Counterfeit and defect prevention
Visual and packaging inspection
Electrical performance verification
Service Email:
[email protected]
>
MSP430F147IPAG
Texas Instruments
IC MCU 16BIT 32KB FLASH 64TQFP
34954 Pcs New Original In Stock
MSP430 CPU16 MSP430x1xx Microcontroller IC 16-Bit 8MHz 32KB (32K x 8 + 256B) FLASH 64-TQFP (10x10)
Request Quote
(Ships tomorrow)
*Quantity
Minimum 1
Minimum 1
5.0 / 5.0
- (346 Ratings)
MSP430F147IPAG
Product Overview
1370690
DiGi Electronics Part Number
MSP430F147IPAG-DGManufacturer
Texas Instruments
MSP430F147IPAG
Description
IC MCU 16BIT 32KB FLASH 64TQFPInventory
34954 Pcs New Original In Stock
MSP430 CPU16 MSP430x1xx Microcontroller IC 16-Bit 8MHz 32KB (32K x 8 + 256B) FLASH 64-TQFP (10x10)
Quantity
Minimum 1
Minimum 1
Purchase and inquiry
Warranty & Returns
How to Order
Shipping & Delivery
Quality Assurance
365 - Day Quality Guarantee - Every part fully backed.
90 - Day Refund or Exchange - Defective parts? No hassle.
Limited Stock, Order Now - Get reliable parts without worry.
Global Shipping & Secure Packaging
Worldwide Delivery in 3-5 Business Days
100% ESD Anti-Static Packaging
Real-Time Tracking for Every Order
Secure & Flexible Payment
Credit Card, VISA, MasterCard, PayPal, Western Union, Telegraphic Transfer(T/T) and more
All payments encrypted for security
MSP430F147IPAG Technical Specifications
Category
Embedded, Microcontrollers
Packaging
Tray
Series
MSP430x1xx
Product Status
Active
DiGi-Electronics Programmable
Verified
Core Processor
MSP430 CPU16
Core Size
16-Bit
Speed
8MHz
Connectivity
SPI, UART/USART
Peripherals
POR, PWM, WDT
Number of I/O
48
Program Memory Size
32KB (32K x 8 + 256B)
Program Memory Type
FLASH
EEPROM Size
-
RAM Size
1K x 8
Voltage - Supply (Vcc/Vdd)
1.8V ~ 3.6V
Data Converters
A/D 8x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C (TA)
Mounting Type
Surface Mount
Supplier Device Package
64-TQFP (10x10)
Package / Case
64-TQFP
Base Product Number
MSP430F147
Datasheet & Documents
Manufacturer Product Page
MSP430F147IPAG Specifications
HTML Datasheet
MSP430F147IPAG-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
4 (72 Hours)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8542.31.0001
Additional Information
Other Names
296-15855
2156-MSP430F147IPAG
TEXTISMSP430F147IPAG
296-15893
-MSP430F147IPAG-NDR
296-15855-DG
296-15893-NDR
-296-15893-DG
-296-15893
Standard Package
160
Reviews
5.0/5.0-(Show up to 5 Ratings)
de desembre 02, 2025
長く使っても変わらない対応の良さに感謝しています。
de desembre 02, 2025
Their support staff is knowledgeable and attentive, ensuring my issues are resolved promptly.
de desembre 02, 2025
Tracking information was accurate and updated frequently.
de desembre 02, 2025
Fast delivery and very secure packaging, which I really appreciated.
de desembre 02, 2025
Fast shipping ensures I can meet my project deadlines without delays.
de desembre 02, 2025
Order processed quickly and packaged securely for safe transit.
Publish Evalution
Evalution Message
Please enter your review message.
Please post honest comments and do not post ilegal comments.
Frequently Asked Questions (FAQ)
What are the key design-in risks when using the MSP430F147IPAG in a low-power sensor node with intermittent SPI communication?
When integrating the MSP430F147IPAG into a low-power sensor node, a key risk is improper handling of SPI peripheral wake-up timing from low-power modes (e.g., LPM3 or LPM4). The internal oscillator startup delay after wake-up can cause data corruption if SPI transactions begin too soon. To mitigate this, use the WDT in interval timer mode to trigger wake-up and add a software delay before enabling SPI. Additionally, ensure GPIOs used for SPI slave select are configured with internal pull-ups to prevent floating inputs during power-down. Use the 12-bit ADC with internal reference for battery monitoring and scale clock speed based on workload to maintain ultra-low current consumption.
Can the MSP430F147IPAG replace an STM32F103C8T6 in an existing motor control application using PWM and UART, and what compatibility issues should be expected?
Replacing an STM32F103C8T6 with the MSP430F147IPAG in motor control applications involves significant trade-offs. While the MSP430F147IPAG supports PWM and UART, its 8MHz clock speed and 16-bit MSP430 CPU offer lower computational throughput than the STM32’s 72MHz Cortex-M3, limiting complex control algorithms. The MSP430F147IPAG provides only basic timer-based PWM (no dead-time control or complementary outputs), increasing risk in H-bridge drive scenarios. UART baud rate stability at low Vcc (1.8V) should be verified due to internal oscillator drift. If motor control is simple (e.g., on/off or basic speed control), the MSP430F147IPAG can work with careful PWM frequency tuning and external buffer ICs for higher-current gate drives.
How does the internal 12-bit ADC performance of the MSP430F147IPAG degrade under noisy power conditions, and what PCB layout practices prevent inaccurate readings?
The MSP430F147IPAG’s internal 12-bit ADC is sensitive to supply noise, especially when operating near the 1.8V minimum Vcc or in mixed-signal layouts. Without proper decoupling, ADC code spread can exceed ±4 LSB due to Vcc ripple modulating the reference. To maintain accuracy, place a 100nF X7R ceramic capacitor directly at the AVCC pin and use a separate analog ground plane tied at one point to digital ground. Avoid routing digital signals under the device. Use the internal 1.5V/2.5V reference instead of Vcc for critical measurements, and sample at S&H intervals ≥4μs to allow settling. Enable the internal temperature sensor only when needed, as it loads the reference.
What are the reliability concerns when using the MSP430F147IPAG in an industrial environment with extended temperature cycling from -40°C to 85°C?
Operating the MSP430F147IPAG in industrial environments demands attention to thermal cycling fatigue and long-term moisture ingress due to its MSL-4 rating (72-hour floor life). Repeated thermal expansion can crack solder joints, especially on the 64-TQFP package, if PCB pad design doesn’t follow IPC-7351 standards. Use no-clean flux with low halogen content and conformal coating to reduce electrochemical migration risk. Validate operation at cold extremes: the internal oscillator may require calibration in field firmware to maintain UART timing at -40°C. Avoid hot-plugging power; the lack of built-in reverse-voltage protection risks latch-up on I/Os even within the 1.8–3.6V range.
What are the consequences of exceeding 3.6V on the Vcc pin of the MSP430F147IPAG during battery overvoltage events, and how can system designers protect against it?
Exceeding 3.6V on the MSP430F147IPAG’s Vcc pin—even briefly—can trigger parasitic SCR activation, causing destructive latch-up, as absolute maximum ratings are not guaranteed for transient overvoltage. In battery-powered systems (e.g., 3x AA or Li-ion), transient surges from hot insertion or charger coupling can exceed safe limits. To protect against this, include a low-quiescent-current LDO (e.g., TPS7A02) with overvoltage lockout, or a zener clamp (3.6V, 500mW) on Vcc with a series resistor. Avoid using Zener diodes with high capacitance that could load the internal oscillator. Monitor battery voltage via the ADC’s internal divider before enabling main load to prevent cascade failure.
Quality Assurance (QC)
DiGi ensures the quality and authenticity of every electronic component through professional inspections and batch sampling, guaranteeing reliable sourcing, stable performance, and compliance with technical specifications, helping customers reduce supply chain risks and confidently use components in production.
MSP430F147IPAG CAD Models
Texas Instruments MSP430F147IPAG PCB symbols & footprints
productDetail
