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CC2652R1FRGZR
Texas Instruments
RF IC'S + MODULES
88166 Pcs New Original In Stock
IC RF TxRx + MCU 802.15.4, Bluetooth Bluetooth v5.2, Thread, Zigbee® 2.4GHz ~ 2.48GHz 48-VFQFN Exposed Pad
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5.0 / 5.0
- (489 Ratings)
CC2652R1FRGZR
Product Overview
1420776
DiGi Electronics Part Number
CC2652R1FRGZR-DGManufacturer
Texas Instruments
CC2652R1FRGZR
Description
RF IC'S + MODULESInventory
88166 Pcs New Original In Stock
IC RF TxRx + MCU 802.15.4, Bluetooth Bluetooth v5.2, Thread, Zigbee® 2.4GHz ~ 2.48GHz 48-VFQFN Exposed Pad
Quantity
Minimum 1
Minimum 1
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CC2652R1FRGZR Technical Specifications
Category
RF Transceiver ICs
Packaging
Cut Tape (CT) & Digi-Reel®
Series
SimpleLink™
Product Status
Active
DiGi-Electronics Programmable
Not Verified
Type
TxRx + MCU
RF Family/Standard
802.15.4, Bluetooth
Protocol
Bluetooth v5.2, Thread, Zigbee®
Modulation
DSSS, O-QPSK
Frequency
2.4GHz ~ 2.48GHz
Data Rate (Max)
2Mbps
Power - Output
5dBm
Sensitivity
-105dBm
Memory Size
352kB Flash, 80kB RAM
Serial Interfaces
ADC, GPIO, I2C, I2S, JTAG, SPI, UART
GPIO
31
Voltage - Supply
1.8V ~ 3.8V
Current - Receiving
6.9mA
Current - Transmitting
7.3mA ~ 9.6mA
Operating Temperature
-40°C ~ 85°C (TA)
Mounting Type
Surface Mount
Package / Case
48-VFQFN Exposed Pad
Supplier Device Package
48-VQFN (7x7)
Base Product Number
CC2652
Datasheet & Documents
Manufacturer Product Page
CC2652R1FRGZR Specifications
HTML Datasheet
CC2652R1FRGZR-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
REACH Status
REACH Unaffected
ECCN
5A992C
HTSUS
8542.31.0001
Additional Information
Other Names
296-53500-1
296-53500-2
296-53500-6
Standard Package
2,500
Reviews
5.0/5.0-(Show up to 5 Ratings)
de desembre 02, 2025
每次的購買經驗都很愉快，產品和服務都超出期待。
de desembre 02, 2025
Affordable prices and quick shipping—DiGi Electronics is my go-to for gadgets.
de desembre 02, 2025
The straightforward pricing and product consistency make shopping with DiGi Electronics a pleasure.
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Frequently Asked Questions (FAQ)
What are the key design risks when replacing the CC2652R1FRGZR with a competing multi-protocol SoC like the Silicon Labs EFR32MG21 in a 2.4 GHz Zigbee and Bluetooth coexistence application?
When considering a replacement of the CC2652R1FRGZR with the Silicon Labs EFR32MG21, critical design risks include differences in RF front-end matching networks, antenna layout sensitivity, and protocol stack certification. The CC2652R1FRGZR uses a highly integrated RF path optimized for low external component count, while the EFR32MG21 may require additional external filtering and impedance matching components, increasing BOM complexity and PCB real estate. Additionally, the timing and priority handling of concurrent Bluetooth and Zigbee operations differ between TI’s and Silicon Labs’ stacks—TI’s Dynamic Multi-Protocol Manager (DMM) offers deterministic time slicing, whereas Silabs relies on RTOS-based scheduling that may introduce latency under high load. Ensure thorough RF validation and protocol interoperability testing before committing to a redesign, especially in dense RF environments.
How should I manage thermal and layout constraints for the CC2652R1FRGZR in a compact, battery-powered sensor node with limited ground plane area?
The CC2652R1FRGZR’s 48-VFQFN exposed pad package requires careful thermal and RF grounding to maintain performance and reliability. In compact designs, avoid splitting the ground plane beneath the device; instead, use a solid, uninterrupted ground pour connected to the exposed pad through multiple vias (≥9 recommended) to ensure low thermal and electrical impedance. Insufficient grounding can lead to increased junction temperature, reduced RF output power stability, and susceptibility to noise. For battery-powered nodes, also consider that poor thermal dissipation may accelerate aging under sustained TX bursts. Use a 4-layer PCB with inner ground and power planes if possible, and keep high-speed digital traces (e.g., SPI, UART) away from the RF section to minimize coupling.
Can the CC2652R1FRGZR reliably support long-range Bluetooth LE connections in outdoor environments, and what firmware or hardware adjustments are needed to mitigate link budget challenges?
While the CC2652R1FRGZR has a sensitivity of -105 dBm and 5 dBm output power, achieving reliable long-range Bluetooth LE (e.g., >100m line-of-sight) requires more than raw link budget. The device supports Bluetooth 5.2 with coded PHY (S=2 and S=8), which significantly improves range but reduces data rate. To maximize reliability, enable the S=8 coding scheme in firmware and ensure your antenna system (including matching network and PCB trace) is optimized for 2.4 GHz with VSWR < 2:1. Additionally, implement adaptive frequency hopping and robust connection parameter tuning (e.g., longer connection intervals with supervision timeouts) to handle intermittent interference. Without these firmware optimizations and proper RF layout, real-world range may fall short of theoretical expectations, especially in multipath or obstructed environments.
What are the reliability implications of operating the CC2652R1FRGZR near its maximum supply voltage (3.8V) in industrial environments with voltage transients?
Operating the CC2652R1FRGZR at or near its 3.8V maximum supply voltage in industrial settings increases the risk of premature failure due to voltage spikes, ESD events, or power supply instability. Although the device is rated for 1.8V to 3.8V, sustained operation at the upper limit—especially with inductive loads or poorly regulated supplies—can stress internal LDOs and I/O protection circuits. TI recommends using a low-dropout regulator (LDO) with tight output tolerance (±2%) and adding transient voltage suppression (TVS) diodes on the VDD line to clamp surges. Furthermore, the MSL 3 rating means the device is sensitive to moisture during assembly; improper handling can lead to popcorning or latent defects that manifest under thermal cycling. Always follow IPC-JEDEC J-STD-033 guidelines for moisture-sensitive components.
Is it safe to use the CC2652R1FRGZR as a drop-in replacement for the older CC2650F128RGZR in an existing Thread-based smart home gateway design, and what firmware changes are required?
The CC2652R1FRGZR is not a direct drop-in replacement for the CC2650F128RGZR due to differences in memory architecture, peripheral mapping, and RF calibration. While both support Thread and 802.15.4, the CC2652R1FRGZR has 352kB Flash and 80kB RAM versus the CC2650’s 128kB/20kB, enabling more complex applications but requiring firmware porting. The GPIO pinout and peripheral assignments (e.g., SPI, I2C) differ, so schematic and PCB layout changes may be necessary. Additionally, the CC2652R1FRGZR uses a newer RF transceiver with updated calibration data stored in factory-programmed memory; you must use TI’s SysConfig tool and update your project to the latest SimpleLink SDK to ensure correct RF performance. Attempting a blind swap without firmware and hardware validation risks unstable network joins, increased packet loss, or certification non-compliance.
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CC2652R1FRGZR CAD Models
Texas Instruments CC2652R1FRGZR PCB symbols & footprints
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