F280049PZSR >
F280049PZSR
Texas Instruments
IC MCU 32BIT 256KB FLASH 100LQFP
9105 Pcs New Original In Stock
C28x C2000™ C28x Piccolo™ Microcontroller IC 32-Bit Single-Core 100MHz 256KB (256K x 8) FLASH 100-LQFP (14x14)
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F280049PZSR Texas Instruments
5.0 / 5.0 - (448 Ratings)

F280049PZSR

Product Overview

1323475

DiGi Electronics Part Number

F280049PZSR-DG

Manufacturer

Texas Instruments
F280049PZSR

Description

IC MCU 32BIT 256KB FLASH 100LQFP

Inventory

9105 Pcs New Original In Stock
C28x C2000™ C28x Piccolo™ Microcontroller IC 32-Bit Single-Core 100MHz 256KB (256K x 8) FLASH 100-LQFP (14x14)
Quantity
Minimum 1

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F280049PZSR Technical Specifications

Category Embedded, Microcontrollers

Manufacturer Texas Instruments

Packaging -

Series C2000™ C28x Piccolo™

Product Status Active

DiGi-Electronics Programmable Not Verified

Core Processor C28x

Core Size 32-Bit Single-Core

Speed 100MHz

Connectivity CANbus, I2C, LINbus, SCI, SPI, UART/USART

Peripherals Brown-out Detect/Reset, POR, PWM, WDT

Number of I/O 40

Program Memory Size 256KB (256K x 8)

Program Memory Type FLASH

EEPROM Size -

RAM Size 100K x 8

Voltage - Supply (Vcc/Vdd) 1.14V ~ 1.32V

Data Converters A/D 21x12b; D/A 2x12b

Oscillator Type Internal

Operating Temperature -40°C ~ 125°C (TJ)

Mounting Type Surface Mount

Supplier Device Package 100-LQFP (14x14)

Package / Case 100-LQFP

Base Product Number F280049

Datasheet & Documents

Manufacturer Product Page

F280049PZSR Specifications

HTML Datasheet

F280049PZSR-DG

Environmental & Export Classification

RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991A2
HTSUS 8542.31.0001

Additional Information

Standard Package
1,000

Reviews

5.0/5.0-(Show up to 5 Ratings)
Papier***agesse
de desembre 02, 2025
5.0
Je ne peux que recommander cette entreprise pour leur sérieux et leur souci du détail.
Sere***hores
de desembre 02, 2025
5.0
Their attention to shipment details ensures my products arrive in perfect condition every time.
Golde***rizon
de desembre 02, 2025
5.0
Their shipping schedule is precise, and the packaging is always secure and intact.
Grac***dGrit
de desembre 02, 2025
5.0
Their responsive after-sales team shows genuine care for their customers.
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Frequently Asked Questions (FAQ)

Can the F280049PZSR microcontroller handle real-time motor control applications with high-resolution PWM requirements, and what are the key limitations when replacing older C2000 Piccolo devices like the F28027F?

Yes, the F280049PZSR is well-suited for real-time motor control due to its 100MHz C28x core, high-resolution PWM modules (HRPWM), and on-chip analog comparators. However, when replacing legacy parts like the F28027F, engineers must verify memory mapping differences—especially in flash wait states and RAM allocation—and re-validate interrupt latency under load. The F280049PZSR uses a different clocking architecture, so existing PLL configurations may require adjustment to maintain deterministic timing. Always re-run control loop simulations using the new device’s ADC sampling jitter and PWM edge resolution characteristics.

What are the critical thermal and layout considerations when designing a high-density PCB with the F280049PZSR in a 100-LQFP package, especially for industrial environments operating near 125°C junction temperature?

The F280049PZSR’s 100-LQFP (14x14 mm) package has limited thermal dissipation, so proper PCB layout is essential. Use a 4-layer board with an internal ground plane directly beneath the IC to act as a heat spreader, and connect all thermal vias under the exposed pad (if present) or use thermal relief on power/ground pins. Avoid routing high-speed signals (e.g., PWM, ADC) near noisy digital lines to prevent cross-talk that increases dynamic power and localized heating. In industrial settings, derate the maximum operating frequency if ambient temperatures exceed 85°C, as self-heating can push TJ beyond 125°C even with nominal VDD. Monitor MSL 3 handling requirements to prevent moisture-induced delamination during reflow.

How does the F280049PZSR compare to the newer F280039CPZSR in terms of peripheral compatibility and long-term supply risk for existing designs?

While the F280039CPZSR offers enhanced features like a CLA (Control Law Accelerator) and higher flash density, it is not a drop-in replacement for the F280049PZSR due to differences in pinout, memory map, and peripheral register layouts. The F280049PZSR remains a stable, actively supported part with strong long-term availability from Texas Instruments, making it lower risk for production continuity. If your design doesn’t require the CLA or extra math acceleration, sticking with the F280049PZSR avoids costly firmware revalidation. However, if future scalability is a concern, consider migrating early—TI’s C2000 migration guides provide detailed cross-reference tables, but expect at least 2–4 weeks of firmware adaptation effort.

Is the internal oscillator of the F280049PZSR sufficiently accurate for CAN communication in automotive or industrial networks without an external crystal?

The F280049PZSR’s internal oscillator typically has ±1.5% accuracy over temperature and voltage, which falls short of the ±1% requirement for reliable CAN bus operation per ISO 11898-1. While it may work in non-critical LIN or low-speed UART applications, we strongly recommend using an external ±0.5% or better crystal oscillator for any CAN-based design. Skipping the crystal introduces risk of bit timing errors, especially in multi-node networks or under thermal stress. If cost or space constraints prevent an external crystal, implement robust error handling in software and validate communication integrity across the full -40°C to 125°C range using a CAN analyzer.

What reliability risks should I consider when using the F280049PZSR in safety-critical applications like solar inverters or EV charging stations, particularly regarding flash endurance and brown-out behavior?

The F280049PZSR’s embedded flash is rated for 20,000 program/erase cycles—insufficient for frequent firmware updates in field-deployed systems. For safety-critical roles, implement wear-leveling in software or use external non-volatile memory for configuration logs. More critically, while the device includes brown-out detect (BOD), its response time (~1–2 µs) may not be fast enough to prevent corruption during rapid voltage droops common in power electronics. Always pair it with an external voltage supervisor (e.g., TPS3823) set to trip slightly above the BOD threshold to ensure clean resets. Additionally, enable the built-in watchdog timer and CRC modules, and follow IEC 60730 Class B guidelines for self-test routines if targeting functional safety certification.

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