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CY74FCT244ATQCT
Texas Instruments
IC BUF NON-INVERT 5.25V 20SSOP
2067 Pcs New Original In Stock
Buffer, Non-Inverting 2 Element 4 Bit per Element 3-State Output 20-SSOP
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5.0 / 5.0
- (481 Ratings)
CY74FCT244ATQCT
Product Overview
1252431
DiGi Electronics Part Number
CY74FCT244ATQCT-DGManufacturer
Texas Instruments
CY74FCT244ATQCT
Description
IC BUF NON-INVERT 5.25V 20SSOPInventory
2067 Pcs New Original In Stock
Buffer, Non-Inverting 2 Element 4 Bit per Element 3-State Output 20-SSOP
CAD Models - PCB Symbols & Footprints
Quantity
Minimum 1
Minimum 1
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CY74FCT244ATQCT Technical Specifications
Category
Logic, Buffers, Drivers, Receivers, Transceivers
Packaging
Cut Tape (CT)
Series
74FCT
Product Status
Active
Logic Type
Buffer, Non-Inverting
Number of Elements
2
Number of Bits per Element
4
Input Type
-
Output Type
3-State
Current - Output High, Low
32mA, 64mA
Voltage - Supply
4.75V ~ 5.25V
Operating Temperature
-40°C ~ 85°C (TA)
Mounting Type
Surface Mount
Package / Case
20-SSOP (0.154", 3.90mm Width)
Supplier Device Package
20-SSOP
Base Product Number
74FCT244
Datasheet & Documents
HTML Datasheet
CY74FCT244ATQCT-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
2 (1 Year)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8542.39.0001
Additional Information
Other Names
TEXTISCY74FCT244ATQCT
2156-CY74FCT244ATQCT
-CY74FCT244ATQCT-NDR
-CY74FCT244ATQCTG4-NDR
CY74FCT244ATQCTE4
-296-13854-1
CY74FCT244ATQCTG4-DG
CY74FCT244ATQCTE4-DG
296-13854-6
296-13854-5
-296-13854-1-DG
296-13854-5-DG
296-13854-2
296-13854-1
296-13854-2-NDR
-CY74FCT244ATQCTE4-NDR
-CY74FCT244ATQCTE4
CY74FCT244ATQCTG4
-CY74FCT244ATQCTG4
Standard Package
2,500
Alternative Parts
PART NUMBER
MANUFACTURER
QUANTITY AVAILABLE
DiGi PART NUMBER
UNIT PRICE
SUBSTITUTE TYPE
Reviews
5.0/5.0-(Show up to 5 Ratings)
de desembre 02, 2025
他們的交付流程非常高效，每次都能提前完成任務，提升我們的生產效率。
de desembre 02, 2025
長年のファンです。安定した品質と丁寧なサービスにいつも助けられています。
de desembre 02, 2025
Excellent support team that addresses issues swiftly and effectively.
de desembre 02, 2025
Their inventory updates are timely, reflecting real-time stock status.
de desembre 02, 2025
Their commitment to customer satisfaction is reflected in the quality of their products.
de desembre 02, 2025
Whenever I reach out for support, their response is immediate, demonstrating excellent after-sales service.
de desembre 02, 2025
Their responsive support team has helped me troubleshoot and resolve issues swiftly, saving time and hassle.
de desembre 02, 2025
DiGi Electronics always keeps their stock levels balanced, preventing shortages and overstock issues.
de desembre 02, 2025
I've been impressed by how durable their items are; they hold up perfectly through continuous use.
de desembre 02, 2025
Their professional and quick after-sales help minimizes my time troubleshooting issues and maximizes productivity.
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Frequently Asked Questions (FAQ)
What are the key reliability risks when using the CY74FCT244ATQCT in high-vibration industrial environments, and how can PCB layout mitigate them?
The CY74FCT244ATQCT, housed in a 20-SSOP package with a 3.90mm width, is susceptible to solder joint fatigue under sustained mechanical stress. In high-vibration applications such as motor control or automotive under-hood systems, repeated flexing can lead to cracked joints at the perimeter leads. To mitigate this, use a robust solder paste (e.g., SAC305 with no-clean flux), ensure full pad wetting, and implement strain relief via rigid-flex board design or conformal coating. Additionally, avoid placing the device near board edges or heavy components that induce bending moments. Thermal cycling between -40°C and 85°C exacerbates CTE mismatch, so anchoring vias around the package perimeter and using a ground plane beneath the IC improve mechanical stability and thermal dissipation.
Can the CY74FCT244ATQCT safely drive long backplane traces in legacy 5V TTL systems, and what termination strategy is recommended?
Yes, the CY74FCT244ATQCT can drive long backplane traces (up to 30 inches) in 5V TTL systems due to its strong output drive (32mA high, 64mA low) and 3-state capability, but uncontrolled transmission line effects may cause signal integrity issues like ringing and overshoot. For traces exceeding 6 inches, treat the line as transmission line and use series termination (e.g., 22–33Ω resistor at the driver output) to match source impedance and dampen reflections. Avoid parallel termination at the far end unless power consumption is not a concern, as it increases static current draw. Always verify signal integrity with TDR or eye diagram testing, especially when replacing older buffers like the SN74ALS244 without re-evaluating termination.
Is the CY74FCT244ATQCT a drop-in replacement for the NXP 74LVC244A in a 3.3V-powered system, and what pitfalls should I watch for?
No, the CY74FCT244ATQCT is not a safe drop-in replacement for the NXP 74LVC244A in 3.3V systems. While both are 8-bit non-inverting buffers, the CY74FCT244ATQCT requires a 4.75V to 5.25V supply and has TTL-compatible input thresholds (VIH ≈ 2.0V), which may not reliably recognize 3.3V logic high levels from modern CMOS outputs. Conversely, applying 3.3V to its inputs while powered at 5V risks exceeding absolute maximum ratings over time. If migrating from 74LVC244A, consider level-shifting or switch to a true 3.3V-compatible buffer like the SN74LVC244A. Always verify input voltage compatibility and avoid mixed-voltage operation unless level translation is explicitly designed in.
How does the 3-state output behavior of the CY74FCT244ATQCT impact hot-swapping or live-insertion applications, and what protection circuitry is advised?
The CY74FCT244ATQCT’s 3-state outputs allow high-impedance isolation when disabled, making it suitable for bus-sharing applications, but during hot-swapping, floating inputs or unintended enable states can cause bus contention or shoot-through currents. To prevent damage, ensure the OE (Output Enable) pin is actively driven (not left floating) and consider adding pull-down resistors (10kΩ) to default the output to high-Z during insertion. Additionally, place TVS diodes on I/O lines to clamp ESD events and use staggered pin connectors (ground first, then power, then signals) to minimize transient stress. Monitor inrush current if enabling the buffer immediately upon power-up, as simultaneous switching of all 8 outputs can cause localized voltage droop on the 5V rail.
What derating considerations apply to the CY74FCT244ATQCT when operating near its maximum temperature limit of 85°C in enclosed control panels?
When operating the CY74FCT244ATQCT near 85°C in enclosed environments, derating is essential due to reduced noise margin and increased propagation delay variation. Although the device is rated for -40°C to 85°C, sustained operation at top temperature accelerates electromigration and degrades output drive strength—especially critical when sourcing 32mA per pin. Reduce total output current by 20–30% and avoid simultaneous switching of all outputs to minimize self-heating. Ensure adequate airflow or thermal vias under the SSOP package to conduct heat to an internal ground plane. Also, verify that upstream/downstream logic families (e.g., 74HC or 74HCT) maintain valid noise margins at elevated temperatures, as threshold shifts can lead to logic errors even if the CY74FCT244ATQCT itself remains functional.
Quality Assurance (QC)
DiGi ensures the quality and authenticity of every electronic component through professional inspections and batch sampling, guaranteeing reliable sourcing, stable performance, and compliance with technical specifications, helping customers reduce supply chain risks and confidently use components in production.
CY74FCT244ATQCT CAD Models
Texas Instruments CY74FCT244ATQCT PCB symbols & footprints
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