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CC430F5133IRGZR
Texas Instruments
IC RF TXRX+MCU ISM<1GHZ 48VFQFN
7087 Pcs New Original In Stock
IC RF TxRx + MCU General ISM < 1GHz 300MHz ~ 348MHz, 389MHz ~ 464MHz, 779MHz ~ 928MHz 48-VFQFN Exposed Pad
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5.0 / 5.0
- (389 Ratings)
CC430F5133IRGZR
Product Overview
1408968
DiGi Electronics Part Number
CC430F5133IRGZR-DGManufacturer
Texas Instruments
CC430F5133IRGZR
Description
IC RF TXRX+MCU ISM<1GHZ 48VFQFNInventory
7087 Pcs New Original In Stock
IC RF TxRx + MCU General ISM < 1GHz 300MHz ~ 348MHz, 389MHz ~ 464MHz, 779MHz ~ 928MHz 48-VFQFN Exposed Pad
Quantity
Minimum 1
Minimum 1
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CC430F5133IRGZR Technical Specifications
Category
RF Transceiver ICs
Packaging
Cut Tape (CT) & Digi-Reel®
Series
-
Product Status
Active
DiGi-Electronics Programmable
Not Verified
Type
TxRx + MCU
RF Family/Standard
General ISM < 1GHz
Protocol
-
Modulation
2FSK, 2GFSK, ASK, MSK, OOK
Frequency
300MHz ~ 348MHz, 389MHz ~ 464MHz, 779MHz ~ 928MHz
Data Rate (Max)
500kBaud
Power - Output
13dBm
Sensitivity
-117dBm
Memory Size
8kB Flash, 2kB SRAM
Serial Interfaces
I2C, IrDA, JTAG, SPI, UART
GPIO
30
Voltage - Supply
2V ~ 3.6V
Current - Receiving
15mA ~ 18.5mA
Current - Transmitting
15mA ~ 36mA
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
48-VFQFN Exposed Pad
Supplier Device Package
48-VQFN (7x7)
Base Product Number
CC430F5133
Datasheet & Documents
Manufacturer Product Page
CC430F5133IRGZR Specifications
HTML Datasheet
CC430F5133IRGZR-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
REACH Status
REACH Unaffected
ECCN
5A992C
HTSUS
8542.31.0001
Additional Information
Other Names
296-27418-2
-296-27418-1-DG
296-27418-1
-CC430F5133IRGZR-NDR
296-27418-6
Standard Package
2,500
Reviews
5.0/5.0-(Show up to 5 Ratings)
de desembre 02, 2025
전반적인 서비스와 제품 품질이 최고라고 생각합니다.
de desembre 02, 2025
Clear and honest pricing practices at DiGi Electronics are truly appreciated.
de desembre 02, 2025
Their transparent pricing policies build strong customer confidence.
de desembre 02, 2025
The durability of their products makes them reliable for long-term projects.
de desembre 02, 2025
Their affordable prices make upgrading my gadgets stress-free, plus I love their sustainable packaging.
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Frequently Asked Questions (FAQ)
What are the key design risks when integrating the CC430F5133IRGZR into a battery-powered ISM sensor node, and how can I mitigate power consumption spikes during RF transmission?
The CC430F5133IRGZR draws up to 36mA during transmit at 13dBm output, which can cause voltage droop on small batteries or shared power rails if not properly managed. To mitigate this, use a low-ESR decoupling capacitor (≥10µF ceramic) near the VDD pins and consider a dedicated LDO or buck converter for the RF section. Also, leverage the device’s low-power modes (LPM3/LPM4) between transmissions and minimize duty cycling to reduce average current. Avoid relying solely on the internal DC-DC converter under high RF load—external power staging improves stability and extends battery life in remote deployments.
Can I replace the CC430F5133IRGZR with a CC1310 or CC1350 in an existing 433MHz sub-1GHz design without major firmware changes?
While the CC1310 and CC1350 support similar frequency bands (including 433MHz), direct replacement of the CC430F5133IRGZR is not drop-in compatible due to architectural differences. The CC430 uses an MSP430 core with integrated RF, whereas the CC13xx series uses an ARM Cortex-M3/M4 and requires different peripheral drivers, RTOS considerations, and RF stack configuration (e.g., TI’s RF Driver vs. legacy SmartRF). Additionally, GPIO count, memory layout, and interrupt handling differ—expect significant firmware rework. If migrating, validate pin compatibility, re-evaluate antenna matching networks, and retest regulatory compliance, as modulation support (e.g., MSK performance) may vary subtly.
How should I handle thermal and PCB layout challenges with the CC430F5133IRGZR’s 48-VFQFN exposed pad package in a compact industrial enclosure?
The CC430F5133IRGZR’s 7x7mm 48-VQFN package with an exposed thermal pad demands careful PCB design to avoid solder voids and ensure reliable heat dissipation. Use a solid ground plane beneath the pad with multiple thermal vias (≥9 vias of 0.3mm diameter) to transfer heat to inner or bottom layers. Avoid placing high-current traces near the pad to prevent thermal imbalance during reflow. In enclosed industrial environments, ensure adequate airflow or consider a small heatsink if operating near the -40°C to 85°C limit under continuous transmit loads. Poor thermal management can lead to premature failure or RF performance drift due to junction temperature rise.
Is the CC430F5133IRGZR suitable for long-range (>1km) outdoor telemetry applications in the 868MHz band, and what external components are critical to maximize link budget?
The CC430F5133IRGZR can support long-range 868MHz telemetry with its -117dBm sensitivity and 13dBm output, but achieving >1km range requires careful system design. You must add a high-efficiency PA/LNA (e.g., RFX2401C) if higher EIRP is needed, though this increases complexity and power draw. Use a high-gain directional antenna (e.g., Yagi or patch) and ensure impedance matching (50Ω) via a pi-network between the RF pin and antenna. Also, optimize modulation (2GFSK with narrow bandwidth) and data rate (≤100kbps) to improve SNR. Without these, real-world obstructions and multipath fading may reduce effective range significantly—always conduct field testing with your specific enclosure and environment.
What reliability concerns should I consider when using the CC430F5133IRGZR in high-humidity or outdoor environments, given its MSL 3 rating?
With an MSL 3 (168-hour floor life) rating, the CC430F5133IRGZR is susceptible to moisture absorption if exposed to ambient air before reflow, risking popcorning or solder joint degradation in humid conditions. For outdoor or high-humidity applications, bake the devices per J-STD-033 if stored beyond floor life, and ensure conformal coating is applied post-assembly to protect against condensation and corrosion. Additionally, the exposed pad must be fully soldered to prevent moisture ingress through voids—use nitrogen reflow and inspect with X-ray if reliability is critical. Long-term exposure to >85% RH without protection may lead to intermittent RF failures or GPIO leakage, especially near the 2V minimum supply threshold.
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CC430F5133IRGZR CAD Models
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