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LM3S9D90-IQC80-A2T
Texas Instruments
IC MCU 32BIT 512KB FLASH 100LQFP
4584 Pcs New Original In Stock
ARM® Cortex®-M3 Stellaris® ARM® Cortex®-M3S 9000 Microcontroller IC 32-Bit Single-Core 80MHz 512KB (512K x 8) FLASH 100-LQFP (14x14)
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5.0 / 5.0
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LM3S9D90-IQC80-A2T
Product Overview
1341245
DiGi Electronics Part Number
LM3S9D90-IQC80-A2T-DGManufacturer
Texas Instruments
LM3S9D90-IQC80-A2T
Description
IC MCU 32BIT 512KB FLASH 100LQFPInventory
4584 Pcs New Original In Stock
ARM® Cortex®-M3 Stellaris® ARM® Cortex®-M3S 9000 Microcontroller IC 32-Bit Single-Core 80MHz 512KB (512K x 8) FLASH 100-LQFP (14x14)
Quantity
Minimum 1
Minimum 1
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LM3S9D90-IQC80-A2T Technical Specifications
Category
Embedded, Microcontrollers
Packaging
-
Series
Stellaris® ARM® Cortex®-M3S 9000
Product Status
Obsolete
DiGi-Electronics Programmable
Not Verified
Core Processor
ARM® Cortex®-M3
Core Size
32-Bit Single-Core
Speed
80MHz
Connectivity
CANbus, Ethernet, I2C, IrDA, LINbus, Microwire, QEI, SPI, SSI, UART/USART, USB OTG
Peripherals
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O
60
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
EEPROM Size
-
RAM Size
96K x 8
Voltage - Supply (Vcc/Vdd)
1.235V ~ 1.365V
Data Converters
A/D 16x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C (TA)
Mounting Type
Surface Mount
Supplier Device Package
100-LQFP (14x14)
Package / Case
100-LQFP
Base Product Number
LM3S9D90
Datasheet & Documents
Manufacturer Product Page
LM3S9D90-IQC80-A2T Specifications
HTML Datasheet
LM3S9D90-IQC80-A2T-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
REACH Status
REACH Unaffected
ECCN
3A991A2
HTSUS
8542.31.0001
Additional Information
Other Names
LM3S9D90IQC80A2T
296-29334-6
296-29334-1
296-29334-2
Standard Package
1,000
Reviews
5.0/5.0-(Show up to 5 Ratings)
de desembre 02, 2025
Die Qualität der Produkte bei DiGi Electronics ist immer zuverlässig und hochwertig, was meine Erwartungen stets übertrifft.
de desembre 02, 2025
Speedy delivery, I was impressed by how quickly my order arrived.
de desembre 02, 2025
DiGi Electronics demonstrates a genuine concern for customer satisfaction.
de desembre 02, 2025
Reliable support and consistent service ensure I keep coming back.
de desembre 02, 2025
Their support team is always courteous and helpful.
de desembre 02, 2025
Prompt delivery with secure packaging made the whole shopping experience pleasant.
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Frequently Asked Questions (FAQ)
Can the LM3S9D90-IQC80-A2T be used as a drop-in replacement for the older LM3S8962 in an existing motor control design, and what firmware or pinout changes might be required?
While the LM3S9D90-IQC80-A2T shares the same ARM Cortex-M3 core and many peripherals with the LM3S8962, it is not a direct drop-in replacement due to differences in pinout, memory mapping, and peripheral register layouts. The LM3S9D90 has 60 I/Os compared to 56 on the LM3S8962, and its 100-LQFP package has a different pin assignment—particularly for Ethernet MAC and USB OTG signals. Additionally, the LM3S9D90 includes enhanced DMA and QEI features that may require firmware reconfiguration. You must verify pin compatibility using TI’s cross-reference tools and update your startup code and linker script to match the new memory map (512KB Flash vs. 256KB). Always test interrupt handling and clock configuration, as the internal oscillator and PLL settings differ slightly.
What are the key reliability risks when designing a safety-critical industrial system around the LM3S9D90-IQC80-A2T, given that it's now marked obsolete by Texas Instruments?
Using the LM3S9D90-IQC80-A2T in new safety-critical designs poses significant long-term reliability and supply chain risks due to its obsolete status. While the device is still available from distributors like DiGi-Electronics, TI no longer guarantees future production, which threatens lifecycle support for medical, automotive, or industrial systems requiring 10+ year availability. Additionally, obsolete parts may lack updated errata documentation or security patches. For functional safety applications (e.g., IEC 61508), this creates compliance challenges. We recommend migrating to a supported successor like the TM4C129x series (e.g., TM4C1294NCPDT), which offers pin-compatible upgrades with enhanced security, larger memory, and active lifecycle support—reducing obsolescence risk and simplifying certification.
How should I handle power sequencing and brown-out protection when integrating the LM3S9D90-IQC80-A2T into a low-power sensor node with intermittent 3.3V supply fluctuations?
The LM3S9D90-IQC80-A2T operates at a narrow Vdd range of 1.235V–1.365V, which is internally regulated from a higher external supply (typically 3.3V). This means the external regulator must remain stable; the internal BOR (Brown-Out Reset) only monitors the core voltage, not the I/O rail. In fluctuating 3.3V environments, use an external supervisor IC (e.g., TPS3823) to monitor the input supply and assert reset if voltage drops below 3.0V, preventing erratic behavior during brown-outs. Also, ensure your LDO can supply sufficient current during flash programming peaks (~50mA). Avoid relying solely on the internal POR/BOR—external monitoring adds robustness, especially in battery-powered or noisy industrial settings where voltage sag could corrupt flash operations.
Is it feasible to repurpose the Ethernet MAC on the LM3S9D90-IQC80-A2T for a custom industrial IoT gateway, and what are the limitations compared to modern MCUs with integrated PHYs?
The LM3S9D90-IQC80-A2T includes a 10/100 Ethernet MAC with MII and RMII interfaces, making it technically capable for IoT gateway applications, but it requires an external PHY (e.g., DP83848 or LAN8720) and careful PCB layout for signal integrity. Unlike newer MCUs such as the STM32H7 or TM4C129x, it lacks an integrated PHY, increasing BOM cost, board space, and power consumption. Additionally, the 80MHz Cortex-M3 may struggle with TCP/IP stack overhead under high traffic loads—consider offloading with a dedicated network co-processor. Also, note that StellarisWare (TI’s legacy SDK) has limited TLS/security support, so implementing secure MQTT or HTTPS will require third-party libraries, increasing firmware complexity and attack surface.
What layout and thermal considerations are critical when placing the LM3S9D90-IQC80-A2T on a high-density PCB with mixed-signal components, especially near analog sensors and switching regulators?
The LM3S9D90-IQC80-A2T’s 100-LQFP package (14x14mm) demands careful thermal and signal integrity planning. Despite lacking a thermal pad, the package can dissipate up to 1W under heavy load (e.g., Ethernet + USB + ADC sampling), so ensure adequate copper pour under the device and use thermal vias to inner ground planes. Keep high-speed digital traces (e.g., Ethernet MII, USB DP/DM) short and impedance-controlled, and isolate them from sensitive analog inputs (ADC channels) using ground guards. Place decoupling capacitors (100nF ceramic) as close as possible to each Vdd pin, and use a star-ground topology to prevent noise from switching regulators (e.g., buck converters) coupling into the ADC reference. Also, avoid routing digital lines under the ADC input traces—the 12-bit ADC performance degrades significantly with ground bounce or crosstalk.
Quality Assurance (QC)
DiGi ensures the quality and authenticity of every electronic component through professional inspections and batch sampling, guaranteeing reliable sourcing, stable performance, and compliance with technical specifications, helping customers reduce supply chain risks and confidently use components in production.
LM3S9D90-IQC80-A2T CAD Models
Texas Instruments LM3S9D90-IQC80-A2T PCB symbols & footprints
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