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LMX2572RHAR
Texas Instruments
IC FREQ SYNTH 40VQFN
16037 Pcs New Original In Stock
Frequency Synthesizer (RF) IC 6.4GHz 1 40-VFQFN Exposed Pad
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5.0 / 5.0
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LMX2572RHAR
Product Overview
1350712
DiGi Electronics Part Number
LMX2572RHAR-DGManufacturer
Texas Instruments
LMX2572RHAR
Description
IC FREQ SYNTH 40VQFNInventory
16037 Pcs New Original In Stock
Frequency Synthesizer (RF) IC 6.4GHz 1 40-VFQFN Exposed Pad
Quantity
Minimum 1
Minimum 1
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LMX2572RHAR Technical Specifications
Category
Clock/Timing, Clock Generators, PLLs, Frequency Synthesizers
Packaging
-
Series
-
Product Status
Active
DiGi-Electronics Programmable
Not Verified
Type
Frequency Synthesizer (RF)
PLL
Yes with Bypass
Input
Clock
Output
-
Number of Circuits
1
Ratio - Input:Output
1:2
Differential - Input:Output
Yes/Yes
Frequency - Max
6.4GHz
Divider/Multiplier
Yes/Yes
Voltage - Supply
3V ~ 3.5V
Operating Temperature
-40°C ~ 85°C (TA)
Mounting Type
Surface Mount
Package / Case
40-VFQFN Exposed Pad
Supplier Device Package
40-VQFN (6x6)
Base Product Number
LMX2572
Datasheet & Documents
Manufacturer Product Page
LMX2572RHAR Specifications
HTML Datasheet
LMX2572RHAR-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8542.39.0001
Additional Information
Standard Package
2,500
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5.0/5.0-(Show up to 5 Ratings)
de desembre 02, 2025
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de desembre 02, 2025
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de desembre 02, 2025
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Frequently Asked Questions (FAQ)
When designing in the LMX2572RHAR, what are the key layout considerations to maintain signal integrity at its maximum 6.4GHz output frequency?
To ensure signal integrity with the LMX2572RHAR at frequencies up to 6.4GHz, use controlled-impedance transmission lines (typically 50Ω) for RF traces, minimize vias in high-speed paths, and maintain a solid ground plane beneath RF routing. Use the exposed pad for optimal thermal and electrical grounding by soldering it directly to the PCB ground with multiple vias. Keep sensitive nodes like the VCO and loop filter components short and isolated from digital switching noise. Proper stack-up design with adjacent ground layers and tight power supply decoupling (using 100nF and 10pF capacitors close to VCC pins) are critical to suppress spurs and phase noise degradation in high-frequency applications.
Can the LMX2572RHAR be used as a drop-in replacement for the ADF4371 in a 6GHz radar design, and what are the key performance trade-offs?
The LMX2572RHAR is not a drop-in replacement for the ADF4371 due to differences in architecture and integration. The ADF4371 supports up to 8GHz with integrated multipliers, while the LMX2572RHAR maxes out at 6.4GHz and requires external dividers for higher flexibility. The LMX2572RHAR offers better phase noise performance under 6GHz with lower power consumption (typ. 120mW vs. 250mW), but lacks the ADF4371’s integrated microwave doublers. When replacing, verify loop bandwidth compatibility, re-characterize the PLL filter design, and ensure the LMX2572RHAR’s 3.0–3.5V supply range aligns with your rail. Use TI’s PLLatinum Sim tool to model spur performance and lock time under your specific configuration.
How does the LMX2572RHAR handle supply voltage noise, and what mitigation techniques should be used in mixed-signal systems?
The LMX2572RHAR has a PSRR of approximately 45dB at low frequencies but degrades above 1MHz, making it susceptible to switching regulator noise in mixed-signal systems. To mitigate risk, use an LDO (e.g., TPS7A47) instead of a buck converter for the 3.3V supply rail. Place 10μF (bulk), 100nF, and 10pF capacitors in parallel near each VCC pin to address different noise frequencies. Isolate noisy digital sections with ground guards and avoid sharing inductors or traces with sensitive analog nodes. In high-noise environments, consider shielding or filtering the power lines with ferrite beads in combination with low-ESR capacitors to prevent supply-induced phase jitter.
What are the reliability risks when operating the LMX2572RHAR at 85°C ambient, and how should thermal management be implemented?
At 85°C ambient, the LMX2572RHAR’s junction temperature can approach its 125°C limit due to internal power dissipation (~120mW). To ensure long-term reliability, design the PCB with adequate copper area connected to the exposed pad (6x6mm thermal pad) using a 4x4 array of 0.3mm thermal vias to inner ground planes. Avoid placing heat-generating components nearby, and consider forced airflow in enclosed systems. Monitor thermal derating of nearby passives and verify performance under temperature cycling, as phase drift and increased close-in phase noise can occur near thermal limits. Operating consistently above 80°C ambient without proper heatsinking increases risk of parametric drift and early wear-out.
When replacing an older LMX2571 with the LMX2572RHAR, what design-in changes are required for optimal frequency agility and reduced lock time?
Replacing the LMX2571 with the LMX2572RHAR enables faster lock times due to enhanced PLL bandwidth capabilities (up to 500kHz vs. 200kHz typical). To leverage this improvement, reoptimize the loop filter for a wider bandwidth, ensuring component selection (e.g., low-temperature-coefficient resistors and NP0/C0G capacitors) maintains stability across -40°C to 85°C. Update the SPI configuration to enable the LMX2572RHAR’s digital phase detector modes and fast calibration algorithms. Also, verify input clock drive level meets the LMX2572RHAR’s differential input sensitivity (min 200mVpp). Backward compatibility exists, but unlocking performance gains requires recalibrating charge pump current and minimizing parasitic capacitance in filter traces.
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LMX2572RHAR CAD Models
Texas Instruments LMX2572RHAR PCB symbols & footprints
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