CSD97394Q4M >
CSD97394Q4M
Texas Instruments
IC HALF BRIDGE DRIVER 20A 8VSON
20180 Pcs New Original In Stock
Half Bridge Driver Synchronous Buck Converters Power MOSFET 8-VSON (3.5x4.5)
Request Quote (Ships tomorrow)
*Quantity
Minimum 1
CSD97394Q4M Texas Instruments
5.0 / 5.0 - (242 Ratings)

CSD97394Q4M

Product Overview

1253614

DiGi Electronics Part Number

CSD97394Q4M-DG

Manufacturer

Texas Instruments
CSD97394Q4M

Description

IC HALF BRIDGE DRIVER 20A 8VSON

Inventory

20180 Pcs New Original In Stock
Half Bridge Driver Synchronous Buck Converters Power MOSFET 8-VSON (3.5x4.5)
Quantity
Minimum 1

Purchase and inquiry

Quality Assurance

365 - Day Quality Guarantee - Every part fully backed.

90 - Day Refund or Exchange - Defective parts? No hassle.

Limited Stock, Order Now - Get reliable parts without worry.

Global Shipping & Secure Packaging

Worldwide Delivery in 3-5 Business Days

100% ESD Anti-Static Packaging

Real-Time Tracking for Every Order

Secure & Flexible Payment

Credit Card, VISA, MasterCard, PayPal, Western Union, Telegraphic Transfer(T/T) and more

All payments encrypted for security

In Stock (All prices are in USD)
  • QTY Target Price Total Price
  • 1 4.3787 4.3787
Better Price by Online RFQ.
Request Quote (Ships tomorrow)
* Quantity
Minimum 1
(*) is mandatory
We'll get back to you within 24 hours

CSD97394Q4M Technical Specifications

Category Power Management (PMIC), Full Half-Bridge (H Bridge) Drivers

Manufacturer Texas Instruments

Packaging Cut Tape (CT) & Digi-Reel®

Series NexFET™

Product Status Active

Output Configuration Half Bridge

Applications Synchronous Buck Converters

Interface PWM

Load Type Inductive

Technology Power MOSFET

Rds On (Typ) -

Current - Output / Channel 20A

Current - Peak Output 45A

Voltage - Supply 4.5V ~ 5.5V

Voltage - Load 4.5V ~ 24V

Operating Temperature -40°C ~ 150°C (TJ)

Features Bootstrap Circuit

Fault Protection Shoot-Through, UVLO

Mounting Type Surface Mount

Package / Case 8-PowerVFDFN

Supplier Device Package 8-VSON (3.5x4.5)

Base Product Number CSD97394

Datasheet & Documents

Manufacturer Product Page

CSD97394Q4M Specifications

HTML Datasheet

CSD97394Q4M-DG

Environmental & Export Classification

RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 2 (1 Year)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.39.0001

Additional Information

Other Names
296-40020-2
2156-CSD97394Q4M
CSD97394Q4M-DG
296-40020-1
296-40020-6
-296-40020-1-DG
TEXTISCSD97394Q4M
Standard Package
2,500

Reviews

5.0/5.0-(Show up to 5 Ratings)
月***笑顔
de desembre 02, 2025
5.0
コストメリットと物流の効率性に大満足しています。
SeaSa***hores
de desembre 02, 2025
5.0
Great prices and friendly staff—my shopping experience is always excellent.
Mys***Path
de desembre 02, 2025
5.0
I am impressed with how smoothly DiGi Electronics handles shipping and delivery processes every time.
Oce***pray
de desembre 02, 2025
5.0
The company's commitment to excellent after-sales service boosts customer confidence.
Publish Evalution
* Product Rating
(Normal/Preferably/Outstanding, default 5 stars)
* Evalution Message
Please enter your review message.
Please post honest comments and do not post ilegal comments.

Frequently Asked Questions (FAQ)

Can I replace the CSD97394Q4M with a competitor half-bridge driver like the Infineon 2EDN752x series in a 12V-to-1.2V 20A synchronous buck converter without redesigning the gate drive layout?

Direct replacement of the CSD97394Q4M with the Infineon 2EDN752x (e.g., 2EDN7524F) is not recommended without careful evaluation. While both are half-bridge drivers, the CSD97394Q4M integrates NexFET™ MOSFETs and a bootstrap circuit optimized for high-side switching up to 24V, whereas the 2EDN752x is a discrete driver requiring external MOSFETs. The CSD97394Q4M’s monolithic integration reduces parasitic inductance and simplifies layout, but the 2EDN752x offers flexibility in MOSFET selection. Replacing it would require re-evaluating gate resistance, dead-time control, and PCB parasitics—especially critical at 20A loads—and may compromise efficiency or introduce shoot-through risk if not retuned. Always validate thermal performance and switching waveforms before committing to a drop-in replacement.

What are the key reliability risks when operating the CSD97394Q4M near its maximum junction temperature of 150°C in a compact, poorly ventilated industrial power supply?

Operating the CSD97394Q4M near 150°C TJ significantly increases long-term reliability risks, including accelerated electromigration, bond wire fatigue, and degradation of the internal power MOSFETs’ Rds(on). Even though the device is rated for -40°C to 150°C, sustained operation above 125°C reduces mean time between failures (MTBF) and may trigger thermal runaway under transient overloads. To mitigate this, ensure adequate copper pour under the 8-VSON package for heat spreading, avoid stacking high-power components nearby, and consider active cooling if ambient temperatures exceed 85°C. TI recommends derating output current by 20% above 125°C TJ for mission-critical applications—monitoring TJ via thermal modeling or IR imaging is strongly advised during prototype testing.

How does the integrated bootstrap circuit in the CSD97394Q4M affect dead-time optimization compared to discrete half-bridge drivers like the UCC27211?

The CSD97394Q4M’s integrated bootstrap circuit simplifies dead-time control by automatically managing high-side gate charge replenishment, but it imposes tighter constraints on minimum off-time and duty cycle. Unlike the UCC27211—which allows external adjustment of bootstrap refresh timing—the CSD97394Q4M’s internal circuitry requires the low-side FET to conduct long enough to recharge the bootstrap capacitor, typically limiting maximum duty cycles below 95%. This can be problematic in low-input-voltage, high-step-down-ratio applications (e.g., 5V to 0.8V). Designers must ensure the PWM controller enforces sufficient low-side conduction time; otherwise, high-side gate voltage droops, increasing Rds(on) and conduction losses. Always verify bootstrap behavior under light-load and startup conditions using an oscilloscope.

Is the CSD97394Q4M suitable for replacing a failed discrete MOSFET + driver solution in a legacy 48V telecom buck converter, and what layout changes are critical?

The CSD97394Q4M is not suitable for direct replacement in a 48V input application, as its maximum load voltage rating is 24V—exceeding this risks catastrophic failure due to avalanche breakdown. Even if the nominal input is 48V with transient spikes, the internal power MOSFETs cannot withstand the stress. For 48V systems, consider TI’s CSD97374Q4M (30V-rated) or external-driver solutions like the LM5106 with discrete 100V MOSFETs. If retrofitting a lower-voltage system (≤24V), the CSD97394Q4M can simplify design, but critical layout changes are needed: minimize loop area between VIN, SW, and PGND, use a solid ground plane, and place input capacitors within 2mm of the package. Poor layout negates the benefits of integration and increases EMI and switching losses.

What shoot-through protection mechanisms does the CSD97394Q4M implement, and can it tolerate accidental PWM overlap during fault conditions in a motor drive application?

The CSD97394Q4M includes built-in shoot-through protection via internal dead-time control and cross-conduction prevention logic, which blocks both high-side and low-side FETs from turning on simultaneously. However, this protection is effective only within specified PWM input timing margins (see datasheet Figure 10). In motor drive applications with inductive kickback or noisy PWM signals, accidental overlap can still occur if input rise/fall times exceed 10ns or if ground bounce disrupts logic thresholds. The device’s UVLO also disables outputs during power-up/down transients. To enhance robustness, add external RC filters on PWM inputs and ensure tight grounding between the controller and CSD97394Q4M. Never rely solely on internal protection—validate fault response with injected glitches during HALT testing.

Quality Assurance (QC)

DiGi ensures the quality and authenticity of every electronic component through professional inspections and batch sampling, guaranteeing reliable sourcing, stable performance, and compliance with technical specifications, helping customers reduce supply chain risks and confidently use components in production.

Quality Assurance
Counterfeit and defect prevention

Counterfeit and defect prevention

Comprehensive screening to identify counterfeit, refurbished, or defective components, ensuring only authentic and compliant parts are delivered.

Visual and packaging inspection

Visual and packaging inspection

Electrical performance verification

Verification of component appearance, markings, date codes, packaging integrity, and label consistency to ensure traceability and conformity.

Life and reliability evaluation

DiGi Certification
Blogs & Posts
CSD97394Q4M CAD Models
productDetail
Please log in first.
No account yet? Register