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CC3100MODR11MAMOBT
Texas Instruments
IC RF TXRX+MCU WIFI 63SMD
22125 Pcs New Original In Stock
IC RF TxRx + MCU WiFi 802.11b/g/n 2.4GHz 63-SMD Module
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5.0 / 5.0
- (43 Ratings)
CC3100MODR11MAMOBT
Product Overview
1421522
DiGi Electronics Part Number
CC3100MODR11MAMOBT-DGManufacturer
Texas Instruments
CC3100MODR11MAMOBT
Description
IC RF TXRX+MCU WIFI 63SMDInventory
22125 Pcs New Original In Stock
IC RF TxRx + MCU WiFi 802.11b/g/n 2.4GHz 63-SMD Module
Quantity
Minimum 1
Minimum 1
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CC3100MODR11MAMOBT Technical Specifications
Category
RF Transceiver ICs
Packaging
Cut Tape (CT) & Digi-Reel®
Series
SimpleLink™
Product Status
Active
DiGi-Electronics Programmable
Not Verified
Type
TxRx + MCU
RF Family/Standard
WiFi
Protocol
802.11b/g/n
Modulation
-
Frequency
2.4GHz
Data Rate (Max)
16Mbps
Power - Output
17dBm
Sensitivity
-95dBm
Memory Size
-
Serial Interfaces
SPI
Voltage - Supply
2.3V ~ 3.6V
Current - Receiving
54mA
Current - Transmitting
223mA
Operating Temperature
-20°C ~ 70°C
Mounting Type
Surface Mount
Package / Case
63-SMD Module
Supplier Device Package
63-QFM (20.5x17.5)
Base Product Number
CC3100
Datasheet & Documents
Manufacturer Product Page
CC3100MODR11MAMOBT Specifications
HTML Datasheet
CC3100MODR11MAMOBT-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
REACH Status
REACH Unaffected
ECCN
5A992C
HTSUS
8473.30.1180
Additional Information
Other Names
296-43563-1
296-43563-2
296-43563-6
CC3100MODR11MAMOBT-DG
Standard Package
250
Reviews
5.0/5.0-(Show up to 5 Ratings)
de desembre 02, 2025
La rapidité de leur réactivité lors de nos demandes urgentes est exceptionnelle.
de desembre 02, 2025
Their logistics system instilled confidence—everything arrived quickly and in pristine condition.
de desembre 02, 2025
With DiGi Electronics, I feel assured that my investment is protected by their reliable support.
de desembre 02, 2025
Their customer service team is efficient, courteous, and solutions-oriented.
de desembre 02, 2025
High standards of quality are evident in every interaction and product I’ve experienced.
de desembre 02, 2025
Their reliability in product performance and price clarity helps me shop confidently.
de desembre 02, 2025
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Frequently Asked Questions (FAQ)
What are the key design-in risks when integrating the CC3100MODR11MAMOBT into a low-power IoT device with strict sleep current requirements?
The CC3100MODR11MAMOBT supports low-power modes, but improper configuration of sleep/wake cycles can lead to excessive average current draw. A common risk is failing to use deep sleep with wake-on-LPRF (Low-Power RF) mode correctly, which may result in current consumption exceeding 100μA in standby. To mitigate this, ensure the host MCU synchronizes SPI access with wake events and disables unnecessary internal peripherals via the SimpleLink SDK APIs. Also verify power rail sequencing—transitioning from active to PM2 sleep mode requires stable 2.3V to 3.6V supply with ≤100ms settling time to avoid brownout resets.
Can the CC3100MODR11MAMOBT reliably replace the ESP8266 in an existing 2.4GHz Wi-Fi design requiring certified module integration?
Replacing the ESP8266 with the CC3100MODR11MAMOBT offers advantages in terms of FCC/IC/CE certification pre-approval and better protocol offloading via its dedicated network processor, but comes with integration trade-offs. Unlike the ESP8266’s integrated MCU, the CC3100MODR11MAMOBT requires an external host processor and uses SPI instead of UART, demanding careful timing setup and DMA handling to avoid throughput bottlenecks. Additionally, the CC3100MODR11MAMOBT has slower max data rate (16Mbps vs. 72Mbps) and lacks built-in GPIOs, so I/O expansion must be managed by the host. Validate UART-to-SPI bridge logic and ensure antenna isolation meets TI’s reference layout to maintain RF performance.
How does the operating temperature limit of -20°C to 70°C on the CC3100MODR11MAMOBT impact deployment in outdoor industrial environments?
The CC3100MODR11MAMOBT is rated for -20°C to 70°C, making it unsuitable for extended operation in extreme outdoor environments where temperatures exceed 70°C (e.g., enclosed cabinets in direct sunlight). Prolonged exposure beyond the spec risks thermal throttling, packet loss, or premature degradation. For such applications, consider active thermal management—like low-quiescent LDO regulators and PCB heat-spreading planes—or upgrade to extended-temp alternatives such as the CC3200MOD (industrial temperature grade). Additionally, derate the output power by 1–2dBm at high temps to maintain link reliability and reduce self-heating.
What are the critical RF layout guidelines to follow when designing the antenna interface for the CC3100MODR11MAMOBT to achieve the rated -95dBm sensitivity?
To achieve the specified -95dBm sensitivity with the CC3100MODR11MAMOBT, strict adherence to RF layout practices is essential. Maintain a 50Ω controlled impedance path from the RF pin to the antenna connector or chip antenna feed. Avoid routing other signals under the module and preserve the ground plane continuity beneath the 63-QFM package. Use 3 or more vias to connect top-layer ground to internal planes near the feedline, and ensure antenna isolation from noisy digital lines (e.g., SPI, power regulators) is ≥2mm. Mismatches or poor grounding can degrade sensitivity by 10–15dB, severely reducing range. Always validate with a VNA and follow TI’s reference design (SLOK226) for trace width, spacing, and keepout zones.
What are the reliability concerns with the CC3100MODR11MAMOBT in high-humidity environments, and how does MSL 3 classification affect manufacturing?
With an MSL 3 (168-hour floor life) rating, the CC3100MODR11MAMOBT must be stored in dry conditions (<30% RH) and reflow assembled within 7 days of exposure to ambient air, or it risks popcorning or delamination during soldering. For high-humidity applications, conformal coating or potting is recommended post-assembly to prevent moisture ingress, as the module’s epoxy-based packaging isn’t fully sealed. Avoid cleaning with water-soluble fluxes unless followed by thorough drying. Additionally, operate within the specified humidity range (≤90% non-condensing); condensation can lead to leakage currents on the RF front-end. Bake the device at 125°C for 4 hours if floor life is exceeded before assembly.
Quality Assurance (QC)
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CC3100MODR11MAMOBT CAD Models
Texas Instruments CC3100MODR11MAMOBT PCB symbols & footprints
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