCO frequency at startup. For mission-critical timing, consider adding an external 32.768kHz crystal for the low-frequency clock (ACLK) and use Timer_A in continuous mode with capture/compare for accurate event timing. Always validate timing margins across the full operating temperature range during prototype testing.

Is it safe to use the MSP430F2616TPM in a 3.3V system with mixed 5V-tolerant peripherals, and what protection circuitry is recommended for I/O pins connected to external 5V devices?

The MSP430F2616TPM is not 5V-tolerant; applying 5V to any I/O pin can damage the device even if VCC is 3.3V. While some early MSP430 variants had limited tolerance, the F2xx series does not support it. When interfacing with 5V logic (e.g., sensors or legacy MCUs), use level-shifting circuits such as bidirectional voltage translators (e.g., TXB0108) or resistor-divider networks for unidirectional signals. For analog inputs, add a series resistor (1kΩ–10kΩ) and a Schottky diode clamp to VCC to limit current during overvoltage events. Always verify signal levels with an oscilloscope under all operating conditions to prevent latch-up or long-term degradation of the MSP430F2616TPM’s I/O structure.

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