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DAC8551IDGKR
Texas Instruments
IC DAC 16BIT V-OUT 8VSSOP
1600 Pcs New Original In Stock
16 Bit Digital to Analog Converter 1 8-VSSOP
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5.0 / 5.0
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DAC8551IDGKR
Product Overview
1433917
DiGi Electronics Part Number
DAC8551IDGKR-DGManufacturer
Texas Instruments
DAC8551IDGKR
Description
IC DAC 16BIT V-OUT 8VSSOPInventory
1600 Pcs New Original In Stock
16 Bit Digital to Analog Converter 1 8-VSSOP
Quantity
Minimum 1
Minimum 1
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DAC8551IDGKR Technical Specifications
Category
Data Acquisition, Digital to Analog Converters (DAC)
Packaging
Cut Tape (CT) & Digi-Reel®
Series
microPOWER™
Product Status
Active
DiGi-Electronics Programmable
Not Verified
Number of Bits
16
Number of D/A Converters
1
Settling Time
10µs
Output Type
Voltage - Buffered
Differential Output
No
Data Interface
SPI, DSP
Reference Type
External
Voltage - Supply, Analog
2.7V ~ 5.5V
Voltage - Supply, Digital
2.7V ~ 5.5V
INL/DNL (LSB)
±3, ±0.25
Architecture
String DAC
Operating Temperature
-40°C ~ 105°C
Package / Case
8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Supplier Device Package
8-VSSOP
Mounting Type
Surface Mount
Base Product Number
DAC8551
Datasheet & Documents
Manufacturer Product Page
DAC8551IDGKR Specifications
HTML Datasheet
DAC8551IDGKR-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8542.39.0001
Additional Information
Other Names
296-38925-6
296-38925-1
DAC8551IDGKR-DG
296-38925-2
Standard Package
2,500
Alternative Parts
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MANUFACTURER
QUANTITY AVAILABLE
DiGi PART NUMBER
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Reviews
5.0/5.0-(Show up to 5 Ratings)
de desembre 02, 2025
DiGi Electronics propose une grande disponibilité des composants, ce qui facilite la planification de mes projets.
de desembre 02, 2025
アフターサポートが充実していることが決め手でした。価格もお手頃です。
de desembre 02, 2025
Whenever I need parts quickly, DiGi Electronics delivers with their plentiful inventory and helpful support team.
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Frequently Asked Questions (FAQ)
What are the key reliability risks when using the DAC8551IDGKR in a high-vibration industrial environment, and how can layout or component choices mitigate them?
The DAC8551IDGKR is housed in an 8-VSSOP package with a small footprint, which is generally robust but can be susceptible to mechanical stress in high-vibration settings. To mitigate reliability risks, ensure the PCB uses a solid ground plane beneath the device, apply conformal coating to prevent microcracking of solder joints, and avoid placing heavy components nearby that could induce board flexing. Additionally, use low-profile solder joints and consider underfill if the application exceeds typical industrial vibration profiles (e.g., >5 Grms). The MSL 1 rating means no bake-out is required, simplifying assembly in harsh environments.
Can the DAC8551IDGKR safely replace an AD5662ARMZ-1REEL7 in a 3.3V battery-powered sensor node without redesigning the reference circuit?
While both the DAC8551IDGKR and AD5662ARMZ-1REEL7 are 16-bit voltage-output DACs with SPI interfaces and similar supply ranges (2.7V–5.5V), the AD5662 includes an internal reference, whereas the DAC8551IDGKR requires an external reference. Direct replacement without circuit changes will fail if the original design relied on the AD5662’s internal 2.5V reference. You must add a stable external reference (e.g., REF3025) and ensure its output noise and drift meet system accuracy needs. Also, verify that the settling time (10µs for DAC8551IDGKR vs. 7µs for AD5662) is acceptable for your update rate.
How does the string DAC architecture of the DAC8551IDGKR impact glitch energy and output stability in precision motor control applications compared to R-2R ladder types?
The DAC8551IDGKR uses a string DAC architecture, which inherently produces lower glitch energy than R-2R ladder DACs during code transitions—critical in motor control where voltage spikes can induce torque ripple or EMI. However, string DACs may exhibit slightly higher output impedance and sensitivity to capacitive loading. For best stability, keep the output trace short and add a small RC filter (e.g., 10Ω + 1nF) close to the DAC output to dampen high-frequency artifacts. Avoid long capacitive loads (>100pF) without buffering, as this can cause overshoot or ringing due to the internal buffer’s limited drive capability.
What design constraints should I consider when operating the DAC8551IDGKR near its -40°C lower temperature limit in an outdoor telemetry unit?
At -40°C, the DAC8551IDGKR remains functional per its operating range, but external components—especially the voltage reference and decoupling capacitors—can drift or degrade. Use a low-drift, cold-rated reference (e.g., MAX6126) with <5ppm/°C tempco, and select X7R or C0G/NP0 ceramic capacitors for decoupling, as X5R types can lose significant capacitance at low temperatures. Also, ensure the SPI clock integrity is maintained; signal rise/fall times may slow in cold environments, potentially violating timing margins. Add series termination resistors (22–33Ω) near the DAC to dampen reflections on long traces.
Is it safe to share a digital supply rail between the DAC8551IDGKR and a noisy microcontroller without degrading output accuracy, and what filtering is recommended?
Sharing a digital supply between the DAC8551IDGKR and a microcontroller is possible but risky due to digital switching noise coupling into the analog output. To maintain precision, use a dedicated LDO for the DAC’s analog supply (AVDD) and star-ground the analog and digital grounds at a single point near the DAC. Insert a ferrite bead (e.g., Murata BLM18AG102SN1) in series with AVDD and follow it with a 1µF X7R capacitor close to the pin. Avoid routing high-speed digital lines over the DAC’s ground plane, and ensure the SPI lines are properly terminated to prevent ringing that could affect internal logic thresholds.
Quality Assurance (QC)
DiGi ensures the quality and authenticity of every electronic component through professional inspections and batch sampling, guaranteeing reliable sourcing, stable performance, and compliance with technical specifications, helping customers reduce supply chain risks and confidently use components in production.
DAC8551IDGKR CAD Models
Texas Instruments DAC8551IDGKR PCB symbols & footprints
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