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DM8107AAAR21
Texas Instruments
IC DGTL MEDIA PROCESSOR 609FCBGA
1372 Pcs New Original In Stock
Embedded, Integrated Circuits (ICs)
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*Quantity
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Minimum 1
5.0 / 5.0
- (185 Ratings)
DM8107AAAR21
Product Overview
1431739
DiGi Electronics Part Number
DM8107AAAR21-DGManufacturer
Texas Instruments
DM8107AAAR21
Description
IC DGTL MEDIA PROCESSOR 609FCBGAInventory
1372 Pcs New Original In Stock
Embedded, Integrated Circuits (ICs)
Quantity
Minimum 1
Minimum 1
Purchase and inquiry
Warranty & Returns
How to Order
Shipping & Delivery
Quality Assurance
365 - Day Quality Guarantee - Every part fully backed.
90 - Day Refund or Exchange - Defective parts? No hassle.
Limited Stock, Order Now - Get reliable parts without worry.
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DM8107AAAR21 Technical Specifications
Category
Embedded, DSP (Digital Signal Processors)
Packaging
-
Series
-
Product Status
Last Time Buy
Mounting Type
Surface Mount
Package / Case
-
Supplier Device Package
609-FCBGA
Base Product Number
DM8107
Datasheet & Documents
HTML Datasheet
DM8107AAAR21-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
REACH Status
REACH Unaffected
ECCN
5A992C
HTSUS
8542.31.0001
Additional Information
Other Names
296-41509
DM8107AAAR21-DG
Standard Package
90
Reviews
5.0/5.0-(Show up to 5 Ratings)
de desembre 02, 2025
Their affordable pricing doesn't compromise on sustainability—very commendable.
de desembre 02, 2025
Customer support at DiGi Electronics is prompt, friendly, and highly efficient.
de desembre 02, 2025
DiGi Electronics products have never disappointed me in terms of quality.
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Frequently Asked Questions (FAQ)
What are the key design-in risks when using the DM8107AAAR21 in a new embedded video processing application given its Last Time Buy status?
The DM8107AAAR21 being in Last Time Buy means no future production runs are planned, posing significant long-term supply chain risk. For new designs, this increases obsolescence risk, making end-of-life planning essential. We recommend securing sufficient inventory for the product lifecycle or initiating a migration path to a pin- or function-compatible successor such as TI’s TCI6630 or similar heterogeneous SoCs. Consider multi-sourcing strategies or buffer stocking to mitigate production interruptions, especially in industrial or transportation applications with long service lifespans.
How does the 609-FCBGA package of the DM8107AAAR21 impact PCB layout and thermal management in high-density embedded systems?
The 609-FCBGA package requires careful attention to PCB layer count, via-in-pad design, and thermal vias under the exposed thermal pad to ensure proper heat dissipation. Due to its large pin count and fine pitch, we recommend a minimum 8-layer board with controlled impedance routing and a solid ground plane structure. Use thermal simulation to validate junction-to-board heat transfer, especially in sealed or convection-cooled enclosures. Poor layout can lead to signal integrity issues and premature DM8107AAAR21 failure under sustained video encoding loads.
Can the DM8107AAAR21 be used as a drop-in replacement for the DM8168 in existing HD video surveillance designs, and what integration challenges should be expected?
The DM8107AAAR21 is not a direct drop-in replacement for the DM8168, despite both being part of TI's DaVinci™ family. Key differences include reduced ARM core count (single-core vs. dual-core) and lower maximum clock frequency, which impacts multi-channel encoding performance. You must revalidate your HD video pipeline, particularly for simultaneous 1080p30 streams. Additionally, power sequencing and boot configuration may require changes due to differences in SRAM and peripheral mapping. Recompilation of firmware and BIOS-level updates are typically required when migrating to the DM8107AAAR21.
What are the reliability concerns with the DM8107AAAR21 when operating at elevated ambient temperatures in automotive or industrial environments?
The DM8107AAAR21 has an MSL 3 rating (168-hour floor life), requiring careful handling during reflow assembly to avoid 'popcorning' or delamination in humid environments. When deployed in industrial or automotive settings with ambient temperatures exceeding 70°C, ensure active cooling or derating strategies, as sustained junction temperatures above 110°C can degrade video processing reliability over time. Implement watchdog timers and monitor power supply stability, especially on core rails, since voltage droop under video load can lead to silent firmware crashes. Avoid thermal cycling extremes that may fatigue BGA solder joints.
How does the processing architecture of the DM8107AAAR21 compare to competitive media processors like the NXP i.MX 6SoloX in terms of real-time video analytics support?
The DM8107AAAR21 leverages a heterogeneous architecture with a Cortex-A8 and dedicated HD video coprocessors, excelling in fixed-function encoding up to 1080p30, but lacks integrated real-time cores for concurrent analytics. In contrast, the NXP i.MX 6SoloX pairs an ARM Cortex-A9 with a Cortex-M4 for real-time tasks, offering better support for edge analytics such as motion detection or facial recognition without offloading. When using the DM8107AAAR21, additional external MCUs or host-side software optimization is often required to achieve similar real-time capabilities, increasing system complexity.
Quality Assurance (QC)
DiGi ensures the quality and authenticity of every electronic component through professional inspections and batch sampling, guaranteeing reliable sourcing, stable performance, and compliance with technical specifications, helping customers reduce supply chain risks and confidently use components in production.
DM8107AAAR21 CAD Models
Texas Instruments DM8107AAAR21 PCB symbols & footprints
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