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LM3S9B90-IQC80-C5
Texas Instruments
IC MCU 32BIT 256KB FLASH 100LQFP
4387 Pcs New Original In Stock
ARM® Cortex®-M3 Stellaris® ARM® Cortex®-M3S 9000 Microcontroller IC 32-Bit Single-Core 80MHz 256KB (256K x 8) FLASH 100-LQFP (14x14)
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5.0 / 5.0
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LM3S9B90-IQC80-C5
Product Overview
1285459
DiGi Electronics Part Number
LM3S9B90-IQC80-C5-DGManufacturer
Texas Instruments
LM3S9B90-IQC80-C5
Description
IC MCU 32BIT 256KB FLASH 100LQFPInventory
4387 Pcs New Original In Stock
ARM® Cortex®-M3 Stellaris® ARM® Cortex®-M3S 9000 Microcontroller IC 32-Bit Single-Core 80MHz 256KB (256K x 8) FLASH 100-LQFP (14x14)
Quantity
Minimum 1
Minimum 1
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LM3S9B90-IQC80-C5 Technical Specifications
Category
Embedded, Microcontrollers
Packaging
-
Series
Stellaris® ARM® Cortex®-M3S 9000
Product Status
Obsolete
DiGi-Electronics Programmable
Not Verified
Core Processor
ARM® Cortex®-M3
Core Size
32-Bit Single-Core
Speed
80MHz
Connectivity
CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, Microwire, SPI, SSI, UART/USART, USB OTG
Peripherals
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O
60
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
EEPROM Size
-
RAM Size
96K x 8
Voltage - Supply (Vcc/Vdd)
1.235V ~ 1.365V
Data Converters
A/D 16x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C (TA)
Mounting Type
Surface Mount
Supplier Device Package
100-LQFP (14x14)
Package / Case
100-LQFP
Base Product Number
LM3S9B90
Datasheet & Documents
HTML Datasheet
LM3S9B90-IQC80-C5-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
REACH Status
REACH Unaffected
ECCN
3A991A2
HTSUS
8542.31.0001
Additional Information
Other Names
296-41514
LM3S9B90-IQC80-C5-DG
-LM3S9B90-IQC80
Standard Package
90
Alternative Parts
View DetailsPART NUMBER
MANUFACTURER
QUANTITY AVAILABLE
DiGi PART NUMBER
UNIT PRICE
SUBSTITUTE TYPE
Reviews
5.0/5.0-(Show up to 5 Ratings)
de desembre 02, 2025
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de desembre 02, 2025
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de desembre 02, 2025
DiGi Electronics consistently offers budget-friendly options that meet professional needs.
de desembre 02, 2025
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de desembre 02, 2025
The packaging was eco-friendly and showed a clear commitment to sustainability, which I truly appreciated.
de desembre 02, 2025
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Frequently Asked Questions (FAQ)
What are the key risks when designing with the LM3S9B90-IQC80-C5 in new industrial applications, given its obsolete status and limited supply chain support?
The LM3S9B90-IQC80-C5 is officially obsolete, which introduces significant long-term supply and lifecycle risks. Designing new systems around this MCU may lead to last-time buy requirements, inventory obsolescence, and lack of future firmware updates or technical support from Texas Instruments. Additionally, its MSL 3 rating demands strict moisture control during assembly—failure to follow proper baking and handling procedures can result in board-level failures due to popcorning. For new designs, consider migrating to the recommended substitute TM4C1237H6PZI, which offers pin compatibility, enhanced peripherals, active production status, and better long-term availability.
Can the LM3S9B90-IQC80-C5 be safely replaced with the TM4C1237H6PZI in an existing embedded Ethernet control system without major firmware rewrites?
Yes, the TM4C1237H6PZI is a drop-in compatible upgrade path for the LM3S9B90-IQC80-C5 and shares the same ARM Cortex-M3 core architecture, memory map, and peripheral set including Ethernet MAC/PHY interface, USB OTG, and CAN. However, subtle differences in clocking, DMA behavior, and peripheral register defaults may require validation of timing-sensitive code and interrupt handling. Always re-run power-on self-tests and communication protocol stacks (e.g., TCP/IP, USB enumeration) on the new silicon. TI provides migration guides and driver libraries (TivaWare) that ease transition, but full functional regression testing is strongly advised before deployment.
How does the narrow Vcc/Vdd range (1.235V–1.365V) of the LM3S9B90-IQC80-C5 impact power supply design in battery-powered or noisy environments?
The LM3S9B90-IQC80-C5’s tight core voltage requirement (nominally ~1.25V) demands a highly regulated, low-noise power supply. Standard 3.3V rails cannot directly power the core without a dedicated LDO or DC-DC converter with excellent line/load regulation and transient response. In battery-powered systems, voltage droop during transmission bursts (e.g., Ethernet or RF activity) can push Vdd below 1.235V, triggering brown-out resets. Use a low-dropout regulator (LDO) with <50mV dropout and bypass capacitors placed within 2mm of the Vdd pins. Avoid shared noisy rails—especially from switching converters—without additional filtering to prevent erratic behavior or data corruption.
What reliability concerns should be considered when using the LM3S9B90-IQC80-C5 in automotive or extended-temperature field deployments despite its -40°C to 85°C rating?
While the LM3S9B90-IQC80-C5 is rated for -40°C to 85°C ambient temperature, real-world reliability in automotive or industrial settings depends on thermal cycling, solder joint integrity, and peripheral stress. The 100-LQFP package is susceptible to cracking under repeated thermal expansion, especially if PCB CTE mismatch exists. Additionally, internal flash endurance (typically 10k cycles) may degrade faster under high-temperature operation, risking firmware corruption over time. For mission-critical applications, implement external watchdog supervision, periodic flash checksum validation, and consider conformal coating to mitigate moisture ingress—particularly since the device lacks built-in ECC on flash memory.
Is it feasible to interface the LM3S9B90-IQC80-C5 with modern 3.3V logic peripherals given its 1.25V core and I/O voltage domain, and what level-shifting strategies are recommended?
The LM3S9B90-IQC80-C5’s I/O pins are powered by the same 1.25V rail as the core, making direct connection to standard 3.3V logic unsafe and non-compliant with voltage tolerance specs. Applying 3.3V signals to its GPIOs risks latch-up or permanent damage. To interface safely, use bidirectional level translators (e.g., TXB0108 or SN74LVC8T245) on all signal lines, including SPI, I2C, and UART. For I2C specifically, ensure pull-up resistors are connected to the 3.3V side, not the MCU’s 1.25V rail. Alternatively, design the entire subsystem around 1.25V-compatible peripherals—but this severely limits component selection. Always verify signal integrity and timing margins after translation, especially at 80MHz system clock speeds.
Quality Assurance (QC)
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LM3S9B90-IQC80-C5 CAD Models
Texas Instruments LM3S9B90-IQC80-C5 PCB symbols & footprints
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