CDCM1804RGET >
CDCM1804RGET
Texas Instruments
IC CLK BUFFER 1:3 800MHZ 24VQFN
1189 Pcs New Original In Stock
Clock Fanout Buffer (Distribution), Divider, Multiplexer IC 1:3 800 MHz 24-VFQFN Exposed Pad
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CDCM1804RGET Texas Instruments
5.0 / 5.0 - (269 Ratings)

CDCM1804RGET

Product Overview

1253612

DiGi Electronics Part Number

CDCM1804RGET-DG

Manufacturer

Texas Instruments
CDCM1804RGET

Description

IC CLK BUFFER 1:3 800MHZ 24VQFN

Inventory

1189 Pcs New Original In Stock
Clock Fanout Buffer (Distribution), Divider, Multiplexer IC 1:3 800 MHz 24-VFQFN Exposed Pad
Quantity
Minimum 1

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In Stock (All prices are in USD)
  • QTY Target Price Total Price
  • 1 6.8437 6.8437
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CDCM1804RGET Technical Specifications

Category Clock/Timing, Clock Buffers, Drivers

Manufacturer Texas Instruments

Packaging Cut Tape (CT) & Digi-Reel®

Series -

Product Status Active

Type Fanout Buffer (Distribution), Divider, Multiplexer

Number of Circuits 1

Ratio - Input:Output 1:3

Differential - Input:Output Yes/Yes

Input CML, HSTL, LVDS, LVPECL, LVTTL, SSTL-2, VML

Output LVCMOS, LVPECL

Frequency - Max 800 MHz

Voltage - Supply 3V ~ 3.6V

Operating Temperature -40°C ~ 85°C

Mounting Type Surface Mount

Package / Case 24-VFQFN Exposed Pad

Supplier Device Package 24-VQFN (4x4)

Base Product Number CDCM1804

Datasheet & Documents

HTML Datasheet

CDCM1804RGET-DG

Environmental & Export Classification

RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 2 (1 Year)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.39.0001

Additional Information

Other Names
TEXTISCDCM1804RGET
296-18094-2
296-18094-1
2156-CDCM1804RGET
296-18094-1-NDR
-SN0305042RTHT-NDR
296-18094-6
-CDCM1804RGETG4-NDR
-296-18094-1-DG
-296-18094-1-NDR
-SN0305042RTHT
296-18094-2-NDR
-CDCM1804RGETG4
-296-18094-1
-CDCM1804RGET-NDR
Standard Package
250

Alternative Parts

PART NUMBER
MANUFACTURER
QUANTITY AVAILABLE
DiGi PART NUMBER
UNIT PRICE
SUBSTITUTE TYPE
CDCM1804RTHT
Texas Instruments
3124
CDCM1804RTHT-DG
0.0684
Parametric Equivalent
CDCM1804RTHR
Texas Instruments
1472
CDCM1804RTHR-DG
0.0684
Parametric Equivalent
CDCM1804RGETG4
Texas Instruments
2090
CDCM1804RGETG4-DG
0.0684
MFR Recommended
CDCM1804RGER
Texas Instruments
2481
CDCM1804RGER-DG
0.0684
Parametric Equivalent

Reviews

5.0/5.0-(Show up to 5 Ratings)
반***별
de desembre 02, 2025
5.0
디지 일렉트로닉스의 물류 시스템이 정말 체계적이고 믿음이 갑니다.
하***자
de desembre 02, 2025
5.0
저렴한 가격에 양질의 서비스를 제공해주셔서 감사하게 생각합니다.
Papi***nDore
de desembre 02, 2025
5.0
Je peux toujours compter sur leur rapidité d'expédition et leur soutien après-vente.
み***ゃん
de desembre 02, 2025
5.0
素早い配送と明確な価格設定が、お客様の信頼を得る要因です。
Bl***ave
de desembre 02, 2025
5.0
Their packaging quality is consistently top-notch, which reflects their attention to detail.
Pix***aven
de desembre 02, 2025
5.0
Excellent customer support that truly cares and a shipping process that’s quick.
Star***ight
de desembre 02, 2025
5.0
I am satisfied with their prompt responses and the high quality of their offerings.
Qui***torm
de desembre 02, 2025
5.0
Affordable and environment-friendly—supporting DiGi Electronics is a no-brainer.
Char***aser
de desembre 02, 2025
5.0
Responsive and helpful, their support team makes the entire experience smooth.
Sweet***enity
de desembre 02, 2025
5.0
Fast delivery times and supportive post-sales service make my experience enjoyable.
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Frequently Asked Questions (FAQ)

What are the key design-in risks when using the CDCM1804RGET in a mixed-signal PCB with high-speed ADCs and FPGAs?

When integrating the CDCM1804RGET in mixed-signal systems, a major risk is clock jitter accumulation due to power supply noise coupling into the sensitive clock distribution path. Since the CDCM1804RGET operates up to 800 MHz and supports LVPECL outputs, ensure a clean 3.3V supply with dedicated LDO regulation and proper grounding of the exposed pad to minimize jitter. Use separate ground planes for analog and digital sections, and route clock traces with controlled impedance and minimal stubs. Also, avoid sharing supply lines with switching regulators. The CDCM1804RGET's wide input compatibility (LVDS, HSTL, etc.) allows flexible sourcing, but always match termination schemes to the selected input standard to prevent reflections.

Can the CDCM1804RGET replace the CDCM1803RGER in a 1:3 LVPECL clock tree design, and what layout adjustments are needed?

Yes, the CDCM1804RGET can replace the CDCM1803RGER in a 1:3 LVPECL configuration, but with careful attention to output drive differences. The CDCM1804RGET supports both LVCMOS and LVPECL outputs, whereas the CDCM1803 is optimized for LVPECL-only. When replacing, verify output loading: LVCMOS outputs on the CDCM1804RGET may introduce higher skew if driving long PCB traces intended for LVPECL. To mitigate, use series termination and check propagation delay matching across outputs. Update your layout to accommodate the 24-VQFN (4x4) footprint alignment and ensure consistent trace lengths (<50 mils mismatch) to maintain skew performance. Also, confirm supply decoupling (0.1 µF + 1 µF) near VCC pins.

How does input signal integrity affect CDCM1804RGET jitter performance when using LVDS versus LVPECL clocks?

The CDCM1804RGET's jitter performance is highly dependent on input signal quality. LVPECL provides better noise margin and faster edge rates than LVDS at 800 MHz, but requires proper AC-coupling and 50Ω termination to VTT (typically VCC - 2V). LVDS inputs are less susceptible to ground shifts but more vulnerable to EMI on long traces. To minimize additive jitter from the CDCM1804RGET, maintain input rise/fall times under 100 ps and ensure input signals meet the required voltage swing specs (±350mV differential for LVDS, 600–1000mV for LVPECL). Use matched-length differential pairs and avoid sharp bends in routing. Poor input integrity can degrade the CDCM1804RGET’s output phase noise by up to 20%.

What are the thermal and reliability concerns when deploying the CDCM1804RGET in a densely populated 4-layer board at 85°C ambient?

At 85°C ambient temperature, thermal management is critical for the CDCM1804RGET in high-density layouts. The 24-VQFN (4x4) package has an exposed thermal pad that must be soldered to a solid copper ground plane using a thermal via array (6–9 via arrangement, 0.3mm drills) for efficient heat dissipation. Without proper thermal relief, junction temperature may exceed 125°C, risking long-term reliability and increased jitter. Also, the MSL 2 rating requires the CDCM1804RGET to be reflow-soldered within 1 year of dry pack opening or subjected to baking per J-STD-033. Avoid placing the CDCM1804RGET near high-power components and verify thermal performance with infrared testing during prototype.

Is the CDCM1804RGET a suitable pin-compatible upgrade from the Si53302-B-GMR in a high-frequency clock buffer application?

The CDCM1804RGET is not pin-compatible with the Silabs Si53302-B-GMR due to different package configurations (24-VQFN vs. 24-QFN) and power pin arrangements, but it can serve as a functional equivalent in 1:3 fanout applications up to 800 MHz. The CDCM1804RGET offers broader input flexibility (CML, HSTL, LVDS, etc.) compared to the Si53302’s fixed LVPECL input, allowing more integration options. However, unlike the Si53302, the CDCM1804RGET lacks integrated PLLs, so it cannot regenerate or clean jitter on the input clock. Use the CDCM1804RGET only when sourcing a low-jitter reference and update both footprint and power sequencing logic during replacement. Validate output skew and signal integrity on the redesigned board.

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