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MSP430F2419TZQWR
Texas Instruments
IC MCU 16BIT 120KB FLASH 113BGA
3853 Pcs New Original In Stock
MSP430 CPU16 MSP430F2xx Microcontroller IC 16-Bit 16MHz 120KB (120K x 8 + 256B) FLASH 113-BGA Microstar Junior (7x7)
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5.0 / 5.0
- (314 Ratings)
MSP430F2419TZQWR
Product Overview
1348837
DiGi Electronics Part Number
MSP430F2419TZQWR-DGManufacturer
Texas Instruments
MSP430F2419TZQWR
Description
IC MCU 16BIT 120KB FLASH 113BGAInventory
3853 Pcs New Original In Stock
MSP430 CPU16 MSP430F2xx Microcontroller IC 16-Bit 16MHz 120KB (120K x 8 + 256B) FLASH 113-BGA Microstar Junior (7x7)
Quantity
Minimum 1
Minimum 1
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MSP430F2419TZQWR Technical Specifications
Category
Embedded, Microcontrollers
Packaging
-
Series
MSP430F2xx
Product Status
Obsolete
DiGi-Electronics Programmable
Not Verified
Core Processor
MSP430 CPU16
Core Size
16-Bit
Speed
16MHz
Connectivity
I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O
64
Program Memory Size
120KB (120K x 8 + 256B)
Program Memory Type
FLASH
EEPROM Size
-
RAM Size
4K x 8
Voltage - Supply (Vcc/Vdd)
1.8V ~ 3.6V
Data Converters
A/D 8x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 105°C (TA)
Mounting Type
Surface Mount
Supplier Device Package
113-BGA Microstar Junior (7x7)
Package / Case
113-VFBGA
Base Product Number
MSP430F2419
Datasheet & Documents
Manuals
MSP430x2xx User Guide
Manufacturer Product Page
MSP430F2419TZQWR Specifications
HTML Datasheet
MSP430F2419TZQWR-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8542.31.0001
Additional Information
Other Names
296-24712-2
296-24712-1
-MSP430F2419TZQWR-NDR
MSP430F2419TZQWR-DG
296-24712-6
-296-24712-1-DG
Standard Package
2,500
Reviews
5.0/5.0-(Show up to 5 Ratings)
de desembre 02, 2025
發貨速度非常迅速，收到商品時包裝完整，沒有任何損壞的跡象！
de desembre 02, 2025
Leurs délais de livraison courts montrent leur efficacité logistique.
de desembre 02, 2025
Leur service de livraison est toujours ponctuel, ce qui facilite grandement la planification de mes travaux.
de desembre 02, 2025
Customer support is attentive, friendly, and highly effective.
de desembre 02, 2025
The consistent quality of their delivery service reflects their high standards.
de desembre 02, 2025
High-quality products at a price point that is hard to beat, I will shop here again.
de desembre 02, 2025
Quick delivery and super secure packaging—very satisfied.
de desembre 02, 2025
Their follow-up emails are thoughtful and provide useful information about care and support.
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Frequently Asked Questions (FAQ)
What are the key design-in risks when using the MSP430F2419TZQWR in a new product given its obsolete status, and how can I mitigate supply chain issues?
Using the MSP430F2419TZQWR in new designs carries significant supply chain risk due to its 'Obsolete' status from Texas Instruments. While 3,799 units are currently available as New Original stock, long-term availability is not guaranteed. For production designs, this increases risk of future shortages and reliance on secondary distributors. To mitigate: (1) Secure lifetime buys now from authorized sources, (2) Evaluate migration to active-pin-compatible alternatives like the MSP430F2418 or the newer MSP430F5xx series, and (3) Implement design flexibility (e.g., common footprint or software abstraction) to ease future MCU swaps. Consider this only for low-volume, short-lifecycle, or legacy-replacement applications where redesign cost outweighs component risk.
How does the 113-BGA Microstar Junior package of the MSP430F2419TZQWR impact PCB design and thermal management in compact embedded systems?
The 113-BGA Microstar Junior (7x7mm) package of the MSP430F2419TZQWR requires precise PCB layout practices to ensure reliability. Key considerations include: (1) Strict adherence to TI’s recommended land pattern and solder reflow profile due to fine-pitch balls, (2) inclusion of thermal vias under the exposed thermal pad to improve heat dissipation—especially important if operating near 105°C, and (3) managing signal integrity for high-speed SPI/UART lines with proper trace impedance control. Avoid hand-soldering; use automated assembly with X-ray inspection for solder joint quality. Plan for MSL 3 sensitivity—bake boards if exposed beyond 168 hours at ambient conditions.
Can the MSP430F2419TZQWR replace the MSP430F2274 in an existing design requiring more flash and I/O, and what integration trade-offs should be considered?
Yes, the MSP430F2419TZQWR is a viable upgrade from the MSP430F2274 when more memory (120KB vs. 16KB flash) and I/O (64 vs. 16) are needed. However, trade-offs include: (1) Package change from 32-QFN/TQFP to 113-BGA, requiring PCB redesign, (2) higher pin count increases routing complexity and may impact layout density, and (3) identical 16MHz core but enhanced peripherals (e.g., additional USART, IrDA) require updated firmware initialization. Verify power sequencing and reset behavior compatibility. Use common voltage rails (1.8V–3.6V) to maintain analog section compatibility. Retain brown-out and WDT configurations for continued reliability.
What are the reliability implications of operating the MSP430F2419TZQWR at the upper end of its 105°C temperature range in industrial motor control applications?
Operating the MSP430F2419TZQWR at 105°C ambient increases risk of long-term degradation, especially under sustained digital switching. While qualified for -40°C to +105°C (TA), ensure junction temperature (TJ) stays below 125°C. Mitigate risks by: (1) minimizing active clock speeds and enabling low-power modes (LPM3/4) when idle, (2) derating I/O current per pin to avoid localized heating, (3) using adequate ground planes and thermal vias for heat dissipation, and (4) validating actual TJ via thermal monitoring if external temperature sensors are used. Avoid continuous high-speed SPI or PWM loads at max temperature—simulate thermal performance under worst-case environmental conditions.
How does the integrated 8-channel 12-bit ADC in the MSP430F2419TZQWR perform under noisy power conditions, and what PCB layout practices improve measurement accuracy?
The MSP430F2419TZQWR’s integrated 12-bit ADC can suffer from reduced SNR and INL errors under noisy supply conditions, especially when digital activity couples into analog sections. To improve accuracy: (1) Use a separate LDO for AVCC with pi-filtering (10Ω resistor + 1µF ceramic + 10nF), (2) route analog signals away from digital traces and place ADC input RC filters (10kΩ + 10nF) close to MCU pins, (3) tie VREF+ to a clean AREF pin (or use internal 2.5V reference with external buffering), and (4) sample ADC during CPU idle periods to minimize crosstalk. Avoid sharing ground planes between high-current drivers and analog sensors—use split planes tied at single point near AGND.
Quality Assurance (QC)
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MSP430F2419TZQWR CAD Models
Texas Instruments MSP430F2419TZQWR PCB symbols & footprints
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