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CC430F5135IRGZ
Texas Instruments
IC RF TXRX+MCU ISM<1GHZ 48VFQFN
47653 Pcs New Original In Stock
IC RF TxRx + MCU General ISM < 1GHz 300MHz ~ 348MHz, 389MHz ~ 464MHz, 779MHz ~ 928MHz 48-VFQFN Exposed Pad
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5.0 / 5.0
- (248 Ratings)
CC430F5135IRGZ
Product Overview
1421539
DiGi Electronics Part Number
CC430F5135IRGZ-DGManufacturer
Texas Instruments
CC430F5135IRGZ
Description
IC RF TXRX+MCU ISM<1GHZ 48VFQFNInventory
47653 Pcs New Original In Stock
IC RF TxRx + MCU General ISM < 1GHz 300MHz ~ 348MHz, 389MHz ~ 464MHz, 779MHz ~ 928MHz 48-VFQFN Exposed Pad
Quantity
Minimum 1
Minimum 1
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CC430F5135IRGZ Technical Specifications
Category
RF Transceiver ICs
Packaging
Tube
Series
-
Product Status
Active
DiGi-Electronics Programmable
Not Verified
Type
TxRx + MCU
RF Family/Standard
General ISM < 1GHz
Protocol
-
Modulation
2FSK, 2GFSK, ASK, MSK, OOK
Frequency
300MHz ~ 348MHz, 389MHz ~ 464MHz, 779MHz ~ 928MHz
Data Rate (Max)
500kBaud
Power - Output
13dBm
Sensitivity
-117dBm
Memory Size
16kB Flash, 2kB SRAM
Serial Interfaces
I2C, IrDA, JTAG, SPI, UART
GPIO
30
Voltage - Supply
2V ~ 3.6V
Current - Receiving
15mA ~ 18.5mA
Current - Transmitting
15mA ~ 36mA
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
48-VFQFN Exposed Pad
Supplier Device Package
48-VQFN (7x7)
Base Product Number
CC430F5135
Datasheet & Documents
Manufacturer Product Page
CC430F5135IRGZ Specifications
HTML Datasheet
CC430F5135IRGZ-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
REACH Status
REACH Unaffected
ECCN
5A992C
HTSUS
8542.31.0001
Additional Information
Other Names
-CC430F5135IRGZ-NDR
-296-25329-5-DG
TEXTISCC430F5135IRGZ
296-25329-5
2156-CC430F5135IRGZ
Standard Package
52
Reviews
5.0/5.0-(Show up to 5 Ratings)
de desembre 02, 2025
합리적인 가격과 친절한 고객 서비스가 최고의 강점이에요.
de desembre 02, 2025
They stand behind their products with excellent after-sales service.
de desembre 02, 2025
Support staff provided clear and helpful guidance.
de desembre 02, 2025
Their prices are genuinely competitive, and the quality remains consistently high.
de desembre 02, 2025
The peace of mind from sourcing from DiGi Electronics is unparalleled, thanks to their reliable inventory and support.
de desembre 02, 2025
Received my order promptly, and the after-sales assistance was top-notch whenever I needed guidance.
de desembre 02, 2025
Customer service representatives are always courteous and eager to help.
de desembre 02, 2025
I was impressed with the fast shipping; my order arrived well before the expected delivery date, saving me a lot of waiting time.
de desembre 02, 2025
DiGi Electronics's pricing strategy is truly advantageous for our procurement needs.
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Frequently Asked Questions (FAQ)
What are the key design risks when replacing a CC430F5135IRGZ with a competing sub-1GHz SoC like the Silicon Labs Si1060 in a battery-powered sensor node, and how can I mitigate them?
Replacing the CC430F5135IRGZ with the Si1060 introduces several design risks: first, the Si1060 requires an external MCU, increasing BOM complexity and power consumption compared to the CC430F5135IRGZ’s integrated MSP430 core. Second, the CC430F5135IRGZ supports IrDA and has tighter current matching between Tx/Rx modes (15–36mA), which is critical for predictable battery life. The Si1060’s higher peak transmit current (up to 48mA) may require larger decoupling or a different power architecture. To mitigate, validate sleep-mode current draw under real-world duty cycles and re-evaluate your RF matching network, as impedance tolerances differ. Always re-certify your FCC/CE compliance due to layout and harmonic profile changes.
How does the CC430F5135IRGZ’s exposed pad package affect PCB reliability in high-vibration industrial environments, and what layout practices should I follow?
The CC430F5135IRGZ’s 48-VFQFN exposed pad (7x7 mm) improves thermal performance but demands precise PCB design for mechanical reliability in vibration-prone settings. Poor solder joint formation under the pad can lead to intermittent RF performance or thermal runaway. Use a symmetrical thermal relief pattern with at least 6–8 vias (0.3 mm drill, filled or tented) to anchor the pad to a ground plane, ensuring even heat distribution and strain relief. Follow TI’s recommended land pattern (S-PVQFN-N48) and perform cross-section analysis during prototype validation. Avoid placing high-stress traces near the package edges to prevent pad delamination under cyclic stress.
Can I use the CC430F5135IRGZ in a multi-protocol gateway design that needs to support both legacy OOK remotes and modern 2GFSK sensors without firmware reconfiguration?
The CC430F5135IRGZ supports OOK and 2GFSK modulation natively, but switching between them dynamically requires careful timing management in firmware and may cause packet loss if not handled properly. The radio cannot receive both modulations simultaneously—you must reconfigure the RF front-end registers, which introduces a 1–2 ms latency. For a seamless gateway experience, implement a time-sliced polling scheme or use two CC430F5135IRGZ devices if real-time dual-mode operation is required. Ensure your antenna matching network is broadband enough (e.g., using a pi-network) to maintain efficiency across both modulation types, especially at the edges of the 300–928 MHz range.
What are the hidden integration challenges when migrating from a CC1101 + MSP430FR5969 discrete solution to the integrated CC430F5135IRGZ in a space-constrained wearable design?
While the CC430F5135IRGZ reduces footprint by integrating RF and MCU, it introduces new integration challenges: first, the shared memory (16kB Flash, 2kB SRAM) limits complex protocol stacks or over-the-air update capabilities compared to a dedicated FRAM-based MSP430. Second, the RF performance is sensitive to nearby digital noise—keep high-speed GPIOs and switching regulators >5 mm away and use ground shielding. Third, the exposed pad requires a solid thermal ground plane, which may conflict with flexible PCB stackups in wearables. Perform conducted sensitivity tests (-117dBm spec) with your actual enclosure and battery placement to avoid de-sense from parasitic coupling.
Is the CC430F5135IRGZ suitable for safety-critical agricultural telemetry systems operating at -40°C, and what derating practices should I apply for long-term reliability?
The CC430F5135IRGZ is rated for -40°C to 85°C, making it technically suitable for cold agricultural environments, but long-term reliability requires derating. At -40°C, crystal startup time increases and SRAM retention margins shrink—use a TCXO or validate oscillator stability with your chosen 32.768 kHz crystal across temperature. Reduce maximum data rate from 500 kBaud to 250 kBaud in extreme cold to maintain link margin, as semiconductor mobility drops. Also, apply voltage derating: operate at ≤3.3V (not 3.6V max) to extend oxide lifespan. Monitor MSL-3 handling requirements strictly—popcorning risk increases in humid field deployments after prolonged storage.
Quality Assurance (QC)
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CC430F5135IRGZ CAD Models
Texas Instruments CC430F5135IRGZ PCB symbols & footprints
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