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CC2650F128RGZR
Texas Instruments
IC RF TXRX+MCU 802.15.4 48VQFN
3396 Pcs New Original In Stock
IC RF TxRx + MCU 802.15.4, Bluetooth 6LoWPAN, Bluetooth v5.1, Zigbee® 2.4GHz 48-VFQFN Exposed Pad
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5.0 / 5.0
- (301 Ratings)
CC2650F128RGZR
Product Overview
1236330
DiGi Electronics Part Number
CC2650F128RGZR-DGManufacturer
Texas Instruments
CC2650F128RGZR
Description
IC RF TXRX+MCU 802.15.4 48VQFNInventory
3396 Pcs New Original In Stock
IC RF TxRx + MCU 802.15.4, Bluetooth 6LoWPAN, Bluetooth v5.1, Zigbee® 2.4GHz 48-VFQFN Exposed Pad
CAD Models - PCB Symbols & Footprints
Quantity
Minimum 1
Minimum 1
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CC2650F128RGZR Technical Specifications
Category
RF Transceiver ICs
Packaging
Cut Tape (CT) & Digi-Reel®
Series
SimpleLink™
Product Status
Active
DiGi-Electronics Programmable
Not Verified
Type
TxRx + MCU
RF Family/Standard
802.15.4, Bluetooth
Protocol
6LoWPAN, Bluetooth v5.1, Zigbee®
Modulation
DSSS, O-QPSK, GFSK
Frequency
2.4GHz
Data Rate (Max)
1Mbps
Power - Output
5dBm
Sensitivity
-100dBm
Memory Size
128kB Flash, 28kB SRAM
Serial Interfaces
I2C, I2S, JTAG, SPI, UART
GPIO
31
Voltage - Supply
1.8V ~ 3.8V
Current - Receiving
5.9mA ~ 6.1mA
Current - Transmitting
6.1mA ~ 9.1mA
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
48-VFQFN Exposed Pad
Supplier Device Package
48-VQFN (7x7)
Base Product Number
CC2650
Datasheet & Documents
Manufacturer Product Page
CC2650F128RGZR Specifications
HTML Datasheet
CC2650F128RGZR-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
REACH Status
REACH Unaffected
ECCN
5A992C
HTSUS
8542.31.0001
Additional Information
Other Names
296-44316-2
296-44316-1
CC2650F128RGZR-DG
296-44316-6
Standard Package
2,500
Reviews
5.0/5.0-(Show up to 5 Ratings)
de desembre 02, 2025
購物迪吉電子不僅價格優惠，物流效率也很出色，我非常滿意！
de desembre 02, 2025
DiGi Electronics is a haven for anyone seeking cost-effective solutions and friendly support.
de desembre 02, 2025
They handle international shipments smoothly, with minimal delays and clear communication.
de desembre 02, 2025
Their products do not just ship quickly—they also last long, making them a cost-effective choice in the long run.
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Frequently Asked Questions (FAQ)
What are the key design risks when replacing a CC2650F128RGZR with a competing multi-protocol SoC like the nRF52840 in a battery-powered Zigbee sensor node, and how can I mitigate them?
Replacing the CC2650F128RGZR with Nordic’s nRF52840 introduces several practical risks: first, the nRF52840 operates at a higher peak transmit current (~7.5mA at 0dBm vs. ~6.1–9.1mA for CC2650F128RGZR), which may reduce battery life in duty-cycled applications. Second, while both support Zigbee and Bluetooth 5.1, the CC2650F128RGZR’s integrated DC-DC converter allows efficient operation down to 1.8V, whereas the nRF52840 requires careful LDO or buck converter selection below 2.1V. Third, the CC2650F128RGZR’s exposed pad (48-VQFN 7x7) has stricter PCB thermal and soldering requirements than the nRF52840’s QFN; improper reflow can cause voids affecting RF performance. To mitigate, validate current profiles under real-world duty cycles, ensure your power architecture supports the target voltage range, and follow TI’s recommended land pattern and stencil design for reliable assembly of the CC2650F128RGZR.
Can the CC2650F128RGZR reliably operate in industrial environments at 85°C ambient temperature, and what layout or firmware considerations are critical to avoid RF degradation?
Yes, the CC2650F128RGZR is rated for -40°C to +85°C operation, but sustained use at 85°C demands careful thermal and RF layout practices. At high temperatures, the internal PA efficiency drops slightly, potentially reducing effective output power below the nominal 5dBm. To maintain link budget, ensure adequate copper pour under the exposed thermal pad and avoid placing heat-generating components nearby. Additionally, use a solid ground plane beneath the RF section and follow TI’s reference design for antenna matching—any impedance deviation at elevated temps can increase VSWR and reduce range. Firmware-wise, enable dynamic power control if link quality permits, and monitor supply voltage droop under temperature stress, as the 1.8V minimum supply becomes harder to maintain with regulator drift. Thermal vias under the package are non-negotiable for reliable long-term operation of the CC2650F128RGZR in industrial settings.
How does the CC2650F128RGZR compare to the newer CC2652R7 in terms of real-world coexistence performance when Bluetooth and Zigbee are active simultaneously in a crowded 2.4GHz environment?
While the CC2650F128RGZR supports concurrent protocol awareness via software time-slicing, it lacks hardware-based radio coexistence features found in the CC2652R7 (e.g., dedicated COEX pins for Wi-Fi/BLE prioritization). In dense RF environments—such as smart buildings with overlapping Zigbee, Bluetooth, and Wi-Fi networks—the CC2650F128RGZR may experience higher packet loss during simultaneous TX/RX due to software-managed arbitration delays. The CC2652R7’s improved RF front-end and hardware-assisted scheduling reduce this risk. If you're designing a new system with strict latency or reliability requirements, consider migrating; however, for legacy designs using the CC2650F128RGZR, implement robust channel selection algorithms, minimize concurrent radio activity, and leverage TI’s BLE-Stack and Z-Stack coexistence guidelines to mitigate interference.
What are the hidden integration challenges when using the CC2650F128RGZR’s exposed pad package in a high-volume SMT assembly line, and how can yield be improved?
The 48-VQFN exposed pad on the CC2650F128RGZR requires precise stencil aperture design and reflow profiling to avoid solder voids, which can lead to thermal runaway or intermittent RF connections. Common pitfalls include excessive paste volume causing bridging or insufficient coverage leading to poor thermal transfer. Use a laser-cut stencil with 1:1 aperture ratio, 50–75µm thickness, and circular or homeplate-shaped apertures to reduce voiding. Ensure the PCB has a solid ground plane connected through 9–16 thermal vias (0.3mm diameter) under the pad. During reflow, follow TI’s recommended profile with a peak temperature of 240–250°C and slow ramp rates to minimize outgassing. In-circuit test (ICT) coverage may be limited due to pad accessibility, so incorporate boundary scan (JTAG) and functional RF tests early. These steps significantly improve first-pass yield when manufacturing with the CC2650F128RGZR.
Is it safe to run the CC2650F128RGZR continuously at 3.8V supply voltage in a 24/7 mains-powered IoT gateway, or will long-term reliability be compromised?
Operating the CC2650F128RGZR continuously at its maximum rated supply voltage (3.8V) is electrically permissible per the datasheet, but long-term reliability may degrade due to accelerated electromigration and increased leakage currents, especially near the upper temperature limit (85°C). For always-on applications like IoT gateways, TI recommends derating the supply to 3.3V or lower to extend MTBF. Additionally, running at 3.8V reduces the margin for brownout during transient loads, risking resets if the power supply lacks sufficient headroom. If your design must use 3.8V (e.g., for sensor interfacing), implement a low-dropout regulator with tight line regulation and add bulk decoupling near the VDDS pins. Monitor junction temperature via firmware-calculated models, and consider periodic duty cycling if thermal buildup is observed—this proactive derating strategy enhances field reliability of the CC2650F128RGZR in continuous-operation scenarios.
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CC2650F128RGZR CAD Models
Texas Instruments CC2650F128RGZR PCB symbols & footprints
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