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CC430F5137IRGZT
Texas Instruments
IC RF TXRX+MCU ISM<1GHZ 48VFQFN
1396 Pcs New Original In Stock
IC RF TxRx + MCU General ISM < 1GHz 300MHz ~ 348MHz, 389MHz ~ 464MHz, 779MHz ~ 928MHz 48-VFQFN Exposed Pad
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5.0 / 5.0
- (304 Ratings)
CC430F5137IRGZT
Product Overview
1440515
DiGi Electronics Part Number
CC430F5137IRGZT-DGManufacturer
Texas Instruments
CC430F5137IRGZT
Description
IC RF TXRX+MCU ISM<1GHZ 48VFQFNInventory
1396 Pcs New Original In Stock
IC RF TxRx + MCU General ISM < 1GHz 300MHz ~ 348MHz, 389MHz ~ 464MHz, 779MHz ~ 928MHz 48-VFQFN Exposed Pad
Quantity
Minimum 1
Minimum 1
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CC430F5137IRGZT Technical Specifications
Category
RF Transceiver ICs
Packaging
Cut Tape (CT) & Digi-Reel®
Series
-
Product Status
Active
DiGi-Electronics Programmable
Not Verified
Type
TxRx + MCU
RF Family/Standard
General ISM < 1GHz
Protocol
-
Modulation
2FSK, 2GFSK, ASK, MSK, OOK
Frequency
300MHz ~ 348MHz, 389MHz ~ 464MHz, 779MHz ~ 928MHz
Data Rate (Max)
500kBaud
Power - Output
13dBm
Sensitivity
-117dBm
Memory Size
32kB Flash, 4kB SRAM
Serial Interfaces
I2C, IrDA, JTAG, SPI, UART
GPIO
30
Voltage - Supply
2V ~ 3.6V
Current - Receiving
15mA ~ 18.5mA
Current - Transmitting
15mA ~ 36mA
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
48-VFQFN Exposed Pad
Supplier Device Package
48-VQFN (7x7)
Base Product Number
CC430F5137
Datasheet & Documents
Manufacturer Product Page
CC430F5137IRGZT Specifications
HTML Datasheet
CC430F5137IRGZT-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
REACH Status
REACH Unaffected
ECCN
5A992C
HTSUS
8542.31.0001
Additional Information
Other Names
296-38903-6
296-38903-1
296-38903-2
CC430F5137IRGZT-DG
Standard Package
250
Reviews
5.0/5.0-(Show up to 5 Ratings)
de desembre 02, 2025
가격도 좋고 담당자분들도 친절해서 계속 이용할 계획이에요.
de desembre 02, 2025
Their support portal features helpful FAQs and live chat options that resolve problems fast.
de desembre 02, 2025
Reliable delivery schedules and durable packaging make collaboration smooth.
de desembre 02, 2025
We trust DiGi Electronics for their reliable delivery and top-notch product standards.
de desembre 02, 2025
Every interaction with DiGi Electronics' staff feels warm and genuine.
de desembre 02, 2025
Excellent after-sales care that promptly handles warranties and repairs without hassle.
de desembre 02, 2025
I appreciate that their pricing is clear from the start, no unwanted surprises.
de desembre 02, 2025
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de desembre 02, 2025
I had a concern after my order, and their support team responded within hours with a helpful solution.
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Frequently Asked Questions (FAQ)
What are the key design risks when integrating the CC430F5137IRGZT into a battery-powered IoT sensor node, and how can I mitigate current consumption during long idle periods?
The CC430F5137IRGZT’s lowest power mode (LPM3.5) draws ~0.5 µA, but improper GPIO configuration or unterminated RF inputs can cause microamp-level leakage that drastically reduces battery life. Ensure all unused GPIOs are configured as outputs driven low or inputs with pull-ups/downs enabled. Use the internal 32 kHz crystal for RTC wake-up instead of polling, and disable the RF front-end via software when not transmitting. Also, verify that the DC-DC converter (if used) supports ultra-low quiescent current in bypass mode to avoid undermining the MCU’s low-power advantages.
Can I replace the CC430F5137IRGZT with a CC1310 or CC1350 in an existing 868 MHz sub-1GHz design without major hardware changes?
While the CC1310 and CC1350 offer improved RF performance and lower power, direct replacement of the CC430F5137IRGZT is not drop-in compatible due to different pinouts, package sizes (CC13xx uses 7x7 QFN but with different pad layouts), and voltage domains. The CC430F5137IRGZT operates at 2–3.6V with integrated MSP430 core, whereas CC13xx parts use a Cortex-M3/M4 and require recompilation of firmware. Additionally, the CC1310 lacks the CC430’s integrated ADC and comparator peripherals, so analog signal conditioning circuits may need redesign. A board respin is typically required for reliable migration.
How should I handle thermal management and PCB layout for the CC430F5137IRGZT’s exposed pad in a high-density RF module operating near 928 MHz?
The 48-VFQFN exposed pad on the CC430F5137IRGZT must be soldered to a grounded thermal plane with multiple via stitches (≥9 vias of 0.3mm diameter) to ensure both electrical grounding and heat dissipation. At 928 MHz, improper grounding increases harmonic radiation and degrades sensitivity. Keep RF traces (antenna matching network to pin 24/25) short, impedance-controlled (50 Ω), and isolated from digital signals. Use a solid ground plane beneath the device and avoid splitting it under the RF section. Failure to follow TI’s reference layout (SLAU527) can result in reduced range or FCC certification failures.
Is the CC430F5137IRGZT suitable for industrial environments with frequent temperature cycling between -30°C and +80°C, and what reliability concerns should I anticipate?
Yes, the CC430F5137IRGZT is rated for -40°C to +85°C, making it suitable for most industrial applications. However, repeated thermal cycling can stress solder joints—especially under the exposed pad—leading to intermittent failures. Use SAC305 solder with proper reflow profiling and consider underfill if the board undergoes mechanical vibration. Also, flash memory retention is guaranteed only within the full temp range; avoid writing to flash during extreme cold starts. For mission-critical systems, implement periodic memory checksums and watchdog-based recovery to mitigate soft errors induced by temperature swings.
What protocol and modulation choices work best with the CC430F5137IRGZT for long-range, low-data-rate applications in the 433 MHz band, and how do they impact link budget?
For maximum range in the 433 MHz ISM band, configure the CC430F5137IRGZT for 2GFSK with a narrow bandwidth (e.g., 12.5 kHz) and low data rate (≤10 kbps). This leverages its -117 dBm sensitivity and 13 dBm output power to achieve a link budget over 130 dB—ideal for urban or obstructed environments. Avoid OOK for critical data due to its poor noise immunity. Use TI’s SmartRF Studio to optimize deviation and filter settings. Note that regulatory limits (e.g., ETSI EN 300 220) cap duty cycle and field strength; ensure your chosen modulation complies to avoid transmission truncation or legal non-compliance.
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CC430F5137IRGZT CAD Models
Texas Instruments CC430F5137IRGZT PCB symbols & footprints
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