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ISO7761DBQ
Texas Instruments
DGTL ISO 3000VRMS 6CH GP 16SSOP
1641 Pcs New Original In Stock
General Purpose Digital Isolator 3000Vrms 6 Channel 100Mbps 85kV/µs CMTI 16-SSOP (0.154", 3.90mm Width)
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ISO7761DBQ
Product Overview
1300604
DiGi Electronics Part Number
ISO7761DBQ-DGManufacturer
Texas Instruments
ISO7761DBQ
Description
DGTL ISO 3000VRMS 6CH GP 16SSOPInventory
1641 Pcs New Original In Stock
General Purpose Digital Isolator 3000Vrms 6 Channel 100Mbps 85kV/µs CMTI 16-SSOP (0.154", 3.90mm Width)
Quantity
Minimum 1
Minimum 1
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ISO7761DBQ Technical Specifications
Category
Digital Isolators
Packaging
Tube
Series
ISO776x
Product Status
Active
Technology
Capacitive Coupling
Type
General Purpose
Isolated Power
No
Number of Channels
6
Inputs - Side 1/Side 2
5/1
Channel Type
Unidirectional
Voltage - Isolation
3000Vrms
Common Mode Transient Immunity (Min)
85kV/µs
Data Rate
100Mbps
Propagation Delay tpLH / tpHL (Max)
16ns, 16ns
Pulse Width Distortion (Max)
4.9ns
Rise / Fall Time (Typ)
1.1ns, 1.4ns
Voltage - Supply
2.25V ~ 5.5V
Operating Temperature
-55°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
16-SSOP (0.154", 3.90mm Width)
Supplier Device Package
16-SSOP
Base Product Number
ISO7761
Datasheet & Documents
Manufacturer Product Page
ISO7761DBQ Specifications
Design Resources
Digital Isolator Design Guide
HTML Datasheet
ISO7761DBQ-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
2 (1 Year)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8542.39.0001
Additional Information
Other Names
296-48812
ISO7761DBQ-DG
Standard Package
75
Reviews
5.0/5.0-(Show up to 5 Ratings)
de desembre 02, 2025
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de desembre 02, 2025
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de desembre 02, 2025
Loved how fast my order arrived and the secure packaging ensured safety.
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DiGi Electronics’ logistics tracking is seamless, giving me peace of mind.
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de desembre 02, 2025
Their packaging standards are exemplary and reflect a passion for quality.
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Ordering from DiGi Electronics is always hassle-free, thanks to their clear communication and fast dispatch.
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Frequently Asked Questions (FAQ)
Can the ISO7761DBQ safely replace the ADuM140D in a 3.3V industrial motor drive interface, and what design risks should I consider during the swap?
The ISO7761DBQ can replace the ADuM140D in many 3.3V motor drive applications due to its similar channel count (6), high CMTI (85kV/µs), and 3000Vrms isolation rating. However, the ISO7761DBQ lacks integrated isolated power, unlike some variants of the ADuM140D that support isoPower. If your design relies on the ADuM140D’s internal DC-DC converter, you’ll need an external isolated supply for the secondary side—increasing BOM complexity and board space. Additionally, verify timing margins: the ISO7761DBQ has a max propagation delay of 16ns per channel, which is faster than the ADuM140D’s typical 20–30ns, but ensure your system tolerates the tighter skew. Always validate EMI performance under load, as capacitive coupling (used in ISO7761DBQ) may respond differently to high dV/dt noise than magnetic isolation in the ADuM140D.
What are the key reliability concerns when using the ISO7761DBQ in a -40°C to 125°C automotive environment with frequent thermal cycling?
While the ISO7761DBQ is rated for -55°C to 125°C operation, long-term reliability in automotive thermal cycling environments hinges on PCB layout and moisture sensitivity. As an MSL 2 device, it requires baking if exposed to ambient humidity >60% RH before reflow, and improper handling can lead to popcorning during assembly. The 16-SSOP package has limited thermal mass, so ensure symmetrical copper pours on both sides to minimize warpage-induced stress on bond wires. Also, capacitive isolation barriers degrade slightly over time under sustained high voltage stress—TI specifies a 3000Vrms continuous rating, but derate to ≤2500Vrms in mission-critical automotive systems to extend lifetime. Monitor for increased propagation delay drift over temperature, which could affect timing-critical protocols like SPI daisy-chaining.
How does the ISO7761DBQ compare to the Silicon Labs Si8660BC-B-IS in terms of CMTI and real-world noise immunity in a 48V battery management system (BMS)?
In a 48V BMS with high-switching transients, the ISO7761DBQ’s 85kV/µs minimum CMTI outperforms the Si8660BC-B-IS’s typical 50kV/µs, making it more robust against false triggering during MOSFET switching events. However, the Si8660 uses RF-based isolation, which can offer better immunity to low-frequency magnetic fields common near inductors or transformers. The ISO7761DBQ’s capacitive architecture is more sensitive to common-mode noise coupling through parasitic capacitance, so maintain >8mm creepage distance on the PCB and use guard rings tied to the local ground on each side. For best results in BMS designs, pair the ISO7761DBQ with low-inductance ground planes and place bypass capacitors (<5mm from VCC pins) to suppress supply-borne transients that could couple into the isolation barrier.
Can I use the ISO7761DBQ for bidirectional communication on all six channels, or are there channel directionality constraints I might overlook?
No—the ISO7761DBQ has a fixed unidirectional channel configuration: five channels transmit from Side 1 to Side 2, and only one channel goes from Side 2 to Side 1. This asymmetric layout is critical for protocols like UART or SPI where master/slave directionality must be respected. Attempting to force bidirectional signaling (e.g., I²C) across any channel will fail because internal circuitry lacks direction-control logic or open-drain support. If your application requires true bidirectional isolation (e.g., for I²C), consider the ISO7741 (quad-channel with bidirectional capability) or add external pull-ups and level shifters. Misinterpreting this constraint is a common design-in error that leads to non-functional communication links, especially in mixed-voltage systems.
What layout practices are essential to maintain the 3000Vrms isolation rating of the ISO7761DBQ in a compact 2-layer PCB design for a medical power supply?
To preserve the ISO7761DBQ’s 3000Vrms isolation on a 2-layer board, enforce a minimum 8mm clearance (air gap) and 8mm creepage (surface distance) between primary and secondary side traces, per IEC 60601-1 for medical equipment. Avoid routing high-speed or high-voltage traces under the isolator’s package—even though it’s surface-mount, internal bond wires are close to the mold compound surface. Use a solid ground plane on Layer 2 but split it cleanly under the ISO7761DBQ with no copper bridging the isolation barrier. Place 0.1µF ceramic bypass caps on both VCC1 and VCC2 within 3mm of the pins to suppress transient coupling. Never route signals across the isolation gap on the same layer; instead, transition layers only on one side. These steps prevent partial discharge and ensure long-term dielectric integrity under sustained isolation stress.
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ISO7761DBQ CAD Models
Texas Instruments ISO7761DBQ PCB symbols & footprints
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