LP5912-1.2DRVT >
LP5912-1.2DRVT
Texas Instruments
IC REG LINEAR 1.2V 500MA 6WSON
1370 Pcs New Original In Stock
Linear Voltage Regulator IC Positive Fixed 1 Output 500mA 6-WSON (2x2)
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LP5912-1.2DRVT Texas Instruments
5.0 / 5.0 - (62 Ratings)

LP5912-1.2DRVT

Product Overview

1346862

DiGi Electronics Part Number

LP5912-1.2DRVT-DG

Manufacturer

Texas Instruments
LP5912-1.2DRVT

Description

IC REG LINEAR 1.2V 500MA 6WSON

Inventory

1370 Pcs New Original In Stock
Linear Voltage Regulator IC Positive Fixed 1 Output 500mA 6-WSON (2x2)
Quantity
Minimum 1

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LP5912-1.2DRVT Technical Specifications

Category Power Management (PMIC), Voltage Regulators - Linear, Low Drop Out (LDO) Regulators

Manufacturer Texas Instruments

Packaging Cut Tape (CT) & Digi-Reel®

Series -

Product Status Active

Output Configuration Positive

Output Type Fixed

Number of Regulators 1

Voltage - Input (Max) 6.5V

Voltage - Output (Min/Fixed) 1.2V

Voltage - Output (Max) -

Voltage Dropout (Max) -

Current - Output 500mA

Current - Quiescent (Iq) 55 µA

Current - Supply (Max) 600 µA

PSRR 80dB ~ 40dB (100Hz ~ 100kHz)

Control Features Enable, Power Good, Soft Start

Protection Features Over Temperature, Reverse Polarity, Short Circuit

Operating Temperature -40°C ~ 125°C (TJ)

Mounting Type Surface Mount

Package / Case 6-WDFN Exposed Pad

Supplier Device Package 6-WSON (2x2)

Base Product Number LP5912

Datasheet & Documents

Manufacturer Product Page

LP5912-1.2DRVT Specifications

HTML Datasheet

LP5912-1.2DRVT-DG

Environmental & Export Classification

RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.39.0001

Additional Information

Other Names
296-46645-6
296-46645-2
296-46645-1
Standard Package
250

Alternative Parts

PART NUMBER
MANUFACTURER
QUANTITY AVAILABLE
DiGi PART NUMBER
UNIT PRICE
SUBSTITUTE TYPE
LP5912Q1.2DRVTQ1
Texas Instruments
6401
LP5912Q1.2DRVTQ1-DG
0.0687
Parametric Equivalent

Reviews

5.0/5.0-(Show up to 5 Ratings)
Joyf***ulse
de desembre 02, 2025
5.0
They demonstrated excellent professionalism and efficiency in handling my order.
Sunshi***adiance
de desembre 02, 2025
5.0
The attention to detail in their packaging shows a dedication to quality.
Skyl***Pulse
de desembre 02, 2025
5.0
The breadth of options at Di Digi Electronics keeps me coming back.
Blos***Trail
de desembre 02, 2025
5.0
DiGi Electronics’ shipping is consistently prompt and precise.
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Frequently Asked Questions (FAQ)

What are the key design-in considerations when using the LP5912-1.2DRVT in low-dropout linear regulator applications to avoid thermal shutdown under continuous load?

When designing with the LP5912-1.2DRVT, thermal performance is critical due to its 6-WSON (2x2) package with an exposed pad. To prevent thermal shutdown, ensure the PCB layout includes adequate copper vias and thermal planes connected to the exposed pad for heat dissipation. At maximum load (500mA) and higher input voltages (e.g., 5V), power dissipation can approach 1.9W, so calculate the junction-to-ambient thermal resistance (θJA) for your board configuration. Keep the junction temperature below 125°C by minimizing trace length, maximizing copper area, and potentially derating current in high ambient temperature environments. Always verify thermal performance under worst-case conditions during prototype testing.

How does the LP5912-1.2DRVT compare to the TPS7A20-1.2 in terms of PSRR and quiescent current for noise-sensitive applications like RF or sensor power rails?

The LP5912-1.2DRVT offers strong PSRR of 80dB at 100Hz, dropping to 40dB at 100kHz, making it suitable for moderate noise suppression, but the TPS7A20-1.2 provides superior PSRR (up to 70dB at 100kHz) and lower Iq (25µA vs. 55µA). If your design targets ultra-low power IoT sensors or RF front-ends sensitive to ripple, the TPS7A20-1.2 may be preferable despite higher cost. However, if cost efficiency and sufficient noise rejection in a compact 2x2mm footprint are priorities, the LP5912-1.2DRVT remains a robust choice—just add proper input/output ceramic filtering (e.g., 1µF each) to enhance high-frequency noise attenuation.

Can the LP5912-1.2DRVT reliably replace the MCP1702-1.2 in existing designs requiring 1.2V core supply for microcontrollers, and what are the integration risks?

While both the LP5912-1.2DRVT and MCP1702-1.2 provide 1.2V fixed output and ~500mA capability, the LP5912-1.2DRVT integrates advanced features like 'Power Good' and soft-start, which the MCP1702 lacks. This enables sequencing and inrush current control absent in the older Microchip part. However, pin compatibility isn't guaranteed—verify pinouts: the LP5912-1.2DRVT uses a 6-WSON with enable and PG pins requiring proper management. Leaving enable floating may disable the regulator; tie to VIN via pull-up if unused. Also, ensure the layout accommodates the exposed thermal pad correctly. Signal integrity improves with the LP5912-1.2DRVT, but proper enable logic and PG monitoring must be added to legacy designs.

What PCB layout practices minimize instability risks when integrating the LP5912-1.2DRVT in space-constrained wearable devices?

To ensure stability with the LP5912-1.2DRVT in compact layouts, place a 1µF or larger ceramic output capacitor (X5R/X7R) as close as possible to the VOUT and GND pins, minimizing trace length to reduce ESR and ESL. Use separate ground vias for input and output capacitors, connecting them to a solid ground plane. Avoid routing sensitive traces beneath or near the regulator. The device is internally compensated, but poor layout can induce oscillation—especially under light loads. Also, route the EN pin with a 100kΩ pull-up resistor near the IC to prevent false enabling due to noise. Finally, secure the exposed pad with arrayed thermal vias tied to ground plane for both thermal and electrical performance.

How does the LP5912-1.2DRVT handle transient load steps in processor core power applications, and what output capacitance is recommended for optimal response?

The LP5912-1.2DRVT features integrated soft-start and fast transient response due to its NMOS pass element architecture, but it lacks dynamic voltage scaling. For microprocessor core loads with fast current transients (e.g., MCU sleep-to-active mode), use at least 4.7µF of effective ceramic output capacitance near the load to limit voltage droop. A single 10µF capacitor in X5R 0603 case provides good margin. Simultaneously, maintain a 1–4.7µF ceramic capacitor at the input. For best results, simulate load-step behavior using TINA-TI or similar tools modeling PCB inductance, and verify with oscilloscope testing at maximum load step rate. Avoid exceeding thermal limits during sustained high-current bursts beyond average 300–400mA unless heatsinking is sufficient.

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