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CDCE62005RGZR
Texas Instruments
IC CLOCK GENERATOR 48VQFN
17572 Pcs New Original In Stock
Clock Generator IC 1.5GHz 1 48-VFQFN Exposed Pad
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Minimum 1
5.0 / 5.0
- (161 Ratings)
CDCE62005RGZR
Product Overview
1231972
DiGi Electronics Part Number
CDCE62005RGZR-DGManufacturer
Texas Instruments
CDCE62005RGZR
Description
IC CLOCK GENERATOR 48VQFNInventory
17572 Pcs New Original In Stock
Clock Generator IC 1.5GHz 1 48-VFQFN Exposed Pad
Quantity
Minimum 1
Minimum 1
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CDCE62005RGZR Technical Specifications
Category
Clock/Timing, Clock Generators, PLLs, Frequency Synthesizers
Packaging
Cut Tape (CT) & Digi-Reel®
Series
-
Product Status
Active
DiGi-Electronics Programmable
Not Verified
Type
Clock Generator
PLL
Yes with Bypass
Input
LVCMOS, LVDS, LVPECL, Crystal
Output
LVCMOS, LVDS, LVPECL
Number of Circuits
1
Ratio - Input:Output
3:5
Differential - Input:Output
Yes/Yes
Frequency - Max
1.5GHz
Divider/Multiplier
Yes/No
Voltage - Supply
3V ~ 3.6V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
48-VFQFN Exposed Pad
Supplier Device Package
48-VQFN (7x7)
Base Product Number
CDCE62005
Datasheet & Documents
Manufacturer Product Page
CDCE62005RGZR Specifications
HTML Datasheet
CDCE62005RGZR-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8542.39.0001
Additional Information
Other Names
296-38907-1
296-38907-2
296-38907-6
TEXTISCDCE62005RGZR
CDCE62005RGZR-DG
2156-CDCE62005RGZR
Standard Package
2,500
Reviews
5.0/5.0-(Show up to 5 Ratings)
de desembre 02, 2025
每次有需要，他們的售後團隊都能給出令人滿意的解決方案。
de desembre 02, 2025
Herrliche Zuverlässigkeit bei DiGi Electronics, dazu günstige Preise – perfekt für jeden Geldbeutel.
de desembre 02, 2025
配達スピードには特に満足しており、今後も利用したいです。
de desembre 02, 2025
DiGi Electronics offers incredible value for money, making quality tech accessible to everyone.
de desembre 02, 2025
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de desembre 02, 2025
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de desembre 02, 2025
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de desembre 02, 2025
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DiGi Electronics makes sure their packaging is up to standard, even for the best prices.
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Frequently Asked Questions (FAQ)
How can I properly manage power supply noise when using the CDCE62005RGZR in a mixed-signal PCB design to avoid jitter degradation?
When integrating the CDCE62005RGZR in mixed-signal systems, power supply noise can significantly impact clock jitter performance due to its sensitive PLL core. To mitigate this, use a dedicated LDO for the 3.3V supply rail (VDD) with ferrite bead isolation between digital and analog sections. Place 10μF bulk and 0.1μF ceramic capacitors as close as possible to each VDD pin, and ensure a low-impedance ground plane. Pay special attention to the exposed pad (EP) – it must be soldered to a solid ground plane to maximize thermal and electrical performance. Avoid routing high-speed signals under the device to prevent coupling into the clock paths, which could degrade signal integrity beyond acceptable limits in high-speed timing applications.
Is the CDCE62005RGZR a suitable drop-in replacement for the IDT 5P49V60 for generating multi-frequency clock trees in telecom equipment?
While the CDCE62005RGZR and IDT 5P49V60 both serve as clock generators with differential I/O support, they are not direct drop-in replacements due to architectural differences. The CDCE62005RGZR offers a 3:5 input-to-output ratio with flexible PLL bypass but lacks the multi-PLL architecture of the 5P49V60, limiting independent output channel programming. You’ll need to re-map clock inputs and validate output frequency combinations through CDCE62005RGZR’s register configuration, especially if replacing legacy designs relying on dual PLLs. Use TI’s Clock Architect tool to verify feasibility of required frequency plans before redesign. Manual register programming is required—be sure to preserve correct I²C timing to avoid lock-up issues in field deployment.
What precautions should I take when routing differential clock outputs from the CDCE62005RGZR to FPGA reference inputs to maintain signal integrity at 1.2GHz?
At frequencies up to 1.2GHz, routing outputs from the CDCE62005RGZR to FPGAs requires controlled impedance differential pairs (typically 100Ω) with tight length matching (<50 mils) to minimize skew-induced timing errors. Use continuous reference planes, avoid vias where possible, and if necessary, place stitching capacitors near transition points. Terminate LVDS or LVPECL outputs according to the FPGA’s input requirements—usually AC-coupled with proper biasing. Keep traces short and avoid sharp bends; 90-degree corners should be replaced with curved or 45-degree mitered routes. Simulate your stackup-dependent trace dimensions using SI tools to confirm integrity, as poor routing can cause jitter accumulation or failed FPGA lock in high-speed serial links.
Can I use a crystal input with the CDCE62005RGZR instead of an external LVDS reference, and what are the stability risks in industrial temperature applications?
Yes, the CDCE62005RGZR supports direct crystal connection across its XIN/XOUT pins, but stability over the full industrial range (-40°C to 85°C) depends on crystal selection and PCB layout. Use a fundamental-mode AT-cut crystal with load capacitance matching the CDCE62005RGZR’s internal capacitors (typically 10–18pF). Ensure PCB stray capacitance is minimized (<3pF) through compact layout and guard rings. For improved reliability, prefer low-ESR crystals (<60Ω) with tight frequency tolerance (±10ppm). Note that crystals are more susceptible to mechanical stress and aging than LVDS references, so if timing holdover or long-term accuracy is critical, consider using a buffered external reference instead. Validate startup time and phase noise under temperature cycling during qualification.
What are the key thermal and reliability concerns when operating the CDCE62005RGZR at maximum 1.5GHz output frequency in a densely packed 7x7mm QFN package?
Operating the CDCE62005RGZR at 1.5GHz increases dynamic power dissipation, creating localized heating in the 7x7mm VQFN package. Without adequate thermal design, junction temperatures can exceed safe limits even within the -40°C to 85°C ambient range. To ensure reliability, solder the exposed pad to a large internal or external copper area using multiple thermal vias (e.g., 3x3 array). Avoid placing adjacent heat-generating components nearby. Also, operating near max frequency reduces margin for process and voltage variations—derate by 10–15% for high-reliability designs. Monitor lifetime MTBF using TI’s reliability calculator and consider conformal coating or potting in high-humidity environments (MSL3 rating means board assembly must occur within 168 hours of dry pack opening unless rebaked).
Quality Assurance (QC)
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CDCE62005RGZR CAD Models
Texas Instruments CDCE62005RGZR PCB symbols & footprints
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