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LM2675MX-3.3/NOPB
Texas Instruments
IC REG BUCK 3.3V 1A 8SOIC
49163 Pcs New Original In Stock
Buck Switching Regulator IC Positive Fixed 3.3V 1 Output 1A 8-SOIC (0.154", 3.90mm Width)
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5.0 / 5.0
- (439 Ratings)
LM2675MX-3.3/NOPB
Product Overview
1370704
DiGi Electronics Part Number
LM2675MX-3.3/NOPB-DGManufacturer
Texas Instruments
LM2675MX-3.3/NOPB
Description
IC REG BUCK 3.3V 1A 8SOICInventory
49163 Pcs New Original In Stock
Buck Switching Regulator IC Positive Fixed 3.3V 1 Output 1A 8-SOIC (0.154", 3.90mm Width)
Quantity
Minimum 1
Minimum 1
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LM2675MX-3.3/NOPB Technical Specifications
Category
Power Management (PMIC), Voltage Regulators - DC DC Switching Regulators
Packaging
Cut Tape (CT) & Digi-Reel®
Series
SIMPLE SWITCHER®
Product Status
Active
Function
Step-Down
Output Configuration
Positive
Topology
Buck
Output Type
Fixed
Number of Outputs
1
Voltage - Input (Min)
6.5V
Voltage - Input (Max)
40V
Voltage - Output (Min/Fixed)
3.3V
Voltage - Output (Max)
-
Current - Output
1A
Frequency - Switching
260kHz
Synchronous Rectifier
No
Operating Temperature
-40°C ~ 125°C (TJ)
Mounting Type
Surface Mount
Package / Case
8-SOIC (0.154", 3.90mm Width)
Supplier Device Package
8-SOIC
Base Product Number
LM2675
Datasheet & Documents
Manufacturer Product Page
LM2675MX-3.3/NOPB Specifications
HTML Datasheet
LM2675MX-3.3/NOPB-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8542.39.0001
Additional Information
Other Names
LM2675MX-3.3-NDR
LM2675MX-3.3/NOPBCT
LM2675MX-3.3/NOPBDKR
*LM2675MX-3.3/NOPB
2156-LM2675MX-3.3/NOPB-TI
LM2675MX-3.3/NOPBTR
LM2675MX33NOPB
Standard Package
2,500
Alternative Parts
PART NUMBER
MANUFACTURER
QUANTITY AVAILABLE
DiGi PART NUMBER
UNIT PRICE
SUBSTITUTE TYPE
Reviews
5.0/5.0-(Show up to 5 Ratings)
de desembre 02, 2025
J'apprécie beaucoup la façon dont ils emballent leurs produits. Leur méthode garantit une sécurité maximale durant le transport.
de desembre 02, 2025
DiGi Electronics provides excellent value for my investments.
de desembre 02, 2025
Shipment arrived on time, and the eco packaging shows real commitment to sustainability.
de desembre 02, 2025
We value their quick and effective support for any post-purchase concerns.
de desembre 02, 2025
I appreciate how DiGi Electronics integrates environmental considerations into their packaging strategy.
de desembre 02, 2025
Their after-sales technical support is thorough and always available when we need assistance.
de desembre 02, 2025
I value the honesty in their pricing; no surprises at checkout, which is very refreshing.
de desembre 02, 2025
I appreciated how quickly they processed and shipped my order.
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Frequently Asked Questions (FAQ)
What are the key design-in risks when using the LM2675MX-3.3/NOPB in a high-temperature industrial application, and how can thermal shutdown be avoided?
When designing the LM2675MX-3.3/NOPB into high-temperature environments (up to 125°C junction), the primary risk is thermal shutdown due to inadequate PCB copper for heat dissipation. To mitigate this, ensure at least 1 square inch of 2-oz copper pour connected to the GND pin and thermal pad (if applicable, though SOIC-8 has limited exposed pad). Use multiple vias to inner ground planes and avoid placing heat-sensitive components nearby. Calculate power loss as (VIN - VOUT) × ILOAD, and ensure junction temperature stays below 125°C with derating for ambient conditions and airflow. The LM2675MX-3.3/NOPB does not have thermal foldback, so exceeding thermal limits will cause intermittent operation.
How does the LM2675MX-3.3/NOPB compare to the LM2596-3.3 in terms of efficiency and reliability for 12V to 3.3V conversion at 800mA load?
Compared to the LM2596-3.3, the LM2675MX-3.3/NOPB offers superior line regulation, lower EMI due to controlled switch transition, and higher reliability with internal compensation and cycle-by-cycle current limiting. The LM2675MX-3.3/NOPB typically achieves up to 90% efficiency at 12V to 3.3V conversion under 800mA, while the LM2596-3.3 suffers from higher switching losses and less stable feedback control. Additionally, the LM2675MX-3.3/NOPB has better thermal performance due to tighter process control and protection features. For mission-critical designs, the TI-manufactured LM2675MX-3.3/NOPB reduces risk of long-term drift and failure versus generic LM2596 variants.
Can I replace an aging MC34063-based buck converter with the LM2675MX-3.3/NOPB without redesigning the entire power stage?
Yes, replacing an MC34063 with the LM2675MX-3.3/NOPB is feasible and improves performance, but requires board modifications. The LM2675MX-3.3/NOPB integrates the switch and oscillator, enabling a much simpler design: you’ll only need an external inductor (10μH recommended), Schottky diode (e.g., 1N5819), and output capacitor (100μF low-ESR). Unlike the MC34063, external compensation isn’t needed. However, verify input voltage stays above 6.5V (MC34063 supports down to 3V), so this substitution suits 7V+ inputs only. The LM2675MX-3.3/NOPB reduces component count, improves efficiency, and lowers design complexity significantly.
What are the critical PCB layout guidelines for minimizing noise and instability in the LM2675MX-3.3/NOPB buck converter circuit?
To minimize noise and ensure stability with the LM2675MX-3.3/NOPB, keep the high-current switching loop—formed by the input capacitor, LM2675MX-3.3/NOPB SW pin, and catch diode—small and direct. Use a 0.33μF low-ESR ceramic capacitor as close as possible to VIN and GND pins. Route the feedback trace away from the inductor and SW node, and connect it directly to the output capacitor’s clean side. Avoid splitting ground planes beneath the IC; instead, use a solid ground plane under the LM2675MX-3.3/NOPB. Keep traces wide for VIN, SW, and GND to reduce parasitic inductance and prevent ringing. Poor layout can cause overshoot, oscillation, or EMI failures.
What long-term reliability concerns should be addressed when using the LM2675MX-3.3/NOPB in a 24/7 outdoor power system with variable loads?
For continuous outdoor use, reliability of the LM2675MX-3.3/NOPB depends on managing thermal cycling, input transients, and output capacitor aging. Use a TVS diode (e.g., SMAJ5.0A) on VIN to suppress load dump or lightning-induced surges up to 40V. Choose ceramic or polymer capacitors over standard electrolytics for longer lifespan and lower ESR. Design for worst-case load steps (e.g., 100mA to 1A) to avoid output voltage droop, as the fixed compensation of the LM2675MX-3.3/NOPB has limited transient response. Monitor junction temperature over seasons—ensure no condensation or thermal stress cracks—and use conformal coating on the PCB to prevent moisture ingress affecting performance.
Quality Assurance (QC)
DiGi ensures the quality and authenticity of every electronic component through professional inspections and batch sampling, guaranteeing reliable sourcing, stable performance, and compliance with technical specifications, helping customers reduce supply chain risks and confidently use components in production.
LM2675MX-3.3/NOPB CAD Models
Texas Instruments LM2675MX-3.3/NOPB PCB symbols & footprints
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