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LM3S6610-IQC25-A2
Texas Instruments
IC MCU 32BIT 128KB FLASH 100LQFP
24496 Pcs New Original In Stock
ARM® Cortex®-M3 Stellaris® ARM® Cortex®-M3S 6000 Microcontroller IC 32-Bit Single-Core 25MHz 128KB (128K x 8) FLASH 100-LQFP (14x14)
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5.0 / 5.0
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LM3S6610-IQC25-A2
Product Overview
1347959
DiGi Electronics Part Number
LM3S6610-IQC25-A2-DGManufacturer
Texas Instruments
LM3S6610-IQC25-A2
Description
IC MCU 32BIT 128KB FLASH 100LQFPInventory
24496 Pcs New Original In Stock
ARM® Cortex®-M3 Stellaris® ARM® Cortex®-M3S 6000 Microcontroller IC 32-Bit Single-Core 25MHz 128KB (128K x 8) FLASH 100-LQFP (14x14)
Quantity
Minimum 1
Minimum 1
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LM3S6610-IQC25-A2 Technical Specifications
Category
Embedded, Microcontrollers
Packaging
-
Series
Stellaris® ARM® Cortex®-M3S 6000
Product Status
Active
DiGi-Electronics Programmable
Not Verified
Core Processor
ARM® Cortex®-M3
Core Size
32-Bit Single-Core
Speed
25MHz
Connectivity
Ethernet, I2C, IrDA, Microwire, QEI, SPI, SSI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O
46
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
EEPROM Size
-
RAM Size
32K x 8
Voltage - Supply (Vcc/Vdd)
2.25V ~ 2.75V
Data Converters
-
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Supplier Device Package
100-LQFP (14x14)
Package / Case
100-LQFP
Base Product Number
LM3S6610
Datasheet & Documents
Manufacturer Product Page
LM3S6610-IQC25-A2 Specifications
HTML Datasheet
LM3S6610-IQC25-A2-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8542.31.0001
Additional Information
Other Names
726-1075
LM3S6610-IQC25
-LM3S6610-IQC25-A2-NDR
2156-LM3S6610-IQC25-A2
TEXTISLM3S6610-IQC25-A2
-LM3S6610-IQC25
Standard Package
90
Reviews
5.0/5.0-(Show up to 5 Ratings)
de desembre 02, 2025
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Frequently Asked Questions (FAQ)
What are the design-in challenges when using the LM3S6610-IQC25-A2 in a low-power industrial sensor node with strict 25MHz clock requirements?
The LM3S6610-IQC25-A2 runs at a fixed 25MHz internal oscillator speed, which may limit dynamic power scaling compared to MCUs with flexible clock trees. For low-power industrial sensor nodes, ensure that peripherals like Ethernet and UART are selectively disabled to reduce current draw, as they remain active unless explicitly powered down in firmware. Additionally, the 2.25V–2.75V supply range is narrow—designers must use a tightly regulated LDO instead of a general-purpose switching regulator to avoid brown-out resets. Use the on-chip brown-out detection and WDT features to enhance reliability in remote deployments where maintenance is costly.
Can the LM3S6610-IQC25-A2 replace the LM3S8962 in an existing motor control application, and what interface compatibility issues should be expected?
While both belong to the Stellaris® ARM® Cortex®-M3 family, the LM3S6610-IQC25-A2 has fewer I/Os (46 vs 64 on LM3S8962) and lacks analog comparators and ADCs present in the LM3S8962, making it unsuitable for direct drop-in replacement in analog-intensive motor control loops. If your design relies on PWM feedback via ADC or analog comparators, you’ll need external signal conditioning or a different MCU. However, for digital-only control (e.g., using QEI and PWM), the LM3S6610-IQC25-A2 can work with board respin to match the 100-LQFP footprint and reconfigure peripheral routing in code.
How does the lack of external memory interface on the LM3S6610-IQC25-A2 impact firmware scalability in Ethernet-connected embedded gateways?
The LM3S6610-IQC25-A2 includes 128KB flash and 32KB RAM but no external memory bus, which limits its use in Ethernet gateway applications requiring large buffer pools or web server assets. To mitigate this, optimize code size using compiler directives (e.g., -Os) and offload data storage or protocol parsing to a host processor. Consider pairing it with an external FPGA or using a more modern Cortex-M4 with external bus interface if throughput exceeds 10Mbps sustained. Evaluate firmware updates carefully—use compressed bootloaders to stay within 128KB.
What are the PCB layout risks when integrating the LM3S6610-IQC25-A2 in a dense 100-LQFP design with high-speed Ethernet traces?
The 100-LQFP package of the LM3S6610-IQC25-A2 requires careful attention to thermal and signal integrity in compact layouts. Ensure a continuous ground plane beneath the device and avoid slitting it for trace routing, especially under the Ethernet MAC signals. Use controlled impedance routing (50Ω single-ended, 100Ω differential) for Ethernet PHY connections, and place decoupling capacitors (100nF X7R) as close as possible to each VDD pin. Thermal pads should be soldered to an internal ground layer with multiple vias to prevent lift-off during reflow. MSL3 sensitivity means dry packing and use within 168 hours post-baking if exposed.
Is the LM3S6610-IQC25-A2 a viable long-term solution for new designs given its 25MHz speed and lack of modern peripherals like USB or CAN?
The LM3S6610-IQC25-A2 is still active, but its 25MHz speed, absence of USB/CAN, and fixed peripheral set make it a risk for new designs targeting long lifecycles or field upgradability. Competitors like the STM32F103RBT6 (72MHz, USB + CAN) or even TI’s own TM4C123GH6PM (80MHz, USB, CAN) offer better performance and integration. If you're committed to LM3S6610-IQC25-A2, secure multi-year supply agreements and plan for a mid-term migration strategy. Use its strengths—Ethernet MAC, QEI, and wide temperature support—only in cost-controlled, low-complexity control applications where software maintainability is not critical.
Quality Assurance (QC)
DiGi ensures the quality and authenticity of every electronic component through professional inspections and batch sampling, guaranteeing reliable sourcing, stable performance, and compliance with technical specifications, helping customers reduce supply chain risks and confidently use components in production.
LM3S6610-IQC25-A2 CAD Models
Texas Instruments LM3S6610-IQC25-A2 PCB symbols & footprints
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