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MSP430F147IPM
Texas Instruments
IC MCU 16BIT 32KB FLASH 64LQFP
2073 Pcs New Original In Stock
MSP430 CPU16 MSP430x1xx Microcontroller IC 16-Bit 8MHz 32KB (32K x 8 + 256B) FLASH 64-LQFP (10x10)
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5.0 / 5.0
- (235 Ratings)
MSP430F147IPM
Product Overview
1301861
DiGi Electronics Part Number
MSP430F147IPM-DGManufacturer
Texas Instruments
MSP430F147IPM
Description
IC MCU 16BIT 32KB FLASH 64LQFPInventory
2073 Pcs New Original In Stock
MSP430 CPU16 MSP430x1xx Microcontroller IC 16-Bit 8MHz 32KB (32K x 8 + 256B) FLASH 64-LQFP (10x10)
Quantity
Minimum 1
Minimum 1
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MSP430F147IPM Technical Specifications
Category
Embedded, Microcontrollers
Packaging
Tray
Series
MSP430x1xx
Product Status
Active
DiGi-Electronics Programmable
Verified
Core Processor
MSP430 CPU16
Core Size
16-Bit
Speed
8MHz
Connectivity
SPI, UART/USART
Peripherals
POR, PWM, WDT
Number of I/O
48
Program Memory Size
32KB (32K x 8 + 256B)
Program Memory Type
FLASH
EEPROM Size
-
RAM Size
1K x 8
Voltage - Supply (Vcc/Vdd)
1.8V ~ 3.6V
Data Converters
A/D 8x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C (TA)
Mounting Type
Surface Mount
Supplier Device Package
64-LQFP (10x10)
Package / Case
64-LQFP
Base Product Number
MSP430F147
Datasheet & Documents
Manufacturer Product Page
MSP430F147IPM Specifications
HTML Datasheet
MSP430F147IPM-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8542.31.0001
Additional Information
Other Names
-MSP430A002IPM-NDR
2156-MSP430F147IPM
296-9613
296-9613-5
TEXTISMSP430F147IPM
-296-9613
296-9613-5-DG
-296-9613-DG
-MSP430A006IPW
-MSP430A025IPM-NDR
-MSP430A025IPM
296-9613-NDR
-MSP430A002IPM
-MSP430F147IPM-NDR
Standard Package
160
Reviews
5.0/5.0-(Show up to 5 Ratings)
de desembre 02, 2025
가격도 착하고 환경도 생각하는 모습이 너무 좋아요.
de desembre 02, 2025
Leurs employés sont toujours disponibles pour clarifier mes doutes après mon achat.
de desembre 02, 2025
DiGi Electronics’s staff demonstrates professionalism and urgency in addressing post-purchase questions.
de desembre 02, 2025
I trust their brand for reliable, high-quality electronics backed by excellent support.
de desembre 02, 2025
Their transparent pricing system makes purchasing decisions much easier.
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Frequently Asked Questions (FAQ)
What are the critical power supply design considerations when replacing an older 5V microcontroller with the MSP430F147IPM in a legacy industrial control system?
When replacing a 5V microcontroller with the MSP430F147IPM, the primary risk is voltage incompatibility—the MSP430F147IPM operates only between 1.8V and 3.6V. You must ensure all connected peripherals (sensors, communication ICs, etc.) are also 3.3V-tolerant or use level shifters on I/O lines. Additionally, verify that the existing power rail can be stepped down cleanly to 3.3V with sufficient transient response, as brownouts below 1.8V can trigger unintended resets. Always include a low-ESR decoupling capacitor (100nF) near each VCC pin and consider adding a supervisor IC for robust POR behavior, especially in noisy environments.
Can the MSP430F147IPM safely drive standard TTL/CMOS logic inputs directly from its GPIO pins without level translation?
The MSP430F147IPM GPIOs are not 5V-tolerant and output a maximum of VDD (≤3.6V), which may be insufficient to reliably meet the VIH (input high voltage) requirements of some 5V TTL logic families (e.g., 74LS series requires ≥2.0V but marginal at 3.3V under load). For reliable interfacing, use a dedicated bidirectional level shifter (e.g., TXB0108) or ensure downstream devices specify 3.3V-compatible inputs. Driving CMOS inputs (like 74HC series) is generally safe if VCC of the target device is ≤3.6V. Never connect the MSP430F147IPM directly to 5V inputs—this risks latch-up or long-term degradation.
How does the internal oscillator of the MSP430F147IPM impact timing accuracy in precision sensor data acquisition applications, and when should I consider an external crystal?
The MSP430F147IPM’s internal oscillator has a typical accuracy of ±2% over voltage and temperature (worse over full -40°C to 85°C range), which may cause sampling jitter or UART baud rate errors in precision applications like thermocouple readout or synchronous sensor networks. If your design requires tighter timing (e.g., <±0.5%), use an external 32.768kHz watch crystal on XIN/XOUT for real-time clock functions or a high-frequency crystal (e.g., 8MHz) for CPU timing. Note that enabling the external oscillator increases startup time and power slightly—weigh this against your system’s timing budget and low-power requirements.
Is the MSP430F147IPM a drop-in replacement for the Microchip PIC18F4520 in a battery-powered data logger, and what firmware changes are typically needed?
The MSP430F147IPM is not a mechanical or electrical drop-in for the PIC18F4520 due to different pinouts, voltage ranges (PIC runs at 2.0–5.5V vs. MSP430’s 1.8–3.6V), and peripheral architectures. However, it offers superior ultra-low-power performance (µA-range sleep currents), making it attractive for battery loggers. Firmware must be rewritten to accommodate the MSP430’s CPU16 instruction set, register-based peripheral control (vs. PIC’s memory-mapped approach), and different ADC/SPI/UART configurations. Also, re-evaluate sleep mode strategies—the MSP430F147IPM’s LPM3/LPM4 modes can drastically extend battery life but require careful interrupt and clock management.
What reliability risks should I consider when using the MSP430F147IPM in an automotive under-hood application near its maximum operating temperature of 85°C?
Although the MSP430F147IPM is rated for -40°C to 85°C ambient, sustained operation near 85°C increases risk of flash memory degradation, elevated leakage current, and reduced MTBF. In under-hood environments, localized heating from nearby components (e.g., regulators, motors) can push the junction temperature beyond safe limits—always perform thermal modeling with worst-case power dissipation. TI recommends derating flash write/erase cycles at high temps; minimize frequent firmware updates in-field. Additionally, ensure PCB layout minimizes thermal resistance (use thermal vias under the LQFP package) and consider conformal coating to mitigate moisture-induced corrosion, given the MSL3 rating requires baking if exposed to ambient >30°C/60% RH before reflow.
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MSP430F147IPM CAD Models
Texas Instruments MSP430F147IPM PCB symbols & footprints
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