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DAC3482IRKDT
Texas Instruments
IC DAC 16BIT A-OUT 88WQFN
2979 Pcs New Original In Stock
16 Bit Digital to Analog Converter 2 88-WQFN-MR (9x9)
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5.0 / 5.0
- (162 Ratings)
DAC3482IRKDT
Product Overview
1438927
DiGi Electronics Part Number
DAC3482IRKDT-DGManufacturer
Texas Instruments
DAC3482IRKDT
Description
IC DAC 16BIT A-OUT 88WQFNInventory
2979 Pcs New Original In Stock
16 Bit Digital to Analog Converter 2 88-WQFN-MR (9x9)
Quantity
Minimum 1
Minimum 1
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DAC3482IRKDT Technical Specifications
Category
Data Acquisition, Digital to Analog Converters (DAC)
Packaging
Cut Tape (CT) & Digi-Reel®
Series
-
Product Status
Active
DiGi-Electronics Programmable
Not Verified
Number of Bits
16
Number of D/A Converters
2
Settling Time
10ns (Typ)
Output Type
Current - Unbuffered
Differential Output
Yes
Data Interface
LVDS - Parallel
Reference Type
External, Internal
Voltage - Supply, Analog
3.14V ~ 3.46V
Voltage - Supply, Digital
1.14V ~ 1.32V
INL/DNL (LSB)
±4, ±2
Architecture
Current Source
Operating Temperature
-40°C ~ 85°C
Package / Case
88-WQFN Exposed Pad
Supplier Device Package
88-WQFN-MR (9x9)
Mounting Type
Surface Mount
Base Product Number
DAC3482
Datasheet & Documents
HTML Datasheet
DAC3482IRKDT-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8542.39.0001
Additional Information
Other Names
296-DAC3482IRKDTDKR
-DAC3482IRKDT-NDR
-296-28978-1-DG
296-28978-6
296-28978-6-DG
2156-DAC3482IRKDT
296-28978-2
296-DAC3482IRKDTCT
296-28978-1
296-DAC3482IRKDTTR
296-28978-2-DG
296-28978-1-DG
TEXTISDAC3482IRKDT
Standard Package
250
Alternative Parts
PART NUMBER
MANUFACTURER
QUANTITY AVAILABLE
DiGi PART NUMBER
UNIT PRICE
SUBSTITUTE TYPE
Reviews
5.0/5.0-(Show up to 5 Ratings)
de desembre 02, 2025
환경을 생각하는 포장 방식과 빠른 배송 덕분에 재이용 의사가 확실히 들었어요.
de desembre 02, 2025
購入後の対応も素晴らしく、安心して長く使えます。
de desembre 02, 2025
DiGi Electronics turns tech shopping into a pleasant and affordable experience.
de desembre 02, 2025
Shipping is always faster than expected—greatly enhancing my shopping experience.
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Frequently Asked Questions (FAQ)
What are the key design risks when replacing the DAC3482IRKDT with a lower-cost 16-bit dual DAC like the AD9117 in a high-speed current-output application, and how can I mitigate them?
Replacing the DAC3482IRKDT with the AD9117 introduces several risks due to architectural and interface differences. The DAC3482IRKDT uses LVDS parallel input and unbuffered current output optimized for low glitch and fast settling (10ns typ), while the AD9117 uses CMOS/LVDS-selectable inputs and has different output compliance and dynamic performance. A direct drop-in replacement may cause timing mismatches, increased glitch energy, or degraded SFDR in RF applications. To mitigate, verify LVDS termination schemes match, re-evaluate output buffer requirements, and re-characterize settling time and linearity under your load conditions. Always validate with bench testing at full data rate and temperature extremes.
How does the unbuffered current output of the DAC3482IRKDT impact board layout and output stage design, especially when driving variable or capacitive loads?
The unbuffered current output of the DAC3482IRKDT requires careful output stage design because it lacks internal output amplifiers, making it sensitive to load impedance and parasitic capacitance. Driving capacitive loads (>10pF) can cause instability or ringing due to the high-impedance current source interacting with PCB parasitics. You must include a well-designed transimpedance or voltage buffer stage close to the DAC pins, use controlled-impedance traces, and minimize stubs. Additionally, ground return paths for the differential outputs must be symmetric to maintain matching and reduce EMI. Poor layout here directly impacts INL/DNL and dynamic performance, so follow TI’s reference layout and consider simulation with extracted parasitics.
Can the DAC3482IRKDT operate reliably in an industrial environment with ambient temperatures reaching 80°C, and what derating or thermal management is necessary given its 88-WQFN exposed pad package?
Yes, the DAC3482IRKDT is rated for -40°C to 85°C operation, so 80°C ambient is within spec, but thermal management is critical due to power dissipation in the 88-WQFN exposed pad package. At high data rates and full-scale output current, junction temperature can exceed safe limits without proper heatsinking. You must ensure the exposed pad is soldered to a sufficiently large thermal plane with multiple vias to inner or bottom layers. TI recommends a 4-layer board with 2 oz copper and thermal vias under the pad. Monitor TJ using θJA from the datasheet and consider airflow if power exceeds ~1W. Neglecting this can lead to thermal shutdown or long-term reliability issues due to MSL3 moisture sensitivity during assembly.
What are the pitfalls of using the internal reference of the DAC3482IRKDT versus an external precision reference like the REF5025, and how does this choice affect system-level accuracy over temperature?
While the DAC3482IRKDT includes an internal reference, relying on it introduces risks in precision applications due to its limited initial accuracy and temperature drift compared to external references like the REF5025. The internal reference may drift significantly over the -40°C to 85°C range, directly impacting gain error and system calibration stability. For high-accuracy designs (e.g., medical or test equipment), use an external low-drift, low-noise reference such as the REF5025 (2.5V, ±0.05%, 3ppm/°C) and disable the internal reference. This improves long-term stability and reduces temperature-induced errors. Always validate total system error budget including reference drift, INL, and settling behavior under dynamic conditions.
How do I ensure signal integrity when routing the LVDS parallel interface to the DAC3482IRKDT in a multi-Gbps data acquisition system, and what layout mistakes commonly cause timing failures?
Ensuring signal integrity on the LVDS parallel interface to the DAC3482IRKDT requires strict differential pair routing with matched lengths (±5mil), controlled impedance (100Ω differential), and minimal vias. Common failures stem from unmatched trace lengths causing skew, poor ground return paths increasing jitter, or proximity to noisy digital lines inducing crosstalk. Use ground shielding between LVDS pairs and avoid crossing split planes. Terminate each pair at the receiver with 100Ω resistors close to the DAC3482IRKDT pins. Also, synchronize data capture with the internal PLL and validate setup/hold times using eye diagrams at full speed. Neglecting these can lead to data corruption, increased DNL, or failed synchronization—especially critical in interleaved or multi-DAC systems.
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DAC3482IRKDT CAD Models
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