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DP83867ISRGZR
Texas Instruments
IC CONTROLLER ETHERNET 48VQFN
8913 Pcs New Original In Stock
Ethernet Physical Layer Controller 10/100/1000 Base-TX PHY Serial Interface 48-VQFN (7x7)
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5.0 / 5.0
- (167 Ratings)
DP83867ISRGZR
Product Overview
1430958
DiGi Electronics Part Number
DP83867ISRGZR-DGManufacturer
Texas Instruments
DP83867ISRGZR
Description
IC CONTROLLER ETHERNET 48VQFNInventory
8913 Pcs New Original In Stock
Ethernet Physical Layer Controller 10/100/1000 Base-TX PHY Serial Interface 48-VQFN (7x7)
Quantity
Minimum 1
Minimum 1
Purchase and inquiry
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DP83867ISRGZR Technical Specifications
Category
Interface, Controllers
Packaging
Cut Tape (CT) & Digi-Reel®
Series
-
Product Status
Active
DiGi-Electronics Programmable
Not Verified
Protocol
Ethernet
Function
Physical Layer Controller
Interface
Serial
Standards
10/100/1000 Base-TX PHY
Voltage - Supply
1.1V, 2.5V
Current - Supply
157mA
Operating Temperature
-40°C ~ 85°C
Package / Case
48-VFQFN Exposed Pad
Supplier Device Package
48-VQFN (7x7)
Base Product Number
DP83867
Datasheet & Documents
Manufacturer Product Page
DP83867ISRGZR Specifications
HTML Datasheet
DP83867ISRGZR-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8542.39.0001
Additional Information
Other Names
296-48906-6
296-48906-2
296-48906-1
DP83867ISRGZR-DG
Standard Package
2,500
Alternative Parts
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MANUFACTURER
QUANTITY AVAILABLE
DiGi PART NUMBER
UNIT PRICE
SUBSTITUTE TYPE
Reviews
5.0/5.0-(Show up to 5 Ratings)
de desembre 02, 2025
Commande arrivée plus tôt que prévu et support très aimable. Parfait!
de desembre 02, 2025
Très satisfait de la rapidité de l’expédition. Les produits sont extrêmement durables et performants dans le cadre de projets à long terme.
de desembre 02, 2025
物流が非常に効率的で、注文後も追跡情報をきちんと提供してくれるため、安心して待つことができました。
de desembre 02, 2025
Their affordability is perfect for gamers who want reliable equipment without high prices.
de desembre 02, 2025
Support staff is professional and always eager to help.
de desembre 02, 2025
Great to see a company that cares about eco-friendliness and affordability.
de desembre 02, 2025
Their affordable prices and efficiency make my shopping experience perfect.
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Frequently Asked Questions (FAQ)
What are the key design-in considerations when using the DP83867ISRGZR in a space-constrained industrial application with tight power budgets?
When integrating the DP83867ISRGZR in space-constrained and power-sensitive industrial designs, prioritize managing its dual 1.1V and 2.5V supply requirements efficiently. Use low-dropout regulators (LDOs) or a compact PMIC to minimize footprint. Ensure proper thermal dissipation via the exposed pad—connect it to a solid ground plane using multiple vias. Be cautious of signal integrity with the 10/100/1000 Base-TX PHY: route differential pairs (MDI) with controlled impedance (~100Ω) and length matching to avoid EMI in noisy environments. Also verify that the serial interface (e.g., RMII or SGMII) is fully supported by your host processor, as misconfiguration can lead to link instability under temperature variation from -40°C to 85°C.
Can the DP83867ISRGZR reliably replace the DP83867IRRGZR in an existing networked embedded system without hardware modifications?
Yes, the DP83867ISRGZR can generally replace the DP83867IRRGZR without PCB changes, as both share the same 48-VQFN (7x7 mm) footprint, pinout, and electrical specs. However, note the S-variant may have slightly different default strap pin configurations—verify that your resistor strapping on PWR_MGMT and MODE pins aligns with the S-variant's datasheet to ensure identical boot-up behavior (e.g., master/slave mode, PHY address). Also confirm firmware compatibility, especially if using auto-negotiation or energy-detect features, to prevent link formation delays or incompatibility with 1000BASE-T switches.
What are the risks of using the DP83867ISRGZR in high-humidity environments, and how can I improve long-term reliability?
The DP83867ISRGZR has an MSL rating of 3 (168-hour floor life), indicating sensitivity to moisture during assembly. In high-humidity operating environments, ensure the device is baked before reflow if exposed beyond the MSL limit to avoid 'popcorn' cracking. Post-assembly, use conformal coating on the PCB to protect against condensation, especially near the transformer and RJ-45 connector. Monitor the junction temperature—thermal stress combined with humidity can accelerate corrosion or leakage currents. Also, avoid placing the DP83867ISRGZR near heat-generating components to maintain operation within -40°C to 85°C ambient range and avoid thermal derating issues.
How does the DP83867ISRGZR handle electromagnetic compatibility (EMC) in automotive or factory automation applications, and what layout techniques reduce emissions?
The DP83867ISRGZR typically performs well in EMC-critical applications like automotive or industrial automation, but layout is crucial. To reduce radiated emissions, tightly couple the MDI differential pairs to ground and include common-mode chokes rated for Gigabit Ethernet. Use a continuous ground plane beneath the DP83867ISRGZR and avoid splits under the VQFN exposed pad. Place 0.1µF decoupling capacitors as close as possible to each power pin (1.1V and 2.5V) and use a low-inductance path to ground. Additionally, consider enabling the DP83867ISRGZR's internal EEE (Energy Efficient Ethernet) and slew rate control features via strap pins or software to minimize high-frequency energy, especially in systems near sensitive RF receivers.
What are common pitfalls when interfacing the DP83867ISRGZR with an FPGA or microcontroller lacking integrated Gigabit Ethernet MAC, and how can they be avoided?
A common pitfall when using the DP83867ISRGZR with an external MAC (e.g., in FPGA-based systems) is clock domain mismatch or interface signal skew. Ensure the DP83867ISRGZR's reference clock (25 MHz or 50 MHz, depending on configuration) is stable and low-jitter; use a dedicated oscillator instead of a PLL-generated clock when possible. For SGMII or RGMII interface modes, strictly follow setup/hold timing—route clock and data lines with matched trace lengths and controlled impedance. In FPGAs, use IDELAY elements to align internal timing, and double-check MDIO bus pull-ups and polling intervals to avoid initialization failures. Finally, validate auto-negotiation with your switch gear—if link instability occurs, consider forcing a fixed link speed via strap pins for deterministic behavior.
Quality Assurance (QC)
DiGi ensures the quality and authenticity of every electronic component through professional inspections and batch sampling, guaranteeing reliable sourcing, stable performance, and compliance with technical specifications, helping customers reduce supply chain risks and confidently use components in production.
DP83867ISRGZR CAD Models
Texas Instruments DP83867ISRGZR PCB symbols & footprints
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