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MF10CCWM
Texas Instruments
IC FILTER 200KHZ SWITCH 20SOIC
1411 Pcs New Original In Stock
Universal Switched Capacitor Filter IC Universal Switched Capacitor 4th Order 200kHz 20-SOIC
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MF10CCWM
Product Overview
1324663
DiGi Electronics Part Number
MF10CCWM-DGManufacturer
Texas Instruments
MF10CCWM
Description
IC FILTER 200KHZ SWITCH 20SOICInventory
1411 Pcs New Original In Stock
Universal Switched Capacitor Filter IC Universal Switched Capacitor 4th Order 200kHz 20-SOIC
Quantity
Minimum 1
Minimum 1
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MF10CCWM Technical Specifications
Category
Interface, Filters - Active
Packaging
-
Series
-
Product Status
Obsolete
Filter Type
Universal Switched Capacitor
Frequency - Cutoff or Center
200kHz
Number of Filters
2
Filter Order
4th
Voltage - Supply
±9V ~ 14V
Mounting Type
Surface Mount
Package / Case
20-SOIC (0.295", 7.50mm Width)
Supplier Device Package
20-SOIC
Base Product Number
MF10
Datasheet & Documents
HTML Datasheet
MF10CCWM-DG
Environmental & Export Classification
RoHS Status
RoHS non-compliant
Moisture Sensitivity Level (MSL)
2A (4 Weeks)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8542.39.0001
Additional Information
Standard Package
36
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5.0/5.0-(Show up to 5 Ratings)
de desembre 02, 2025
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Frequently Asked Questions (FAQ)
When designing with the obsolete MF10CCWM, what are the critical power supply sequencing risks for the ±9V to ±14V rails to prevent latch-up or damage?
The MF10CCWM uses a switched-capacitor architecture that is sensitive to asymmetric power-up. If the positive supply (V+) ramps significantly faster than the negative supply (V-), internal parasitic SCR structures can trigger latch-up, potentially causing excessive current draw or device destruction. To mitigate this, implement a supply sequencing circuit that ensures V- reaches at least -5V before V+ exceeds +5V, or use a dual-tracking regulator (e.g., TPS7A39) to maintain balanced rails during startup. Add 10Ω resistors in series with each supply line and place 0.1µF ceramic capacitors directly at the pins to suppress transients. If a single supply is mandatory, the device can operate from +12V with a virtual ground, but performance degradation in offset and dynamic range must be validated.
As a direct replacement for the MF10CCWM in a 200kHz anti-aliasing application, what are the hidden trade-offs when using a modern alternative like the LTC1064-3 or MAX274?
While the LTC1064-3 and MAX274 are common switched-capacitor filter replacements, they are not pin-compatible and introduce distinct design considerations. The MF10CCWM offers dual independent 4th-order filters with a 200kHz center frequency, but modern alternatives often integrate more poles or require external clock dividers. For the LTC1064-3, note that its clock-to-center-frequency ratio is fixed at 100:1 (vs. the MF10’s 50:1 or 100:1 selectable), which may force a higher clock frequency and increase switching noise coupling. The MAX274 requires external resistors to set filter characteristics, adding BOM complexity and sensitivity to resistor drift. If you must replace the MF10CCWM without board redesign, consider the MF10CCN (through-hole) or stockpile from authorized distributors, as no exact functional equivalent exists in the same 20-SOIC footprint with identical pinout and dual 4th-order flexibility.
In a high-accuracy sensor signal chain, how does the MF10CCWM’s clock feedthrough and aliasing bandwidth affect dynamic range when clocking it from a microcontroller PWM versus a dedicated crystal oscillator?
The MF10CCWM’s switched-capacitor architecture inherently transfers clock noise (typically at the clock frequency, fCLK) to the output, with feedthrough levels around 10-50mVpp depending on layout. Using a microcontroller PWM as the clock source introduces jitter and harmonic content that can degrade the signal-to-noise ratio (SNR) by 10-15dB compared to a clean crystal oscillator. Moreover, the filter’s aliasing bandwidth is determined by the clock frequency; if fCLK is imprecise, the cutoff frequency drifts proportionally. For high-dynamic-range applications (e.g., medical instrumentation), use a dedicated low-jitter oscillator (e.g., SiTime) with a separate ground plane, and add a post-filter RC stage (e.g., 1kΩ, 1nF) to attenuate clock feedthrough. Ensure the input signal bandwidth is limited to less than 0.4 × fCLK to avoid aliasing artifacts, as per the device’s sampling nature.
When replacing a failed MF10CCWM in a legacy ±12V design, what reliability pitfalls arise from using RoHS-compliant solder profiles on this non-RoHS device with MSL 2A rating?
The MF10CCWM is RoHS non-compliant (containing lead in terminals) and has an MSL rating of 2A (floor life of 4 weeks). If the replacement is performed with lead-free solder and reflow profiles exceeding 245°C peak, two risks emerge: first, the device’s internal die attach and wire bonds may degrade due to the higher thermal stress (lead-free reflow often peaks at 260°C), potentially causing latent reliability failures. Second, mixing lead-free solder with leaded device terminations can result in poor wetting and voiding under the 20-SOIC package, leading to intermittent connections over thermal cycling. Mitigation: use a Sn63Pb37 solder paste and limit peak reflow to 220°C max. If the assembly line is lead-free only, hand-solder with a temperature-controlled iron at 315°C for no more than 3 seconds per lead, and perform X-ray inspection for voiding. Ensure the device has not exceeded its 4-week floor life since dry-pack opening; otherwise, bake at 125°C for 24 hours prior to assembly.
In a low-distortion audio application using the MF10CCWM, how do I select the external clock frequency and configure the 50:1 vs. 100:1 clock-to-corner ratio to minimize total harmonic distortion plus noise (THD+N) below 0.05%?
To achieve THD+N below 0.05% with the MF10CCWM, set the clock-to-corner ratio to 100:1 by tying the 50/100 pin to V- (or logic low) to reduce the internal op-amp slew-rate demands. Operating at 100:1 raises the clock frequency relative to the filter corner, which pushes switching artifacts further out-of-band but increases power consumption by approximately 20%. For a 20kHz audio corner, set fCLK = 2MHz (100:1) and ensure the input signal amplitude does not exceed 2Vpp to stay within linear region. Clock jitter must be kept below 50ps RMS to prevent noise floor elevation; use a low-phase-noise crystal oscillator. Additionally, bypass the MF10CCWM’s power pins with a 10µF tantalum in parallel with 0.1µF ceramic, placed within 2mm of the pins. Finally, route the clock trace as a 50Ω microstrip and isolate it from analog input traces to prevent coupling, as clock feedthrough is the dominant distortion source at frequencies above 5kHz.
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MF10CCWM CAD Models
Texas Instruments MF10CCWM PCB symbols & footprints
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