LM3S5B91-IQC80-C3 >
LM3S5B91-IQC80-C3
Texas Instruments
IC MCU 32BIT 256KB FLASH 100LQFP
7981 Pcs New Original In Stock
ARM® Cortex®-M3 Stellaris® ARM® Cortex®-M3S 5000 Microcontroller IC 32-Bit Single-Core 80MHz 256KB (256K x 8) FLASH 100-LQFP (14x14)
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LM3S5B91-IQC80-C3 Texas Instruments
5.0 / 5.0 - (441 Ratings)

LM3S5B91-IQC80-C3

Product Overview

1369380

DiGi Electronics Part Number

LM3S5B91-IQC80-C3-DG

Manufacturer

Texas Instruments
LM3S5B91-IQC80-C3

Description

IC MCU 32BIT 256KB FLASH 100LQFP

Inventory

7981 Pcs New Original In Stock
ARM® Cortex®-M3 Stellaris® ARM® Cortex®-M3S 5000 Microcontroller IC 32-Bit Single-Core 80MHz 256KB (256K x 8) FLASH 100-LQFP (14x14)
Quantity
Minimum 1

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LM3S5B91-IQC80-C3 Technical Specifications

Category Embedded, Microcontrollers

Manufacturer Texas Instruments

Packaging -

Series Stellaris® ARM® Cortex®-M3S 5000

Product Status Obsolete

DiGi-Electronics Programmable Not Verified

Core Processor ARM® Cortex®-M3

Core Size 32-Bit Single-Core

Speed 80MHz

Connectivity CANbus, EBI/EMI, I2C, IrDA, LINbus, Microwire, QEI, SPI, SSI, UART/USART, USB OTG

Peripherals Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT

Number of I/O 72

Program Memory Size 256KB (256K x 8)

Program Memory Type FLASH

EEPROM Size -

RAM Size 96K x 8

Voltage - Supply (Vcc/Vdd) 1.08V ~ 1.32V

Data Converters A/D 16x10b

Oscillator Type Internal

Operating Temperature -40°C ~ 85°C (TA)

Mounting Type Surface Mount

Supplier Device Package 100-LQFP (14x14)

Package / Case 100-LQFP

Base Product Number LM3S5B91

Datasheet & Documents

HTML Datasheet

LM3S5B91-IQC80-C3-DG

Environmental & Export Classification

RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991A2
HTSUS 8542.31.0001

Additional Information

Standard Package
90

Alternative Parts

View Details
PART NUMBER
MANUFACTURER
QUANTITY AVAILABLE
DiGi PART NUMBER
UNIT PRICE
SUBSTITUTE TYPE
ATSAMS70N19A-AN
Microchip Technology
3157
ATSAMS70N19A-AN-DG
3.6556
MFR Recommended

Reviews

5.0/5.0-(Show up to 5 Ratings)
ひまわ***さやき
de desembre 02, 2025
5.0
何か問題があった時も、速やかに対応してくれて感謝しています。素晴らしい会社です。
Suns***haser
de desembre 02, 2025
5.0
Their price points make high-quality technology accessible for all users.
WildF***erGaze
de desembre 02, 2025
5.0
DiGi Electronics’ logistics efficiencies have significantly streamlined our procurement process.
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Frequently Asked Questions (FAQ)

Can the LM3S5B91-IQC80-C3 be safely replaced with an ATSAMS70N19A-AN in an existing 80MHz industrial control design without major firmware rewrites?

While the ATSAMS70N19A-AN offers higher performance (300MHz Cortex-M7) and more peripherals, direct replacement of the LM3S5B91-IQC80-C3 is not drop-in compatible due to architectural differences—Cortex-M3 vs. M7, distinct memory maps, and peripheral register layouts. Firmware will require significant porting effort, especially for low-level drivers (UART, SPI, ADC timing). Additionally, the ATSAMS70N19A-AN operates at 3.3V with wider I/O tolerance, whereas the LM3S5B91-IQC80-C3 runs on a tighter 1.08V–1.32V core supply, so power sequencing and level-shifting must be re-evaluated. Only consider this substitution if you're prepared for a full hardware and software validation cycle.

What are the critical risks when designing a high-reliability system around the LM3S5B91-IQC80-C3 given its obsolete status and MSL 3 rating?

The LM3S5B91-IQC80-C3’s obsolete status means long-term supply is unreliable, increasing risk of last-time buy scenarios or counterfeit parts. Combined with its Moisture Sensitivity Level (MSL) 3 (168-hour floor life), improper handling during assembly can lead to popcorning or latent failures in humid environments. To mitigate, implement strict bake-and-store protocols per J-STD-033, use nitrogen dry storage post-unpacking, and qualify second-source alternatives early. Also, avoid new designs unless legacy compatibility is mandatory—consider migrating to active TI SimpleLink or ARM-based successors like the TM4C series for better lifecycle support.

How does the internal oscillator accuracy of the LM3S5B91-IQC80-C3 impact UART and USB OTG communication in noisy industrial environments?

The LM3S5B91-IQC80-C3 relies on an internal RC oscillator, which typically has ±1–2% frequency tolerance over temperature and voltage—insufficient for reliable USB OTG operation, which requires ±0.25% or better. While UART may tolerate this inaccuracy at lower baud rates (e.g., 9600–115200 bps), timing drift can cause framing errors in extended transmissions or multi-drop networks. For robust industrial use, always use an external crystal or oscillator (e.g., 8MHz ±50ppm) connected to the XTAL pins. This ensures stable clocking for USB, CAN, and high-speed serial links, reducing resynchronization failures and EMI-induced data corruption.

Is it safe to run the LM3S5B91-IQC80-C3 at 80MHz continuously in an enclosure reaching 80°C ambient, given its -40°C to 85°C operating range?

Operating the LM3S5B91-IQC80-C3 at 80MHz near its upper temperature limit (85°C) significantly increases thermal stress and electromigration risk, potentially shortening lifespan. Although the datasheet specifies 85°C as the absolute maximum, sustained operation at this temperature—especially with high peripheral activity (DMA, ADC, USB)—can push junction temperatures beyond safe margins. TI recommends derating clock speed or reducing load above 70°C ambient. Add thermal vias under the LQFP package, ensure adequate airflow, and monitor current draw. For mission-critical applications, consider throttling to 60MHz above 75°C or switching to a more robust, currently supported MCU with better thermal headroom.

What design precautions are needed when using the LM3S5B91-IQC80-C3’s 1.2V core voltage in a mixed 3.3V system to avoid latch-up or signal integrity issues?

The LM3S5B91-IQC80-C3’s core runs at 1.08V–1.32V, but its I/O pins are 3.3V-tolerant, simplifying interfacing—however, improper power sequencing can cause latch-up. Always ensure VDD (core) and VDDA (analog) rise before or simultaneously with I/O voltages (VDDIO). Use a power supervisor IC to enforce correct sequencing and prevent reverse biasing of ESD diodes. Additionally, place 100nF decoupling caps within 2mm of each VDD pin and use a solid ground plane to minimize noise on the low-voltage core. Avoid floating inputs; enable internal pull-ups/downs on unused pins to reduce leakage and susceptibility to EMI, especially in long-trace PCB layouts.

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