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ISO7142CCQDBQRQ1
Texas Instruments
DGTL ISO 2500VRMS 4CH 16SSOP
72990 Pcs New Original In Stock
General Purpose Digital Isolator 2500Vrms 4 Channel 50Mbps 25kV/µs CMTI 16-SSOP (0.154", 3.90mm Width)
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ISO7142CCQDBQRQ1
Product Overview
1356809
DiGi Electronics Part Number
ISO7142CCQDBQRQ1-DGManufacturer
Texas Instruments
ISO7142CCQDBQRQ1
Description
DGTL ISO 2500VRMS 4CH 16SSOPInventory
72990 Pcs New Original In Stock
General Purpose Digital Isolator 2500Vrms 4 Channel 50Mbps 25kV/µs CMTI 16-SSOP (0.154", 3.90mm Width)
Quantity
Minimum 1
Minimum 1
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ISO7142CCQDBQRQ1 Technical Specifications
Category
Digital Isolators
Packaging
Cut Tape (CT) & Digi-Reel®
Series
-
Product Status
Active
Technology
Capacitive Coupling
Type
General Purpose
Isolated Power
No
Number of Channels
4
Inputs - Side 1/Side 2
2/2
Channel Type
Unidirectional
Voltage - Isolation
2500Vrms
Common Mode Transient Immunity (Min)
25kV/µs
Data Rate
50Mbps
Propagation Delay tpLH / tpHL (Max)
38ns, 38ns
Pulse Width Distortion (Max)
3.5ns
Rise / Fall Time (Typ)
2.5ns, 2.1ns
Voltage - Supply
2.7V ~ 5.5V
Grade
Automotive
Qualification
AEC-Q100
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
16-SSOP (0.154", 3.90mm Width)
Supplier Device Package
16-SSOP
Base Product Number
ISO7142
Datasheet & Documents
Design Resources
Digital Isolator Design Guide
HTML Datasheet
ISO7142CCQDBQRQ1-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
2 (1 Year)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8542.39.0001
Additional Information
Other Names
-296-43395-1-DG
2156-ISO7142CCQDBQRQ1
296-43395-6
296-43395-2
ISO7142CCQDBQRQ1-DG
296-43395-1
TEXTISISO7142CCQDBQRQ1
Standard Package
2,500
Alternative Parts
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MANUFACTURER
QUANTITY AVAILABLE
DiGi PART NUMBER
UNIT PRICE
SUBSTITUTE TYPE
Reviews
5.0/5.0-(Show up to 5 Ratings)
de desembre 02, 2025
포장 품질이 뛰어나고, 배송 상태도 꼼꼼하게 알려줘서 만족스럽네요.
de desembre 02, 2025
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de desembre 02, 2025
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Frequently Asked Questions (FAQ)
What are the key design risks when integrating the ISO7142CCQDBQRQ1 into an automotive 4-channel isolation circuit with fast switching signals?
When integrating the ISO7142CCQDBQRQ1 in automotive applications with fast-switching signals, a primary risk is exceeding the propagation delay matching limits (max 38ns tpLH/tpHL) across channels, which can cause timing skew in control loops such as motor phase drivers. To mitigate, ensure tight PCB layout symmetry—match trace lengths on both sides of the isolator and minimize capacitive loading. Additionally, leverage its 25kV/µs CMTI rating to reject noise in high di/dt environments, but validate with real-world transient testing on the final board, especially when interfacing with IGBT or SiC gate drivers. Always decouple each VDD pin with a 0.1µF ceramic capacitor close to the supply pin to maintain signal integrity at up to 50Mbps data rates.
Can the ISO7142CCQDBQRQ1 replace the SI8642BB-B-IU in an existing design, and what are the critical compatibility concerns?
The ISO7142CCQDBQRQ1 can generally replace the SI8642BB-B-IU in 4-channel unidirectional isolation applications, but key differences must be addressed. First, the ISO7142CCQDBQRQ1 uses capacitive coupling versus the Si8642’s magnetic isolation, which affects common-mode transient immunity behavior—it’s critical to verify CMTI performance under fast ground shifts. Second, supply voltage ranges are similar (2.7V–5.5V), but the TI device has faster rise/fall times (2.5ns/2.1ns typ), which may expose previously hidden PCB parasitics. Check pin-to-pin compatibility (both 16-SSOP) and ensure the unidirectional channel configuration (2/2) matches the interface directionality in your system. Finally, confirm AEC-Q100 qualification levels (grade 1) are equivalent for your temperature requirements (-40°C to 125°C).
How does the lack of isolated power in the ISO7142CCQDBQRQ1 impact system design, and what should engineers watch out for?
Since the ISO7142CCQDBQRQ1 does not include isolated power, engineers must separately provide isolated DC-DC converters (e.g., SN6505-based or flyback regulators) for the secondary-side supply rail. A common design pitfall is introducing ground loops or noise coupling through poor isolation boundary planning. Ensure clear separation between primary and secondary ground domains, and route the isolated supply traces away from high-speed digital lines to prevent EMI. Use low-ESR ceramic capacitors on both VDD1 and VDD2 to stabilize the supply under transient loads. Failing to properly manage isolated power can compromise the 2500Vrms isolation rating and lead to long-term reliability issues, especially in extended temperature environments.
What reliability concerns should be considered when using the ISO7142CCQDBQRQ1 in high-temperature automotive underhood applications?
While the ISO7142CCQDBQRQ1 is rated for -40°C to 125°C and AEC-Q100 qualified, long-term reliability in underhood applications depends on managing thermal stress and PCB interconnect fatigue. Operate below the maximum junction temperature by ensuring adequate PCB copper for heat dissipation—especially critical due to its 3.90mm-wide 16-SSOP package with limited thermal pad. Avoid conformal coating over the package that may trap heat, and verify solder joint reliability under thermal cycling. Additionally, monitor humidity exposure; though the device is MSL2 rated, prolonged high-humidity operation without proper board-level sealing increases risk of leakage currents across the isolation barrier. Perform HALT testing to validate robustness in your specific thermal environment.
What layout practices are recommended to preserve signal integrity when running the ISO7142CCQDBQRQ1 at its maximum 50Mbps data rate?
To maintain signal integrity at 50Mbps with the ISO7142CCQDBQRQ1, follow stringent high-speed layout practices: keep all signal traces as short and straight as possible, avoiding 90-degree bends (use 45° or curved routes). Use a solid ground plane beneath signal layers and preserve the isolation boundary with a minimum 0.5mm creepage/clearance gap. Route high-speed signals on outer PCB layers with controlled impedance where possible. Terminate signals only if trace lengths exceed 5cm to prevent reflections, and always place 0.1µF decoupling capacitors within 2mm of each VDD pin. Use guard rings around critical nodes if noise coupling is suspected. Simulate channel performance with extracted parasitics to validate pulse width distortion stays below the 3.5ns max limit under real conditions.
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ISO7142CCQDBQRQ1 CAD Models
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