LM95071QIMFX/NOPB >
LM95071QIMFX/NOPB
Texas Instruments
SENSOR DIGITAL -40C-150C SOT23-5
10045 Pcs New Original In Stock
Temperature Sensor Digital, Local -40°C ~ 150°C 13 b SOT-23-5
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LM95071QIMFX/NOPB Texas Instruments
5.0 / 5.0 - (142 Ratings)

LM95071QIMFX/NOPB

Product Overview

1359471

DiGi Electronics Part Number

LM95071QIMFX/NOPB-DG

Manufacturer

Texas Instruments
LM95071QIMFX/NOPB

Description

SENSOR DIGITAL -40C-150C SOT23-5

Inventory

10045 Pcs New Original In Stock
Temperature Sensor Digital, Local -40°C ~ 150°C 13 b SOT-23-5
Quantity
Minimum 1

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In Stock (All prices are in USD)
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  • 1 5.8859 5.8859
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LM95071QIMFX/NOPB Technical Specifications

Category Temperature Sensors, Analog and Digital Output

Manufacturer Texas Instruments

Packaging Cut Tape (CT) & Digi-Reel®

Series -

Product Status Active

Sensor Type Digital, Local

Sensing Temperature - Local -40°C ~ 150°C

Sensing Temperature - Remote -

Output Type SPI

Voltage - Supply 2.4V ~ 5.5V

Resolution 13 b

Features Shutdown Mode

Accuracy - Highest (Lowest) ±1°C (±2°C)

Test Condition 0°C ~ 70°C (-40°C ~ 150°C)

Operating Temperature -40°C ~ 150°C

Mounting Type Surface Mount

Grade Automotive

Qualification AEC-Q100

Package / Case SC-74A, SOT-753

Supplier Device Package SOT-23-5

Base Product Number LM95071

Datasheet & Documents

Manufacturer Product Page

LM95071QIMFX/NOPB Specifications

HTML Datasheet

LM95071QIMFX/NOPB-DG

Environmental & Export Classification

RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.39.0001

Additional Information

Other Names
-296-40259-1-DG
296-40259-2-DG
296-40259-1-DG
296-LM95071QIMFX/NOPBDKR
296-40259-6
LM95071QIMFX/NOPB-DG
296-LM95071QIMFX/NOPBTR
296-40259-2
296-40259-1
296-40259-6-DG
TEXTISLM95071QIMFX/NOPB
2156-LM95071QIMFX/NOPB
296-LM95071QIMFX/NOPBCT
Standard Package
3,000

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5.0/5.0-(Show up to 5 Ratings)
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Frequently Asked Questions (FAQ)

What are the key reliability risks when using the LM95071QIMFX/NOPB in automotive under-hood applications, and how does its AEC-Q100 qualification mitigate them?

The LM95071QIMFX/NOPB is AEC-Q100 Grade 2 qualified, meaning it is rated for operation up to 105°C ambient, which is critical for under-hood environments where temperatures can exceed 125°C under peak load. However, sustained operation near the 150°C sensing limit—especially during thermal cycling—can accelerate aging of the internal bandgap reference and affect long-term accuracy. To mitigate risk, maintain PCB copper pour under the SOT-23-5 package for heat spreading, avoid placing near high-dissipation components, and validate performance across the full -40°C to 125°C vehicle operating range during HALT testing. The MSL 1 rating also eliminates moisture-related failures during reflow, a common failure mode in non-automotive-grade sensors.

Can the LM95071QIMFX/NOPB replace a Maxim MAX31875 in an existing SPI-based thermal monitoring design without firmware changes?

While both the LM95071QIMFX/NOPB and Maxim MAX31875 support SPI interfaces and similar voltage ranges (2.7V–5.5V for MAX31875 vs. 2.4V–5.5V for LM95071QIMFX/NOPB), direct replacement is not guaranteed due to differences in register map, data format, and power-on reset behavior. The LM95071QIMFX/NOPB uses a 13-bit two’s complement output with a fixed 0.03125°C/LSB resolution, whereas the MAX31875 uses a 12-bit format with different scaling. Additionally, the LM95071QIMFX/NOPB lacks a configurable alert pin, which the MAX31875 provides. A firmware update will be required to reinterpret temperature data and handle initialization sequences. Always verify timing compatibility—especially SPI mode and clock rate—before drop-in substitution.

How does the shutdown mode in the LM95071QIMFX/NOPB impact system power budgeting in battery-powered automotive modules, and what are the trade-offs?

The LM95071QIMFX/NOPB’s shutdown mode reduces typical current consumption to below 1 µA, making it suitable for always-on battery-powered systems like telematics or security modules. However, entering/exiting shutdown introduces a wake-up delay of approximately 10 ms before valid temperature readings are available, which may affect real-time thermal response in safety-critical loops. To balance power and responsiveness, use periodic sampling with duty cycling rather than continuous monitoring. Also, ensure the host MCU’s SPI controller can tolerate the sensor’s re-initialization time. Over-reliance on shutdown mode without accounting for this latency can lead to undetected thermal events during transient overloads.

What PCB layout practices are essential to maintain ±1°C accuracy with the LM95071QIMFX/NOPB in high-vibration automotive environments?

To preserve the LM95071QIMFX/NOPB’s ±1°C accuracy (specified from 0°C to 70°C), minimize thermal gradients and mechanical stress on the SOT-23-5 package. Use a solid ground plane beneath the device with thermal vias to stabilize die temperature, but avoid large copper pours that could create thermal inertia and delay response. Keep high-current traces and switching components (e.g., DC-DC converters) at least 5 mm away to reduce conducted EMI and self-heating. In high-vibration settings, ensure adequate solder fillet formation during reflow and consider conformal coating to prevent microcracks. Poor layout can induce self-heating errors exceeding 2°C—worse than the sensor’s native accuracy—defeating the purpose of using a precision automotive-grade device.

Is the LM95071QIMFX/NOPB a viable upgrade from the older LM95071IMF/NOPB, and what design changes are needed for backward compatibility?

The LM95071QIMFX/NOPB is the AEC-Q100 qualified version of the commercial LM95071IMF/NOPB, offering identical electrical characteristics, pinout, and SPI protocol, making it a drop-in replacement in most cases. However, the 'Q' suffix denotes automotive-grade screening, including tighter process controls and extended reliability testing. If your design previously used the non-automotive LM95071IMF/NOPB in a non-safety application, upgrading to the LM95071QIMFX/NOPB requires no hardware changes but mandates updated documentation for compliance (e.g., PPAP, IMDS). Ensure your assembly house handles the RoHS3-compliant, lead-free package correctly—though MSL 1 eliminates bake requirements. This upgrade is strongly recommended for new automotive designs to meet functional safety and supply chain traceability demands.

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