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MSP430F169IPM
Texas Instruments
IC MCU 16BIT 60KB FLASH 64LQFP
2039 Pcs New Original In Stock
MSP430 CPU16 MSP430x1xx Microcontroller IC 16-Bit 8MHz 60KB (60K x 8 + 256B) FLASH 64-LQFP (10x10)
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5.0 / 5.0
- (276 Ratings)
MSP430F169IPM
Product Overview
1350320
DiGi Electronics Part Number
MSP430F169IPM-DGManufacturer
Texas Instruments
MSP430F169IPM
Description
IC MCU 16BIT 60KB FLASH 64LQFPInventory
2039 Pcs New Original In Stock
MSP430 CPU16 MSP430x1xx Microcontroller IC 16-Bit 8MHz 60KB (60K x 8 + 256B) FLASH 64-LQFP (10x10)
Quantity
Minimum 1
Minimum 1
Purchase and inquiry
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MSP430F169IPM Technical Specifications
Category
Embedded, Microcontrollers
Packaging
Tray
Series
MSP430x1xx
Product Status
Active
DiGi-Electronics Programmable
Verified
Core Processor
MSP430 CPU16
Core Size
16-Bit
Speed
8MHz
Connectivity
I2C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O
48
Program Memory Size
60KB (60K x 8 + 256B)
Program Memory Type
FLASH
EEPROM Size
-
RAM Size
2K x 8
Voltage - Supply (Vcc/Vdd)
1.8V ~ 3.6V
Data Converters
A/D 8x12b; D/A 2x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C (TA)
Mounting Type
Surface Mount
Supplier Device Package
64-LQFP (10x10)
Package / Case
64-LQFP
Base Product Number
MSP430F169
Datasheet & Documents
Manufacturer Product Page
MSP430F169IPM Specifications
HTML Datasheet
MSP430F169IPM-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8542.31.0001
Additional Information
Other Names
296-16842-NDR
TEXTISMSP430F169IPM
296-16842
-296-16842-DG
-MSP430F169IPM-NDR
-296-16842
2156-MSP430F169IPM
Standard Package
160
Reviews
5.0/5.0-(Show up to 5 Ratings)
de desembre 02, 2025
분명한 안내와 빠른 배송 덕분에 반복 구매를 하고 싶어졌어요.
de desembre 02, 2025
물류과정에서 발생하는 문제도 신속하게 해결해줘서 정말 믿음이 갑니다. 편리하고 안전하게 제품을 받을 수 있어 좋아요.
de desembre 02, 2025
J'apprécie la rapidité de leur livraison et leur soutien après-vente.
de desembre 02, 2025
いつも迅速かつ正確に商品を届けてくれるので、非常に頼りにしています。
de desembre 02, 2025
注文から発送までスムーズで、すぐに必要な部品を受け取ることができました。サポートも信頼できます。
de desembre 02, 2025
The product arrived faster than expected, securely packed.
de desembre 02, 2025
DiGi Electronics demonstrates a strong commitment to customer satisfaction through excellent inventory management and after-sales service.
de desembre 02, 2025
DiGi Electronics demonstrates a commendable level of efficiency in both shipping and customer support, which keeps me coming back.
de desembre 02, 2025
Fast shipping and attentive support define their service quality.
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Frequently Asked Questions (FAQ)
What are the key design risks when replacing an MSP430F169IPM with a newer MSP430FR series microcontroller like the MSP430FR5994 in a low-power sensor node application?
Replacing the MSP430F169IPM with an FRAM-based part like the MSP430FR5994 introduces several design considerations: while FRAM offers faster write speeds and higher endurance, it requires careful re-evaluation of power supply sequencing and brown-out reset thresholds due to different voltage ramp requirements. The MSP430F169IPM operates down to 1.8V, but the FR5994 has a minimum VCC of 1.8V with tighter noise margins—requiring improved decoupling. Additionally, code porting may break timing assumptions, especially for bit-banged I2C or SPI routines that relied on the F169’s 8MHz internal oscillator behavior. Always validate sleep current and wake-up latency under real-world conditions, as FRAM wake-up profiles differ significantly from flash-based devices like the MSP430F169IPM.
Can the MSP430F169IPM safely drive 5V-tolerant logic inputs directly from its GPIO pins without level shifting in a mixed-voltage industrial control system?
No, the MSP430F169IPM is not 5V-tolerant on its I/O pins. Its absolute maximum input voltage is VCC + 0.3V, meaning applying 5V to any pin when VCC is 3.3V risks latch-up or long-term degradation. In industrial environments where 5V TTL/CMOS signals are common, you must use a level shifter (e.g., TXB0108) or voltage divider network. Relying on internal protection diodes is unsafe and violates TI’s recommended operating conditions. This constraint is critical during field firmware updates or when interfacing with legacy PLCs—failure to isolate voltages can lead to silent data corruption or premature MCU failure in the MSP430F169IPM.
How does the limited 2KB RAM of the MSP430F169IPM impact real-time data logging applications using its 12-bit ADC, and what architectural workarounds exist?
The MSP430F169IPM’s 2KB RAM severely constrains buffer depth for high-sample-rate ADC logging. At 12-bit resolution, even a modest 500-sample circular buffer consumes 1KB (assuming 16-bit storage), leaving minimal space for stack, variables, and communication buffers. For sustained logging, implement segmented buffering with immediate offload via DMA to external SPI flash (e.g., Winbond W25Q80DV) or compress samples using delta encoding. Alternatively, reduce effective sampling rate or resolution if signal bandwidth allows. Without such mitigations, stack overflow or heap fragmentation can cause silent crashes—especially problematic in unattended deployments where the MSP430F169IPM must maintain deterministic response.
Is the internal oscillator of the MSP430F169IPM sufficiently accurate for UART communication at 115200 bps without an external crystal, and what are the failure risks in production units?
The MSP430F169IPM’s internal ±2% calibrated DCO typically supports UART up to 57600 bps reliably, but 115200 bps pushes the limits. Over temperature (-40°C to 85°C) and voltage (1.8V–3.6V) extremes, DCO drift can exceed ±3%, causing framing errors. In production, this leads to intermittent comms failures that are hard to reproduce in lab conditions. For robust 115200 bps operation, use an external 32.768kHz crystal with Timer_A-based baud rate generation or switch to a part with a factory-trimmed high-frequency oscillator. If cost constraints prevent an external crystal, implement software-based baud rate detection and adaptive timing—but validate across full environmental specs to avoid field returns of the MSP430F169IPM.
What reliability concerns arise from operating the MSP430F169IPM near its 85°C maximum ambient temperature in enclosed automotive under-hood applications, and how can thermal derating be applied?
Operating the MSP430F169IPM continuously at 85°C ambient—especially in poorly ventilated enclosures—reduces flash endurance and increases leakage current, accelerating aging. TI specifies 10k write/erase cycles for flash at 25°C, but this degrades significantly above 70°C. Additionally, the LQFP package’s thermal resistance (θJA ≈ 45°C/W) means junction temperature can exceed 100°C with just 0.3W dissipation, risking thermal runaway. Mitigate by derating clock frequency below 8MHz, disabling unused peripherals, and adding a thermal pad or heatsink. Always perform HALT (Highly Accelerated Life Testing) validation if the MSP430F169IPM is deployed in mission-critical automotive systems—field data shows increased early-life failures when operated beyond 80°C without thermal management.
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DiGi ensures the quality and authenticity of every electronic component through professional inspections and batch sampling, guaranteeing reliable sourcing, stable performance, and compliance with technical specifications, helping customers reduce supply chain risks and confidently use components in production.
MSP430F169IPM CAD Models
Texas Instruments MSP430F169IPM PCB symbols & footprints
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