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MSP430F2370IYFFR
Texas Instruments
IC MCU 16BIT 32KB FLASH 49DSBGA
32661 Pcs New Original In Stock
MSP430 CPU16 MSP430F2xx Microcontroller IC 16-Bit 16MHz 32KB (32K x 8 + 256B) FLASH 49-DSBGA (2.8x2.8)
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Minimum 1
5.0 / 5.0
- (46 Ratings)
MSP430F2370IYFFR
Product Overview
1384628
DiGi Electronics Part Number
MSP430F2370IYFFR-DGManufacturer
Texas Instruments
MSP430F2370IYFFR
Description
IC MCU 16BIT 32KB FLASH 49DSBGAInventory
32661 Pcs New Original In Stock
MSP430 CPU16 MSP430F2xx Microcontroller IC 16-Bit 16MHz 32KB (32K x 8 + 256B) FLASH 49-DSBGA (2.8x2.8)
Quantity
Minimum 1
Minimum 1
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MSP430F2370IYFFR Technical Specifications
Category
Embedded, Microcontrollers
Packaging
-
Series
MSP430F2xx
Product Status
Obsolete
DiGi-Electronics Programmable
Not Verified
Core Processor
MSP430 CPU16
Core Size
16-Bit
Speed
16MHz
Connectivity
I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O
32
Program Memory Size
32KB (32K x 8 + 256B)
Program Memory Type
FLASH
EEPROM Size
-
RAM Size
2K x 8
Voltage - Supply (Vcc/Vdd)
1.8V ~ 3.6V
Data Converters
Slope A/D
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C (TA)
Mounting Type
Surface Mount
Supplier Device Package
49-DSBGA (2.8x2.8)
Package / Case
49-UFBGA, DSBGA
Base Product Number
MSP430F2370
Datasheet & Documents
Manuals
MSP430x2xx User Guide
Manufacturer Product Page
MSP430F2370IYFFR Specifications
HTML Datasheet
MSP430F2370IYFFR-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8542.31.0001
Additional Information
Other Names
TEXTISMSP430F2370IYFFR
296-24336-2-NDR
2156-MSP430F2370IYFFR-TITR
296-24336-2
-296-24336-1-NDR
296-24336-1
296-24336-1-NDR
296-24336-6-NDR
-MSP430F2370IYFFR-NDR
-296-24336-1-DG
296-24336-6
Standard Package
3,000
Reviews
5.0/5.0-(Show up to 5 Ratings)
de desembre 02, 2025
Leurs prix sont très accessibles et leur packaging éco-responsable est un vrai plus.
de desembre 02, 2025
The quick shipping process was remarkable, and the packaging showed environmental care.
de desembre 02, 2025
Orders arrive sooner than expected, showcasing their efficient logistics.
de desembre 02, 2025
Their after-sales response time is among the best I've experienced in electronic companies.
de desembre 02, 2025
DiGi Electronics shows leadership in sustainable packaging solutions.
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Frequently Asked Questions (FAQ)
Can the MSP430F2370IYFFR be used in new designs given its obsolete status, and what are the long-term risks for production scalability?
The MSP430F2370IYFFR is marked as obsolete by Texas Instruments, which means it's not recommended for new designs due to supply chain risks and potential unavailability in the future. While current stock is available (32,600 units), long-term production scalability is a concern. Designers should evaluate migration to active-pin-compatible alternatives like the MSP430FR2355 or MSP430G2955, which offer similar I/O count and peripherals with improved availability and enhanced low-power performance. Use the MSP430F2370IYFFR only for replacement or legacy system repairs.
How does the internal slope A/D converter in the MSP430F2370IYFFR compare to SAR ADCs in competing microcontrollers like the STM32L412KB, and what are the design implications?
The MSP430F2370IYFFR uses an on-chip slope A/D converter, which is simpler and lower power but offers lower resolution and slower conversion rates compared to the 12-bit SAR ADCs in competing devices like the STM32L412KB. This limits its suitability for high-precision sensor interfaces or fast sampling applications. Designers should account for calibration complexity and reduced accuracy when using the slope ADC. For applications requiring better analog performance, consider upgrading to an MSP430 variant with a built-in 10-bit or 12-bit SAR ADC, such as the MSP430F2013, or adding an external ADC with SPI interface.
What are the critical PCB layout considerations when integrating the 49-DSBGA package of the MSP430F2370IYFFR, especially for thermal and signal integrity in high-reliability environments?
The 49-DSBGA (2.8x2.8mm) package of the MSP430F2370IYFFR requires careful PCB design due to its fine pitch and low-profile construction. Key considerations include using a thermal pad connected via array of apertures to internal ground plane for heat dissipation, maintaining short trace lengths for high-impedance analog inputs, and ensuring strict impedance control for communication lines like UART and SPI. Avoid placing vias in bond pads, and follow TI’s recommended land pattern (YFF0049D) to prevent solder joint cracks under thermal cycling. IPC Class 3 standards are advised for high-reliability applications.
Is the MSP430F2370IYFFR suitable as a drop-in replacement for the MSP430F2274 in existing designs, and what are the compatibility risks?
While the MSP430F2370IYFFR shares the same 16MHz CPU16 core and similar peripheral set with the MSP430F2274, it is not a direct drop-in replacement due to differences in package (49-DSBGA vs 40-QFN) and I/O mapping. Additionally, the F2370 has 32KB Flash versus 32KB in F2274 but differs in internal peripheral addressing and pinmux options. Migrating requires PCB redesign and firmware validation, especially for I/O and timer configurations. Verify pin compatibility and revalidate all timing-critical code before substitution.
How do brown-out detection and low supply voltage (1.8V–3.6V) impact system reliability of the MSP430F2370IYFFR in battery-powered applications, and what mitigation strategies should be applied?
The MSP430F2370IYFFR includes integrated brown-out detection and POR, which help maintain reliability in low-voltage battery applications by preventing erratic behavior during power-up or deep discharge. However, operating near the 1.8V lower limit increases flash access instability and oscillator jitter. To mitigate risks, use a low-quiescent LDO regulator (e.g., TPS78233) for stable supply, implement software-based voltage monitoring via the slope ADC, and introduce firmware safeguards such as forced sleep modes and data retention routines. Avoid fast wake-ups at minimum Vcc to prevent CPU lockup.
Quality Assurance (QC)
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MSP430F2370IYFFR CAD Models
Texas Instruments MSP430F2370IYFFR PCB symbols & footprints
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