LMH1219RTWR >
LMH1219RTWR
Texas Instruments
IC INTERFACE SPECIALIZED 24WQFN
3538 Pcs New Original In Stock
Cable Equalization Interface 24-WQFN (4x5)
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LMH1219RTWR Texas Instruments
5.0 / 5.0 - (505 Ratings)

LMH1219RTWR

Product Overview

1327056

DiGi Electronics Part Number

LMH1219RTWR-DG

Manufacturer

Texas Instruments
LMH1219RTWR

Description

IC INTERFACE SPECIALIZED 24WQFN

Inventory

3538 Pcs New Original In Stock
Cable Equalization Interface 24-WQFN (4x5)
Quantity
Minimum 1

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In Stock (All prices are in USD)
  • QTY Target Price Total Price
  • 1 24.8448 24.8448
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LMH1219RTWR Technical Specifications

Category Interface, Specialized

Manufacturer Texas Instruments

Packaging Cut Tape (CT) & Digi-Reel®

Series -

Product Status Active

Applications Cable Equalization

Interface Serial

Voltage - Supply -

Package / Case 24-WFQFN Exposed Pad

Supplier Device Package 24-WQFN (4x5)

Mounting Type Surface Mount

Base Product Number LMH1219

Datasheet & Documents

Manufacturer Product Page

LMH1219RTWR Specifications

HTML Datasheet

LMH1219RTWR-DG

Environmental & Export Classification

RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.39.0001

Additional Information

Other Names
3301-LMH1219RTWRCT
LMH1219RTWR-DG
296-51331-6
3301-LMH1219RTWRDKR
296-51331-2
296-51331-1
3301-LMH1219RTWRTR
Standard Package
100

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Reviews

5.0/5.0-(Show up to 5 Ratings)
구***상
de desembre 02, 2025
5.0
항상 정교한 품질과 빠른 배송으로 작업에 차질이 없어서 정말 감사해요.
Happ***rbor
de desembre 02, 2025
5.0
Their commitment to quality assurance is evident in every product.
Peacef***ourney
de desembre 02, 2025
5.0
The support team is proactive and professional—great shopping experience.
Radia***Rider
de desembre 02, 2025
5.0
DiGi Electronics always provides a smooth browsing experience and good value.
Brig***uture
de desembre 02, 2025
5.0
Very fast processing and dispatch, I received my order within just a couple of days.
Dawn***enade
de desembre 02, 2025
5.0
The site’s search features help me find what I need quickly.
Radia***Rover
de desembre 02, 2025
5.0
We appreciate their proactive approach in keeping us informed about our shipment status.
Sere***pirit
de desembre 02, 2025
5.0
DiGi Electronics offers affordable prices without compromising on quality.
Radi***Rise
de desembre 02, 2025
5.0
Thanks to their punctual delivery, I could launch my product without delay, and their support was invaluable afterward.
Velv***eadow
de desembre 02, 2025
5.0
I've received excellent value and service during my repeat visits.
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Frequently Asked Questions (FAQ)

When designing a high-speed serial interface for a cable equalization application, how does the LMH1219RTWR compare to the ADN8102ACPZ in terms of signal integrity and power efficiency, and what are the key trade-offs to consider during component selection?

The LMH1219RTWR offers superior jitter performance and lower power consumption (typically 180 mW) compared to the ADN8102ACPZ, which draws around 250 mW under similar conditions. However, the ADN8102ACPZ supports a wider input voltage range and includes integrated DC restoration, making it more suitable for legacy coaxial systems with high DC offsets. If your design prioritizes thermal efficiency and signal fidelity in compact, battery-powered or high-density PCB environments, the LMH1219RTWR is preferable. But if backward compatibility with older cable infrastructure is required, the ADN8102ACPZ may reduce system-level complexity despite higher power draw.

What are the critical layout considerations when integrating the LMH1219RTWR into a 4-layer PCB to avoid signal degradation and ensure reliable operation at multi-gigabit data rates?

For the LMH1219RTWR, the exposed thermal pad must be soldered directly to a solid ground plane with multiple vias to minimize ground inductance and improve heat dissipation. Route high-speed serial traces as controlled-impedance differential pairs (100 Ω differential) with minimal length mismatch (<5 mils) and avoid crossing plane splits. Place decoupling capacitors (100 nF and 10 µF) as close as possible to the supply pins, and isolate analog and digital ground regions with a single-point connection near the device. Failure to follow these practices can result in increased jitter, reduced eye margin, and potential thermal throttling due to poor heat sinking through the 24-WQFN package.

Can the LMH1219RTWR be used as a drop-in replacement for older cable equalizers like the TI THS7374 in SDI video applications, and what firmware or hardware adjustments might be necessary?

The LMH1219RTWR is not a direct pin-for-pin replacement for the THS7374 due to differences in interface type (serial vs. parallel) and functional architecture—the LMH1219RTWR is a specialized serial cable equalizer, while the THS7374 is a video filter amplifier. Replacing one with the other would require significant changes to the signal path, including adding a serializer or reconfiguring the receiver logic. Additionally, the LMH1219RTWR operates at much higher data rates and requires precise impedance matching, whereas the THS7374 targets lower-frequency analog video signals. A redesign of the front-end circuitry and possibly firmware updates to the host controller would be necessary, making this substitution non-trivial and generally not recommended without a full system review.

How does the moisture sensitivity level (MSL 3) of the LMH1219RTWR impact handling and assembly processes, and what steps should be taken to prevent popcorning or reliability failures during reflow?

As an MSL 3 device, the LMH1219RTWR can be exposed to ambient conditions for up to 168 hours (7 days) after opening the dry pack before requiring baking. If stored beyond this floor life, the device must be baked at 125°C for 24 hours to remove absorbed moisture and prevent 'popcorning' during reflow. During assembly, use a reflow profile that peaks at 245–250°C with a controlled ramp rate to minimize thermal stress on the 24-WQFN package. Ensure the PCB is pre-baked if stored in humid environments. Neglecting these steps risks internal delamination, solder joint voids, and long-term reliability issues, especially in high-humidity end-use environments.

In a redundant broadcast infrastructure design, what reliability risks should be evaluated when deploying the LMH1219RTWR in parallel signal paths, and how can fault tolerance be improved without compromising signal timing?

Deploying the LMH1219RTWR in redundant signal paths introduces skew and phase mismatch risks due to unit-to-unit variation in equalization response and propagation delay. To mitigate this, use devices from the same manufacturing lot and implement deskew calibration in the downstream receiver. Avoid passive signal splitting before the equalizer, as it degrades return loss and increases insertion loss. Instead, use active redundancy with failover switches controlled by a monitoring IC. Additionally, ensure consistent thermal environments across both paths, as temperature drift affects equalization performance. These measures help maintain signal coherence and reduce the risk of data corruption during switchover events in mission-critical broadcast systems.

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