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CD74ACT540M96
Texas Instruments
IC BUFF INVERT 5.5V 20SOIC
1574 Pcs New Original In Stock
Buffer, Inverting 1 Element 8 Bit per Element 3-State Output 20-SOIC
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5.0 / 5.0
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CD74ACT540M96
Product Overview
1229741
DiGi Electronics Part Number
CD74ACT540M96-DGManufacturer
Texas Instruments
CD74ACT540M96
Description
IC BUFF INVERT 5.5V 20SOICInventory
1574 Pcs New Original In Stock
Buffer, Inverting 1 Element 8 Bit per Element 3-State Output 20-SOIC
Quantity
Minimum 1
Minimum 1
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CD74ACT540M96 Technical Specifications
Category
Logic, Buffers, Drivers, Receivers, Transceivers
Packaging
Cut Tape (CT) & Digi-Reel®
Series
74ACT
Product Status
Active
Logic Type
Buffer, Inverting
Number of Elements
1
Number of Bits per Element
8
Input Type
-
Output Type
3-State
Current - Output High, Low
24mA, 24mA
Voltage - Supply
4.5V ~ 5.5V
Operating Temperature
-55°C ~ 125°C (TA)
Mounting Type
Surface Mount
Package / Case
20-SOIC (0.295", 7.50mm Width)
Supplier Device Package
20-SOIC
Base Product Number
74ACT540
Datasheet & Documents
HTML Datasheet
CD74ACT540M96-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8542.39.0001
Additional Information
Other Names
296-31555-1
296-31555-2
CD74ACT540M96-DG
296-31555-6
CD74ACT540M96E4-DG
CD74ACT540M96E4
Standard Package
2,000
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Reviews
5.0/5.0-(Show up to 5 Ratings)
de desembre 02, 2025
The customer service team’s friendliness and professionalism are truly commendable.
de desembre 02, 2025
DiGi's pricing model is straightforward, and their support staff is extremely helpful.
de desembre 02, 2025
Their transparent pricing model and secure packaging reflect their professionalism and customer focus.
de desembre 02, 2025
The professionalism shown by DiGi Electronics in supporting customers is remarkable.
de desembre 02, 2025
Their pricing is quite competitive, and the eco-friendly packaging adds an extra layer of satisfaction.
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Frequently Asked Questions (FAQ)
Can the CD74ACT540M96 be safely used as a drop-in replacement for the MC74ACT540DWR2G in a 5V TTL-level interface design, and what are the key reliability risks to evaluate before making the swap?
Yes, the CD74ACT540M96 can generally serve as a drop-in replacement for the MC74ACT540DWR2G due to nearly identical electrical characteristics, pinout, and 3-state output behavior. However, critical reliability risks include verifying propagation delay matching under your actual load conditions (fan-out and capacitive loading), confirming output drive strength compatibility with downstream CMOS/TTL inputs, and ensuring both parts meet the same ESD protection levels. Always validate timing margins in your specific PCB layout, as subtle differences in internal buffering or package parasitics may affect signal integrity at higher frequencies or in long-trace applications.
What design constraints should I consider when using the CD74ACT540M96 to drive multiple CMOS inputs in a noisy industrial environment operating near its -55°C lower temperature limit?
When deploying the CD74ACT540M96 in industrial settings near -55°C, ensure adequate decoupling (100nF ceramic capacitor within 5mm of VCC/GND pins) to mitigate supply noise, which becomes more impactful at low temperatures due to reduced transistor gain. The 24mA output current capability remains stable across temperature, but trace resistance increases slightly—account for IR drop over long PCB runs. Avoid floating enable inputs; tie OE (output enable) to a defined logic level via pull-up/down to prevent unintended 3-state activation. Also, confirm that input rise/fall times from sensors or controllers meet the 74ACT family’s minimum slew rate requirements to avoid metastability or excessive power dissipation.
How does the CD74ACT540M96 compare to the original 74LS540 in terms of power consumption and noise margin when upgrading an older 5V system, and what integration pitfalls should I avoid?
Replacing a 74LS540 with the CD74ACT540M96 reduces static power consumption significantly (typ. <1µA vs. ~8mA for LS-TTL) and improves noise immunity due to ACT-family’s CMOS-level inputs with TTL-compatible thresholds. However, the CD74ACT540M96 has much faster edge rates, which can exacerbate ringing or crosstalk on unterminated lines—add series termination resistors (22–100Ω) near the driver if traces exceed 15cm. Also, ensure your system’s input devices can tolerate the sharper transitions; some legacy TTL inputs may require Schmitt-trigger buffering. Never assume identical timing—recheck setup/hold times for downstream logic, as ACT propagation delays are typically half that of LS-TTL.
Is the CD74ACT540M96 suitable for bidirectional data bus isolation in a mixed-voltage system where the output side operates at 3.3V while the input side is at 5V, and what protection measures are necessary?
The CD74ACT540M96 is not inherently level-shifting and cannot safely interface 5V inputs directly to 3.3V logic without risk of damaging the downstream 3.3V device. While its inputs are 5V-tolerant per the datasheet, the outputs will swing rail-to-rail at 5V (VOH ≈ 5V), exceeding the absolute maximum input voltage of most 3.3V CMOS ICs. To use it in this scenario, insert a dedicated level translator (e.g., TXB0108) between the CD74ACT540M96 output and the 3.3V domain, or consider a true bidirectional buffer with integrated level shifting. Alternatively, power the CD74ACT540M96 from 3.3V if your input signals are valid CMOS levels at that voltage—but note its VIH(min) rises slightly at 3.3V, potentially causing logic errors with marginal 5V→3.3V divided signals.
Given the CD74ACT540M96’s MSL-1 rating and unlimited floor life, what handling and storage practices are still recommended during high-volume PCB assembly to prevent latent failures?
Although the CD74ACT540M96 carries an MSL-1 (moisture sensitivity level 1) rating indicating unlimited ambient shelf life and no baking requirement, best practices still apply: store in anti-static shielding bags with desiccant when not in use, and limit exposure to high-humidity environments (>60% RH) during prolonged rework or prototyping. During reflow, adhere strictly to the recommended profile (peak temp ≤260°C, time above liquidus <30s) to avoid thermal stress on the 20-SOIC package. Even with robust packaging, avoid repeated solder cycles—each thermal excursion accelerates intermetallic growth at wire bonds, potentially leading to early parametric drift in high-reliability applications. Always verify output drive symmetry (IOH/IOL) post-assembly if used in precision timing paths.
Quality Assurance (QC)
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CD74ACT540M96 CAD Models
Texas Instruments CD74ACT540M96 PCB symbols & footprints
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