LM25066PSQ/NOPB >
LM25066PSQ/NOPB
Texas Instruments
IC POWER MANAGEMENT 24WQFN
1452 Pcs New Original In Stock
Base Station-Networking Line Cards, Servers PMIC 24-WQFN (4x5)
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LM25066PSQ/NOPB Texas Instruments
5.0 / 5.0 - (182 Ratings)

LM25066PSQ/NOPB

Product Overview

1362334

DiGi Electronics Part Number

LM25066PSQ/NOPB-DG

Manufacturer

Texas Instruments
LM25066PSQ/NOPB

Description

IC POWER MANAGEMENT 24WQFN

Inventory

1452 Pcs New Original In Stock
Base Station-Networking Line Cards, Servers PMIC 24-WQFN (4x5)
Quantity
Minimum 1

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In Stock (All prices are in USD)
  • QTY Target Price Total Price
  • 1 232.5523 232.5523
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LM25066PSQ/NOPB Technical Specifications

Category Power Management (PMIC), Power Management - Specialized

Manufacturer Texas Instruments

Packaging -

Series -

Product Status Active

Applications Base Station-Networking Line Cards, Servers

Current - Supply 5.8mA

Voltage - Supply 2.9V ~ 17V

Operating Temperature -40°C ~ 85°C

Mounting Type Surface Mount

Package / Case 24-WFQFN Exposed Pad

Supplier Device Package 24-WQFN (4x5)

Base Product Number LM25066

Datasheet & Documents

Manufacturer Product Page

LM25066PSQ/NOPB Specifications

HTML Datasheet

LM25066PSQ/NOPB-DG

Environmental & Export Classification

RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.39.0001

Additional Information

Other Names
2156-LM25066PSQ/NOPB
296-40161-2
LM25066PSQ/NOPB-DG
296-40161-1
296-40161-6
TEXTISLM25066PSQ/NOPB
-296-40161-1-DG
-LM25066PSQ-NDR
Standard Package
1,000

Reviews

5.0/5.0-(Show up to 5 Ratings)
Spir***ider
de desembre 02, 2025
5.0
Fast dispatch time means I get my items quickly, which is fantastic.
Brig***liss
de desembre 02, 2025
5.0
The overall experience with Di Digi Electronics has been smooth, thanks to their reliable shipping and product quality.
Lu***One
de desembre 02, 2025
5.0
I appreciate how quickly the order was dispatched and arrived at my doorstep.
Soul***rcher
de desembre 02, 2025
5.0
They provide quick shipment and attentive service, which I highly appreciate.
Rusti***diance
de desembre 02, 2025
5.0
The robustness of the packaging gave my fragile items the protection they needed.
Winte***nderer
de desembre 02, 2025
5.0
DiGi Electronics’ product diversity has allowed us to upgrade our facilities seamlessly.
Wildf***erView
de desembre 02, 2025
5.0
I received my order in record time, and the packaging was robust and reliable.
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Frequently Asked Questions (FAQ)

What are the key design-in risks when using the LM25066PSQ/NOPB in a high-temperature server environment near its 85°C operating limit?

When designing the LM25066PSQ/NOPB into server power systems operating near 85°C, thermal derating and PCB layout become critical. The device draws 5.8mA supply current but can heat up under sustained load due to internal regulation and monitoring functions. To mitigate thermal stress, ensure adequate copper pour for thermal dissipation, especially connected to the exposed pad. Avoid placing near high-power components, and consider airflow or active cooling in dense line cards. Also verify that remote sense inputs (if used) are routed with matched lengths to prevent erroneous voltage readings caused by thermal gradients. Board-level thermal validation with real-world loads is recommended before final deployment.

Can the LM25066PSQ/NOPB replace the LTC2977 in a base station power monitoring application, and what integration challenges should I expect?

While both the LM25066PSQ/NOPB and LTC2977 are PMICs for power monitoring in networking equipment, direct replacement requires careful review. The LTC2977 supports PMBus commands and offers higher integration with EEPROM and more fault logs, whereas the LM25066PSQ/NOPB uses a simpler interface and lacks non-volatile fault storage. When replacing LTC2977 with the LM25066PSQ/NOPB, verify compatibility with your existing I2C/SMBus firmware stack—TI's device may not support all PMBus commands. Also, confirm external sense resistor values are within the LM25066’s measurement range (typically 10–20mΩ), and recalibrate threshold settings. Simulate fault scenarios like overcurrent to ensure proper response timing.

How does the wide 2.9V to 17V supply range of the LM25066PSQ/NOPB impact system reliability in unregulated intermediate bus architectures?

The LM25066PSQ/NOPB’s 2.9V to 17V input range offers flexibility in unregulated 12V intermediate bus systems, but introduces reliability concerns during voltage transients. In base station line cards, sudden load shifts can cause supply spikes beyond 17V, risking damage. Always include transient voltage suppression (TVS) diodes and input capacitors near the device’s VIN pin. Use a small ferrite bead for additional filtering, but avoid excessive impedance that could affect internal reference stability. Monitor startup behavior in brown-out conditions, as low-voltage lockout (UVLO) thresholds are not user-adjustable. Validate with dynamic load testing across the full operating temperature range.

What PCB layout best practices minimize measurement errors when using the LM25066PSQ/NOPB for precision current sensing?

To maintain accuracy in current sensing with the LM25066PSQ/NOPB, use Kelvin (4-wire) connections to the external sense resistor, routing differential sense traces as tightly coupled pairs directly to the SENSE+/SENSE− pins. Keep these traces away from switching nodes or high-current paths to prevent noise coupling. Use a guard ring around the sense traces connected to ground if necessary. Place the sense resistor close to the load and device, and avoid vias in high-impedance analog paths. The 24-WQFN (4x5) package’s exposed pad must be soldered to a solid ground plane for thermal and electrical stability. These steps reduce offset and drift errors that can exceed 2–3% otherwise.

What are the long-term reliability concerns with the LM25066PSQ/NOPB in humid environments, given its MSL 3 (168-hour) rating?

With an MSL 3 rating, the LM25066PSQ/NOPB is susceptible to moisture absorption, leading to package cracking or wire bond failure during solder reflow if not handled properly. Boards stored in high-humidity environments must follow JEDEC guidelines: bake the device at 125°C for 24 hours if exposed beyond 168 hours at ambient conditions above 30°C/60% RH. For field reliability, conformal coating or sealed enclosures are advised in outdoor base station applications. Ensure the PCB design includes proper creepage and clearance distances, and avoid condensation-prone locations. Use humidity indicators in storage and production to track environmental exposure.

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