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ISO7821LLDW
Texas Instruments
DGTL ISO 5700VRMS 2CH GP 16SOIC
25480 Pcs New Original In Stock
General Purpose Digital Isolator 5700Vrms 2 Channel 100Mbps 100kV/µs CMTI 16-SOIC (0.295", 7.50mm Width)
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5.0 / 5.0
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ISO7821LLDW
Product Overview
1341904
DiGi Electronics Part Number
ISO7821LLDW-DGManufacturer
Texas Instruments
ISO7821LLDW
Description
DGTL ISO 5700VRMS 2CH GP 16SOICInventory
25480 Pcs New Original In Stock
General Purpose Digital Isolator 5700Vrms 2 Channel 100Mbps 100kV/µs CMTI 16-SOIC (0.295", 7.50mm Width)
Quantity
Minimum 1
Minimum 1
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ISO7821LLDW Technical Specifications
Category
Digital Isolators
Packaging
-
Series
-
Product Status
Active
Technology
Capacitive Coupling
Type
General Purpose
Isolated Power
No
Number of Channels
2
Inputs - Side 1/Side 2
1/1
Channel Type
Unidirectional
Voltage - Isolation
5700Vrms
Common Mode Transient Immunity (Min)
100kV/µs
Data Rate
100Mbps
Propagation Delay tpLH / tpHL (Max)
25ns, 25ns
Pulse Width Distortion (Max)
4.5ns
Rise / Fall Time (Typ)
-
Voltage - Supply
2.25V ~ 5.5V
Operating Temperature
-55°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
16-SOIC (0.295", 7.50mm Width)
Supplier Device Package
16-SOIC
Base Product Number
ISO7821
Datasheet & Documents
Manufacturer Product Page
ISO7821LLDW Specifications
HTML Datasheet
ISO7821LLDW-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
2 (1 Year)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8542.39.0001
Additional Information
Standard Package
40
Alternative Parts
PART NUMBER
MANUFACTURER
QUANTITY AVAILABLE
DiGi PART NUMBER
UNIT PRICE
SUBSTITUTE TYPE
Reviews
5.0/5.0-(Show up to 5 Ratings)
de desembre 02, 2025
구매 후에 궁금한 점이 생겼을 때 빠른 답변을 받아서 편했고, 상담원이 친절해서 좋아요.
de desembre 02, 2025
Their dedication to quality makes me feel valued as a customer.
de desembre 02, 2025
Prompt shipment and sturdy packaging demonstrated their professionalism.
de desembre 02, 2025
Reliable products and honest pricing make my shopping experience highly positive.
de desembre 02, 2025
The fast dispatch times allow us to plan our production schedules accurately.
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Frequently Asked Questions (FAQ)
When designing in the ISO7821LLDW, how can I ensure reliable signal integrity in high-noise industrial motor control applications with fast common-mode transients?
To ensure reliable signal integrity with the ISO7821LLDW in noisy environments, leverage its 100kV/μs common-mode transient immunity (CMTI) by minimizing PCB parasitic capacitance across isolation barriers. Use a solid ground plane split between isolated sides and route high-speed signals orthogonally to reduce crosstalk. Keep input traces short and consider adding series resistors (22–33Ω) near the ISO7821LLDW inputs to damp ringing. Also, bypass each VDD pin with a 0.1μF ceramic capacitor close to the device to maintain stable supply during fast switching events, ensuring robust performance in motor control systems operating up to 125°C.
Can the ISO7821LLDW replace the Si86201ED-AD1 in a bidirectional I2C isolation circuit, and what design changes are needed?
The ISO7821LLDW cannot directly replace the Si86201ED-AD1 in a bidirectional I2C line because it features unidirectional channels only, whereas I2C requires bidirectional signaling. To use the ISO7821LLDW in such a design, you must implement external circuitry like a direction-sensing logic or use a bidirectional buffer configuration with discrete FETs. Consider migrating to TI's ISO1541 or ISO1540 for native I2C support. If space and cost allow, the ISO7821LLDW can isolate other unidirectional signals in the same system while offloading bidirectional isolation to a dedicated device.
What are the thermal and electrical trade-offs when operating the ISO7821LLDW at 5.5V supply with 100Mbps data rates in a compact, sealed enclosure?
Operating the ISO7821LLDW at 5.5V and maximum 100Mbps data rates increases dynamic power dissipation, which can raise junction temperature in sealed enclosures with limited airflow. Estimate total power as P = C•V²•f × channels, where C includes internal load and PCB parasitics (~2pF). For worst-case, this can exceed 15mW per channel. Combine with thermal resistance of 16-SOIC (~150°C/W) to verify temperature rise stays within -55°C to 125°C junction limits. Mitigate risks by reducing data rate if possible, using lower supply (e.g. 3.3V), and ensuring copper pour for heat spreading. Monitor for timing margin loss due to thermal derating.
How does the capacitive coupling in the ISO7821LLDW compare to magnetic-based isolators like the ADuM1201 in terms of EMI sensitivity and long-term reliability?
The ISO7821LLDW's capacitive coupling is inherently less susceptible to low-frequency magnetic interference than the ADuM1201’s transformer-based isolation, making it more stable in high-EMI environments near power converters. However, capacitive designs may couple more high-frequency noise through parasitic substrate paths—mitigate this with proper guard rings and isolation boundary layout. Long-term reliability favors the ISO7821LLDW due to absence of wear-out mechanisms in dielectric layers under normal conditions, unlike potential aging in magnetic cores. Both meet >50-year rated lifetimes at 5700Vrms, but TI's process shows lower drift over temperature and time in sustained partial discharge conditions.
What are the critical PCB layout practices to maintain 5700Vrms isolation rating with the ISO7821LLDW in medical-grade safety-compliant designs?
To maintain the full 5700Vrms isolation rating of the ISO7821LLDW in medical applications (e.g. IEC 60601), strictly adhere to creepage and clearance rules: ensure ≥8mm clearance across the isolation barrier (comparative tracking index CTI >600V). Use an internal ground plane split with a minimum 3mm spacing under the ISO7821LLDW, and avoid placing vias or metal traces within this region. Apply conformal coating to increase pollution degree tolerance. Route signal lines perpendicularly from pins to reduce arc risk. Verify layout compliance with DIN EN 60664-1 and validate with hi-pot testing at 1.2× working voltage. Include TI’s recommended 0.5mm minimum spacing from package edges to any conductive material.
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ISO7821LLDW CAD Models
Texas Instruments ISO7821LLDW PCB symbols & footprints
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