LMK61A2-156M25SIAT >
LMK61A2-156M25SIAT
Texas Instruments
IC OSC CLK 156.25MHZ 6QFM
31147 Pcs New Original In Stock
Clock Oscillator IC 156.25MHz 6-QFM (7x5)
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LMK61A2-156M25SIAT Texas Instruments
5.0 / 5.0 - (110 Ratings)

LMK61A2-156M25SIAT

Product Overview

1320015

DiGi Electronics Part Number

LMK61A2-156M25SIAT-DG

Manufacturer

Texas Instruments
LMK61A2-156M25SIAT

Description

IC OSC CLK 156.25MHZ 6QFM

Inventory

31147 Pcs New Original In Stock
Clock Oscillator IC 156.25MHz 6-QFM (7x5)
Quantity
Minimum 1

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LMK61A2-156M25SIAT Technical Specifications

Category Clock/Timing, Programmable Timers and Oscillators

Manufacturer Texas Instruments

Packaging Cut Tape (CT) & Digi-Reel®

Series -

Product Status Active

Type Clock Oscillator

Count -

Frequency 156.25MHz

Voltage - Supply 3.135V ~ 3.465V

Current - Supply 152 mA

Operating Temperature -40°C ~ 85°C

Package / Case 6-SMD Module

Supplier Device Package 6-QFM (7x5)

Mounting Type Surface Mount

Base Product Number LMK61A2

Datasheet & Documents

Manufacturer Product Page

LMK61A2-156M25SIAT Specifications

Environmental & Export Classification

RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.39.0001

Additional Information

Other Names
296-43861-2
296-43861-1
296-43861-6
Standard Package
250

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Frequently Asked Questions (FAQ)

What are the key design-in considerations when using the LMK61A2-156M25SIAT in high-speed SERDES applications operating near 10 Gbps?

When integrating the LMK61A2-156M25SIAT into high-speed SERDES designs, ensuring low jitter and stable power delivery is critical. The LMK61A2-156M25SIAT provides excellent phase jitter performance suitable for 10G applications, but you must maintain a clean 3.3V supply with proper decoupling (e.g., 100nF and 10μF capacitors close to the VDD pins) and isolate the oscillator’s ground from noisy digital sections. Additionally, route the output clock signal with controlled impedance (typically 50Ω) and minimize stubs to prevent reflections that could degrade signal integrity and increase bit error rates in sensitive timing paths.

Can the LMK61A2-156M25SIAT replace the Si570-156.25 in an existing design, and what are the critical integration risks?

The LMK61A2-156M25SIAT can serve as a footprint- and frequency-compatible alternative to the Si570-156.25, but key differences exist. Unlike the Si570, which supports programmable frequencies via I2C, the LMK61A2-156M25SIAT is a fixed-frequency oscillator, simplifying layout but reducing flexibility. Be aware that the LMK61A2-156M25SIAT draws higher supply current (152 mA vs. ~50 mA for Si570 in standby), potentially affecting power budget and thermal performance. Also confirm the output logic levels are compatible—LMK61A2-156M25SIAT uses LVPECL, whereas Si570 often defaults to LVDS, so ensure your receiver supports the signal type or plan for level translation.

How does the LMK61A2-156M25SIAT perform under marginal power supply conditions, such as voltage droop on a shared 3.3V rail?

The LMK61A2-156M25SIAT requires a stable supply between 3.135V and 3.465V; operation outside this range may result in frequency instability or increased jitter. In systems where the 3.3V rail experiences droop (e.g., during FPGA startup), use a dedicated LDO regulator for the LMK61A2-156M25SIAT to maintain regulation. Voltage droop as small as 100mV below the minimum can cause degraded phase noise or even oscillator stalling in marginal designs. To mitigate risk, measure rail stability under load and include sufficient bulk and high-frequency decoupling near the device.

What PCB layout and thermal management practices should be followed for reliable LMK61A2-156M25SIAT operation in densely populated boards?

For reliable LMK61A2-156M25SIAT performance in dense layouts, isolate the oscillator from high-power or switching components to minimize electromagnetic and thermal coupling. Use a solid ground plane underneath the 6-QFM (7x5) package but avoid thermal vias directly under the center pad unless specified. Since the device consumes 152 mA, thermal rise is moderate, but in tightly packed designs, ensure at least 2mm clearance around the device for airflow and stress relief. Route clock outputs away from sensitive analog or high-speed digital traces to prevent crosstalk, and adhere to MSL-3 handling—bake if exposed to moisture beyond 168 hours to prevent popcorning during reflow.

What are the long-term reliability risks of using the LMK61A2-156M25SIAT in industrial environments with temperature cycling between -40°C and 85°C?

The LMK61A2-156M25SIAT is rated for -40°C to 85°C operation and is well-suited for industrial use, but reliability depends on proper integration. Temperature cycling induces mechanical stress, especially at solder joints due to CTE mismatch between the 6-QFM package and PCB. To enhance long-term reliability, use a robust solder profile per J-STD-020, avoid board flex during assembly, and conformally coat or encapsulate in high-vibration environments. Also, ensure the oscillator is not subjected to rapid thermal transients exceeding 10°C/minute, which could momentarily destabilize output and affect downstream PLL locking in timing-sensitive systems.

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